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    DEFEKTDETEKTION UNTER VERWENDUNG VON STRUKTURINFORMATION
    1.
    发明专利
    DEFEKTDETEKTION UNTER VERWENDUNG VON STRUKTURINFORMATION 未知

    公开(公告)号：DE112015004721T5

    公开(公告)日：2017-07-06

    申请号：DE112015004721

    申请日：2015-10-13

    Applicant: KLA TENCOR CORP

    Inventor： LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO ,  LUO QING ,  WU KENONG

    IPC: H01L21/66

    Abstract: Systeme und Verfahren zur Detektion von Defekten auf einer Probe auf Grundlage von Strukturinformation werden bereitgestellt. Ein System beinhaltet ein oder mehrere Computersubsysteme, die dazu ausgebildet sind, die von einem Detektor eines Inspektionssubsystems in einem Array-Gebiet auf einer Probe erzeugte Ausgabe in zumindest erste und zweite Segmente der Ausgabe zu trennen, auf Grundlage eines Merkmals/von Merkmalen einer Struktur/von Strukturen in dem Array-Gebiet, so dass die Ausgabe in unterschiedlichen Segmenten an unterschiedlichen Positionen in dem Array-Gebiet erzeugt worden ist, in denen die Struktur(en), die unterschiedliche Werte des Merkmals/der Merkmale haben, ausgebildet sind. Das Computersubsystem/die Computersubsysteme sind auch dazu ausgebildet, Defekte auf der Probe zu detektieren, indem sie eine oder mehrere Defektdetektionsmethoden auf die Ausgabe anwenden, abhängig davon, ob sich die Ausgabe in dem ersten Segment oder dem zweiten Segment befindet.

    DEFECT DETECTION USING STRUCTURAL INFORMATION
    2.
    发明专利
    DEFECT DETECTION USING STRUCTURAL INFORMATION 未知

    公开(公告)号：SG11201702725WA

    公开(公告)日：2017-04-27

    申请号：SG11201702725W

    申请日：2015-10-13

    Applicant: KLA TENCOR CORP

    Inventor： LUO QING ,  WU KENONG ,  LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO

    IPC: H01L21/66

    Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.

    HIGH SENSITIVITY REPEATER DEFECT DETECTION
    3.
    发明专利
    HIGH SENSITIVITY REPEATER DEFECT DETECTION 未知

    公开(公告)号：SG11201903715XA

    公开(公告)日：2019-05-30

    申请号：SG11201903715X

    申请日：2017-11-08

    Applicant: KLA TENCOR CORP

    Inventor： BRAUER BJORN ,  BHATTACHARYYA SANTOSH ,  SHIFRIN EUGENE ,  LEE HUCHENG ,  MURRAY BENJAMIN ,  MATHEW ASHOK ,  BHASKAR CHETANA ,  GAO LISHENG

    IPC: G01N21/95 ,  G01N21/88

    Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1#111011110111010101111101 11010011111111011110 HE 10111011111011110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/089459 Al 17 May 2018 (17.05.2018) WIPO I PCT (51) International Patent Classification: Santosh; 5540 Cooney Place, San Jose, California 95123 GO1N 21/95 (2006.01) GO1N 21/88 (2006.01) (US). SHIFRIN, Eugene; 463 Liquidambar Way, Sunny- vale, California 94086 (US). LEE, Hucheng; 1159 Kent- (21) International Application Number: wood Avenue, Cupertino, California 95014 (US). MUR- PCT/US2017/060589 RAY, Benjamin; 17261 NW LaPaloma Lane, Beaver- (22) International Filing Date: ton, California 97006 (US). MATHEW, Ashok; 34782 Si- 08 November 2017 (08.11.2017) ward Drive, Fremont, California 94539 (US). BHASKAR, (25) Filing Language: English Chetana; 1061 Queensbridge Court, San Jose, California 95120 (US). GAO, Lisheng; 21164 Toll Gate Road, Sarato- (26) Publication Language: English ga, California 95070 (US). (30) Priority Data: (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., 62/420,409 10 November 2016 (10.11.2016) US Legal Department, One Technology Drive, Milpitas, Cali- 62/443,810 09 January 2017 (09.01.2017) US fornia 95035 (US). 62/455,948 07 February 2017 (07.02.2017) US (81) Designated States (unless otherwise indicated, for every 15/804,980 06 November 2017 (06.11.2017) US kind of national protection available): AE, AG, AL, AM, (71) Applicant: KLA-TENCOR CORPORATION [US/US]; AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, Legal Department, One Technology Drive, Milpitas, Cali- CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, fornia 95035 (US). DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, (72) Inventors: BRAUER, Bjorn; 16698 NW Tucson Street, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, _ Beaverton, Oregon 97006 (US). BHATTACHARYYA, = = (54) Title: HIGH SENSITIVITY REPEATER DEFECT DETECTION = — = Computer subsystem(s) 300 _ _ = = = — = 28 26 24 20 16 18 2 1 ill. '' •• 34 /-10 I A os % 32 = , No = 14 30 = 22 = = Fig. 1 ,-, .. 11 (57) : Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that CN include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main 7 1. user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the C:N user, and an interface component that provides an interface between the one or more image processing components and the main user °O interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect 0 ---. detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, *1 : and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects 11 c;;;; ) that are repeater defects. N O [Continued on next page] WO 2018/089459 Al MIDEDIMOMOIDEIREEMOOMMEIMOHNOCHINVOIMIE MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))

