公开(公告)号：KR20180030715A

公开(公告)日：2018-03-23

申请号：KR20187006946

申请日：2016-08-11

Applicant: KLA TENCOR CORP

Inventor： LEE HUCHENG ,  THATTAISUNDARAM GOVINDARAJAN

IPC: G01N23/2255 ,  H01L21/66

CPC classification number: H01J37/222 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/74 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01J2237/24592 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: 웨이퍼의전자빔 이미지에서의결함위치결정을위한방법및 시스템이제공된다. 하나의방법은차이이미지에서의결함의제1 위치에기초하여테스트이미지에서이미지화된패턴들에대한결함의제2 위치를결정하는단계를포함한다. 본방법은또한결함에대한전자빔 이미지내의패턴들에대한결함의제3 위치를결정하는단계와, 제1 위치와제3 위치간의연관성을결정하는단계를포함한다. 또한, 본방법은차이이미지내의다른결함의제1 위치및 결정된연관성에기초하여전자빔 이미지내의다른결함의위치를결정하는단계를포함한다.

Abstract translation: 提供了用于晶片的电子束图像中的缺陷定位的方法和系统。 一种方法包括基于差异图像中缺陷的第一位置确定测试图像中成像图案的缺陷的第二位置。 该方法还包括针对缺陷确定电子束图像中的图案的缺陷的第三位置并确定第一位置与第三位置之间的关联。 该方法还包括基于差异图像中的另一缺陷的第一位置和所确定的关联来确定电子束图像中的另一缺陷的位置。

公开(公告)号：DE112015004721T5

公开(公告)日：2017-07-06

申请号：DE112015004721

申请日：2015-10-13

Applicant: KLA TENCOR CORP

Inventor： LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO ,  LUO QING ,  WU KENONG

IPC: H01L21/66

Abstract: Systeme und Verfahren zur Detektion von Defekten auf einer Probe auf Grundlage von Strukturinformation werden bereitgestellt. Ein System beinhaltet ein oder mehrere Computersubsysteme, die dazu ausgebildet sind, die von einem Detektor eines Inspektionssubsystems in einem Array-Gebiet auf einer Probe erzeugte Ausgabe in zumindest erste und zweite Segmente der Ausgabe zu trennen, auf Grundlage eines Merkmals/von Merkmalen einer Struktur/von Strukturen in dem Array-Gebiet, so dass die Ausgabe in unterschiedlichen Segmenten an unterschiedlichen Positionen in dem Array-Gebiet erzeugt worden ist, in denen die Struktur(en), die unterschiedliche Werte des Merkmals/der Merkmale haben, ausgebildet sind. Das Computersubsystem/die Computersubsysteme sind auch dazu ausgebildet, Defekte auf der Probe zu detektieren, indem sie eine oder mehrere Defektdetektionsmethoden auf die Ausgabe anwenden, abhängig davon, ob sich die Ausgabe in dem ersten Segment oder dem zweiten Segment befindet.

公开(公告)号：SG11201702725WA

公开(公告)日：2017-04-27

申请号：SG11201702725W

申请日：2015-10-13

Applicant: KLA TENCOR CORP

Inventor： LUO QING ,  WU KENONG ,  LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO

IPC: H01L21/66

Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.

公开(公告)号：SG11201903715XA

公开(公告)日：2019-05-30

申请号：SG11201903715X

申请日：2017-11-08

Applicant: KLA TENCOR CORP

Inventor： BRAUER BJORN ,  BHATTACHARYYA SANTOSH ,  SHIFRIN EUGENE ,  LEE HUCHENG ,  MURRAY BENJAMIN ,  MATHEW ASHOK ,  BHASKAR CHETANA ,  GAO LISHENG

IPC: G01N21/95 ,  G01N21/88

Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1#111011110111010101111101 11010011111111011110 HE 10111011111011110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/089459 Al 17 May 2018 (17.05.2018) WIPO I PCT (51) International Patent Classification: Santosh; 5540 Cooney Place, San Jose, California 95123 GO1N 21/95 (2006.01) GO1N 21/88 (2006.01) (US). SHIFRIN, Eugene; 463 Liquidambar Way, Sunny- vale, California 94086 (US). LEE, Hucheng; 1159 Kent- (21) International Application Number: wood Avenue, Cupertino, California 95014 (US). MUR- PCT/US2017/060589 RAY, Benjamin; 17261 NW LaPaloma Lane, Beaver- (22) International Filing Date: ton, California 97006 (US). MATHEW, Ashok; 34782 Si- 08 November 2017 (08.11.2017) ward Drive, Fremont, California 94539 (US). BHASKAR, (25) Filing Language: English Chetana; 1061 Queensbridge Court, San Jose, California 95120 (US). GAO, Lisheng; 21164 Toll Gate Road, Sarato- (26) Publication Language: English ga, California 95070 (US). (30) Priority Data: (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., 62/420,409 10 November 2016 (10.11.2016) US Legal Department, One Technology Drive, Milpitas, Cali- 62/443,810 09 January 2017 (09.01.2017) US fornia 95035 (US). 62/455,948 07 February 2017 (07.02.2017) US (81) Designated States (unless otherwise indicated, for every 15/804,980 06 November 2017 (06.11.2017) US kind of national protection available): AE, AG, AL, AM, (71) Applicant: KLA-TENCOR CORPORATION [US/US]; AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, Legal Department, One Technology Drive, Milpitas, Cali- CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, fornia 95035 (US). DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, (72) Inventors: BRAUER, Bjorn; 16698 NW Tucson Street, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, _ Beaverton, Oregon 97006 (US). BHATTACHARYYA, = = (54) Title: HIGH SENSITIVITY REPEATER DEFECT DETECTION = — = Computer subsystem(s) 300 _ _ = = = — = 28 26 24 20 16 18 2 1 ill. '' •• 34 /-10 I A os % 32 = , No = 14 30 = 22 = = Fig. 1 ,-, .. 11 (57) : Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that CN include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main 7 1. user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the C:N user, and an interface component that provides an interface between the one or more image processing components and the main user °O interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect 0 ---. detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, *1 : and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects 11 c;;;; ) that are repeater defects. N O [Continued on next page] WO 2018/089459 Al MIDEDIMOMOIDEIREEMOOMMEIMOHNOCHINVOIMIE MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))

公开(公告)号：EP2847788A4

公开(公告)日：2016-03-23

申请号：EP13788048

申请日：2013-05-07

Applicant: KLA TENCOR CORP

Inventor： LEE HUCHENG ,  HUANG JUNQING ,  GAO LISHENG

IPC: H01L21/66 ,  G06T7/00 ,  H01L21/00

CPC classification number: G06K9/40 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00