公开(公告)号：JP2003149159A

公开(公告)日：2003-05-21

申请号：JP2002201635

申请日：2002-07-10

Applicant: KLA TENCOR TECH CORP

Inventor： VAEZ-IRAVANI MEHDI ,  STOKOWSKI STAN ,  BIELLAK STEPHEN ,  SULLIVAN JAMIE ,  WELLS KEITH ,  NIKOONAHAD MEHRDAD

IPC: G01N21/84 ,  G01N21/47 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  H01L21/027 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a system and method for inspecting the surface of a specimen such as a semiconductor wafer. SOLUTION: The system contains a lighting system wherein a 1st light beam is directed at the specimen surface at a slant angle of incidence and a 2nd light beam is directed at the same with a virtually vertical angle of incidence, a collecting system for collecting at east a part of the beams reflected from the specimen surface, and a detection system wherein the collected part of the reflected beams are processed. Defects if any in presence on the specimen are detected in the collected part of the 1st and 2nd beams.

公开(公告)号：WO2006094115A3

公开(公告)日：2007-03-22

申请号：PCT/US2006007405

申请日：2006-03-01

Applicant: KLA TENCOR TECH CORP ,  BIELLAK STEPHEN ,  SHORT DAVID

Inventor： BIELLAK STEPHEN ,  SHORT DAVID

IPC: G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/474 ,  G01N21/8806

Abstract: A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.

Abstract translation: 公开了一种用于检查的系统和方法。 该设计包括将光轴上的照射光束照射到表面上的照射细长光斑阵列的倾斜角度，沿着线性轴进行线性扫描，其中线性轴线偏离 通过非实质角度量的光轴，并且将来自斑点的散射辐射成像到接收器阵列上，使得阵列中的每个接收器接收来自点阵列中的对应点的散射辐射。

公开(公告)号：WO2007044320A2

公开(公告)日：2007-04-19

申请号：PCT/US2006038568

申请日：2006-09-29

Applicant: KLA TENCOR TECH CORP ,  SHORTT DAVID ,  BIELLAK STEPHEN ,  BELYAEV ALEXANDER

Inventor： SHORTT DAVID ,  BIELLAK STEPHEN ,  BELYAEV ALEXANDER

IPC: G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N2021/4711 ,  G01N2021/8854

Abstract: Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.

Abstract translation: 提供了用于检查晶片的方法和系统。 一种方法包括用透射入晶片的第一波长的光照射晶片，以及用基本上不穿透晶片的第二晶片照射光。 该方法还包括响应来自照明步骤的来自晶片的光而产生输出信号。 此外，该方法包括使用输出信号检测晶片上的缺陷。 该方法进一步包括使用输出信号确定缺陷是否是表面缺陷或表面缺陷。

公开(公告)号：EP1859257A4

公开(公告)日：2012-05-30

申请号：EP06736684

申请日：2006-03-01

Applicant: KLA TENCOR TECH CORP

Inventor： BIELLAK STEPHEN ,  SHORT DAVID

IPC: G01N21/88 ,  G01N21/47 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/474 ,  G01N21/8806