    ALIGNMENT OF INSPECTION TO DESIGN USING BUILT IN TARGETS
    4.
    发明专利
    ALIGNMENT OF INSPECTION TO DESIGN USING BUILT IN TARGETS 未知

    公开(公告)号：SG11201704452VA

    公开(公告)日：2017-07-28

    申请号：SG11201704452V

    申请日：2015-12-30

    Applicant: KLA TENCOR CORP

    Inventor： BHATTACHARYYA SANTOSH ,  BRAEUER BJOERN ,  GAO LISHENG

    IPC: G01R31/307 ,  G01R31/26 ,  G01R31/311 ,  H01L21/68

    Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. One method includes selecting one or more alignment targets from a design for a specimen. At least a portion of the one or more alignment targets include built in targets included in the design for a purpose other than alignment of inspection results to design data space. At least the portion of the one or more alignment targets does not include one or more individual device features. One or more images for the alignment target(s) and output generated by the inspection subsystem at the position(s) of the alignment target(s) may then be used to determine design data space positions of other output generated by the inspection subsystem in a variety of ways described herein.

    COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR SELECTING POLARIZATION SETTINGS FOR AN INSPECTION SYSTEM
    5.
    发明申请
    COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR SELECTING POLARIZATION SETTINGS FOR AN INSPECTION SYSTEM 审中-公开
    计算机实现方法，载体介质和选择用于检查系统的极化设置的系统

    公开(公告)号：WO2009140411A2

    公开(公告)日：2009-11-19

    申请号：PCT/US2009043825

    申请日：2009-05-13

    Applicant: KLA TENCOR CORP ,  WALLINGFORD RICHARD ,  CHEN STEPHANIE ,  KIRKWOOD JASON ,  LUO TAO ,  ZHANG YONG ,  GAO LISHENG

    Inventor： WALLINGFORD RICHARD ,  CHEN STEPHANIE ,  KIRKWOOD JASON ,  LUO TAO ,  ZHANG YONG ,  GAO LISHENG

    IPC: G01N21/88 ,  G01B11/30 ,  G01N21/47

    CPC classification number: G01N21/21 ,  G01N21/9501 ,  G01N2021/8822 ,  G01N2021/8867

    Abstract: Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system for inspection of a layer of a wafer are provided. One method includes detecting a population of defects on the layer of the wafer using results of each of scans of the wafer performed with different combinations of polarization settings of the inspection system for illumination and collection of light scattered from the wafer. The method also includes identifying a subpopulation of the defects for each of the different combinations, each of which includes the defects that are common to at least two of the different combinations, and determining a characteristic of a measure of signal-to-noise for each of the subpopulations. The method further includes selecting the polarization settings for the illumination and the collection to be used for the inspection corresponding to the subpopulation having the best value for the characteristic.

    Abstract translation: 提供了计算机实现的方法，载体介质和用于选择用于检查晶片层的检查系统的偏振设置的系统。 一种方法包括使用用于照射的检查系统的偏振设置的不同组合和从晶片散射的光的收集的晶片的每次扫描的结果来检测晶片层上的缺陷群。 该方法还包括识别每个不同组合的缺陷的子群体，每个组合包括对于至少两个不同组合是共同的缺陷，以及确定每个组合的信噪比度量的特性 的亚群。 该方法还包括选择用于与用于该特征具有最佳值的亚群相对应的检查的照明和收集的偏振设置。

    REGION BASED VIRTUAL FOURIER FILTER
    8.
    发明申请
    REGION BASED VIRTUAL FOURIER FILTER 审中-公开
    基于区域的虚拟傅里叶滤波器

    公开(公告)号：WO2012016243A8

    公开(公告)日：2012-09-27

    申请号：PCT/US2011046154

    申请日：2011-08-01

    Applicant: KLA TENCOR CORP ,  GAO LISHENG ,  WU KENONG ,  PARK ALLEN ,  CHANG ELLIS ,  ZAFAR KHURRAM ,  HUANG JUNQING JENNY ,  GU PING ,  MAHER CHRISTOPHER ,  CHEN GRACE H ,  RONG SONGNIAN ,  WU LIU-MING

    Inventor： GAO LISHENG ,  WU KENONG ,  PARK ALLEN ,  CHANG ELLIS ,  ZAFAR KHURRAM ,  HUANG JUNQING JENNY ,  GU PING ,  MAHER CHRISTOPHER ,  CHEN GRACE H ,  RONG SONGNIAN ,  WU LIU-MING

    IPC: G06T7/60

    CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/20021 ,  G06T2207/20056 ,  G06T2207/30148

    Abstract: The present invention includes searching imagery data in order to identify one or more patterned regions on a semiconductor wafer, generating one or more virtual Fourier filter (VFF) working areas, acquiring an initial set of imagery data from the VFF working areas, defining VFF training blocks within the identified patterned regions of the VFF working areas utilizing the initial set of imagery data, wherein each VFF training block is defined to encompass a portion of the identified patterned region displaying a selected repeating pattern, calculating an initial spectrum for each VFF training block utilizing the initial set of imagery data from the VFF training blocks, and generating a VFF for each training block by identifying frequencies of the initial spectrum having maxima in the frequency domain, wherein the VFF is configured to null the magnitude of the initial spectrum at the frequencies identified to display spectral maxima.

    Abstract translation: 本发明包括搜索图像数据以便识别半导体晶片上的一个或多个图案化区域，生成一个或多个虚拟傅里叶滤波器（VFF）工作区域，从VFF工作区域获取初始图像数据集合，定义VFF训练 使用初始图像数据集合在VFF工作区域的所识别图案化区域内的块，其中每个VFF训练块被定义为涵盖显示选定重复图案的所识别图案化区域的一部分，计算每个VFF训练块的初始光谱 利用来自VFF训练块的初始图像数据集，并且通过识别在频域中具有最大值的初始频谱的频率来为每个训练块生成VFF，其中VFF被配置为使得初始频谱的幅度在 确定频率显示频谱最大值。

    ADAPTIVE SIGNATURE DETECTION
    9.
    发明申请
    ADAPTIVE SIGNATURE DETECTION 审中-公开
    自适应签名检测

    公开(公告)号：WO2010141337A3

    公开(公告)日：2011-02-03

    申请号：PCT/US2010036514

    申请日：2010-05-28

    Applicant: KLA TENCOR CORP ,  GAO YONG ,  HUANG JUNQING ,  GAO LISHENG

    Inventor： GAO YONG ,  HUANG JUNQING ,  GAO LISHENG

    IPC: G01N21/88 ,  G01B11/30 ,  G01R31/02 ,  G06T7/00

    CPC classification number: G01B11/303 ,  G01N21/9501 ,  G01N2021/95638 ,  G06T7/0006 ,  G06T2207/10061 ,  G06T2207/20008 ,  G06T2207/30148

    Abstract: A processor-based method for detecting defects in an integrated circuit, by creating an image of at least a portion of the integrated circuit with a sensor, grouping pixels of the image into bins based at least in part on a common characteristic of the pixels that are grouped within a given bin, creating a histogram of the pixels in each of the bins, calculating a mean value of the histogram for each of the bins, comparing the mean value for each of the bins to a threshold value, flagging as defect candidates those bins where the mean value of the bin varies from the threshold value by more than a predetermined amount, and performing signature detection on the bins that are flagged as defect candidates, where the image of the integrated circuit is not directly compared to any other image of an integrated circuit.

    Abstract translation: 一种基于处理器的方法，用于通过利用传感器创建集成电路的至少一部分的图像来检测集成电路中的缺陷，至少部分地基于像素的共同特征将图像的像素分组为存储体 分组在给定的仓内，创建每个仓中的像素的直方图，计算每个仓的直方图的平均值，将每个仓的平均值与阈值进行比较，标记为缺陷候选 这些箱子的平均值从阈值变化超过预定量，并且对标记为缺陷候选的箱进行签名检测，其中集成电路的图像不直接与任何其他图像进行比较 的集成电路。

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