公开(公告)号：JP2003149159A

公开(公告)日：2003-05-21

申请号：JP2002201635

申请日：2002-07-10

Applicant: KLA TENCOR TECH CORP

Inventor： VAEZ-IRAVANI MEHDI ,  STOKOWSKI STAN ,  BIELLAK STEPHEN ,  SULLIVAN JAMIE ,  WELLS KEITH ,  NIKOONAHAD MEHRDAD

IPC: G01N21/84 ,  G01N21/47 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  H01L21/027 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a system and method for inspecting the surface of a specimen such as a semiconductor wafer. SOLUTION: The system contains a lighting system wherein a 1st light beam is directed at the specimen surface at a slant angle of incidence and a 2nd light beam is directed at the same with a virtually vertical angle of incidence, a collecting system for collecting at east a part of the beams reflected from the specimen surface, and a detection system wherein the collected part of the reflected beams are processed. Defects if any in presence on the specimen are detected in the collected part of the 1st and 2nd beams.

公开(公告)号：WO2006041944A2

公开(公告)日：2006-04-20

申请号：PCT/US2005035867

申请日：2005-10-04

Applicant: KLA TENCOR TECH CORP ,  MILLER LAWRENCE ROBERT ,  VAEZ-IRAVANI MEHDI

Inventor： MILLER LAWRENCE ROBERT ,  VAEZ-IRAVANI MEHDI

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8822

Abstract: Pixel intensities indicative of scattered radiation from portions of the inspected surface surrounding a location of a potential anomaly are also stored so that such data is available for quick review of the pixel intensities within a patch on the surface containing the location of the potential anomaly. Where rotational motion is caused between the illumination beam and the inspected surface, signal-to-noise ratio may be improved by comparing the pixel intensities of pixels at corresponding positions on two different surfaces that are inspected, where corresponding pixels at the same relative locations on the two different surfaces are illuminated and scattered radiation therefrom collected and detected under the same optical conditions.

Abstract translation: 还存储指示来自围绕潜在异常的位置的检查表面的部分的散射辐射的像素强度，使得这样的数据可用于快速查看包含潜在异常的位置的表面上的区块内的像素强度。 在照明光束与被检查表面之间引起旋转运动的情况下，通过比较被检查的两个不同表面上的相应位置处的像素的像素强度，可以改善信噪比，其中在相同相对位置上的对应像素在 两个不同的表面被照射并且在相同的光学条件下收集和检测到散射的辐射。

公开(公告)号：WO2005065246A3

公开(公告)日：2006-01-05

申请号：PCT/US2004043129

申请日：2004-12-17

Applicant: KLA TENCOR TECH CORP ,  VAEZ-IRAVANI MEHDI ,  ZHAO GUOHENG ,  STOWKOWSKI STANLEY E

Inventor： VAEZ-IRAVANI MEHDI ,  ZHAO GUOHENG ,  STOWKOWSKI STANLEY E

IPC: G02B6/00 ,  G02B6/04 ,  G02B6/32 ,  G02B27/48

CPC classification number: G02B27/48 ,  G02B6/0001 ,  G02B6/04

Abstract: Disclosed are apparatus and methods for illuminating a sample,

Abstract translation: 公开了用于照亮样品的装置和方法，

公开(公告)号：WO2006041944A9

公开(公告)日：2006-07-20

申请号：PCT/US2005035867

申请日：2005-10-04

Applicant: KLA TENCOR TECH CORP ,  MILLER LAWRENCE ROBERT ,  VAEZ-IRAVANI MEHDI

Inventor： MILLER LAWRENCE ROBERT ,  VAEZ-IRAVANI MEHDI

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8822

Abstract: Pixel intensities indicative of scattered radiation from portions of the inspected surface surrounding a location of a potential anomaly are also stored so that such data is available for quick review of the pixel intensities within a patch on the surface containing the location of the potential anomaly. Where rotational motion is caused between the illumination beam and the inspected surface, signal-to-noise ratio may be improved by comparing the pixel intensities of pixels at corresponding positions on two different surfaces that are inspected, where corresponding pixels at the same relative locations on the two different surfaces are illuminated and scattered radiation therefrom collected and detected under the same optical conditions.

Abstract translation: 还存储指示围绕潜在异常位置的被检查表面的部分的散射辐射的像素强度，使得这样的数据可用于快速查看包含潜在异常位置的表面上的贴片内的像素强度。 在照明光束和被检查表面之间产生旋转运动的情况下，可以通过比较被检查的两个不同表面上的相应位置处的像素的像素强度来改善信噪比，其中相同相对位置处的相应像素 两个不同的表面被照射，并且在相同的光学条件下收集和检测散射的辐射。

公开(公告)号：WO03089872A9

公开(公告)日：2004-12-23

申请号：PCT/US0312070

申请日：2003-04-18

Applicant: KLA TENCOR TECH CORP

Inventor： VAEZ-IRAVANI MEHDI ,  MILLER LARRY

IPC: G01N21/88 ,  G01N21/956

CPC classification number: G01N21/95623 ,  G01N21/8806

Abstract: A multi-spot inspection system employs an objective (30) for focusing an array of radiation beams (24) to a surface of an object (28) and a second objective (32) having a large numerical aperture for collecting scattered radiation (64) from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel (34) so that information about a scattering may be conveyed to a corresponding detector in a remote detector array (36) for processing. For patterned surface inspection, a cross-shaped filter (90) is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter (92) in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface.

Abstract translation: 多点检查系统采用物镜（30）将辐射束阵列（24）聚焦到物体（28）的表面和具有大数值孔径的第二物镜（32）以收集散射辐射（64） 从阵列的照明点。 来自每个照明点的散射的辐射被聚焦到相应的光纤通道（34），使得关于散射的信息可以传送到远程检测器阵列（36）中的对应的检测器进行处理。 对于图案化表面检查，十字形过滤器（90）与表面一起旋转，以减少曼哈顿几何形状的衍射效应。 也可以采用环形孔形状的空间滤光器（92），以减少表面上的阵列等图案的散射。

公开(公告)号：WO2005092025A3

公开(公告)日：2007-05-18

申请号：PCT/US2005009324

申请日：2005-03-22

Applicant: KLA TENCOR TECH CORP ,  NASSER-GHODSI MEHRAN ,  BOROWICZ MARK ,  BAKKER DAVE ,  VAEZ-IRAVANI MEHDI ,  AJI PRASHANT ,  GARCIA RUDY F ,  CHUANG TZU CHIN

Inventor： NASSER-GHODSI MEHRAN ,  BOROWICZ MARK ,  BAKKER DAVE ,  VAEZ-IRAVANI MEHDI ,  AJI PRASHANT ,  GARCIA RUDY F ,  CHUANG TZU CHIN

IPC: H01L21/00 ,  A61N5/00 ,  G01N1/32 ,  G03C5/00 ,  G03F9/00 ,  G21G5/00 ,  H01J37/30

CPC classification number: H01J37/317 ,  G01N1/32 ,  H01J37/244 ,  H01J37/3005 ,  H01J2237/2814 ,  H01J2237/3174 ,  H01J2237/31745

Abstract: Methods and systems for measuring a characteristic of a substrate (90) or preparing a substrate (90) for analysis are provided. One method for measuring a characteristic of a substrate (90) includes removing a portion of a feature on the substrate (90) using an electron beam (110) to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate (90) for analysis includes removing a portion of a material on the substrate (90) proximate to a defect using chemical etching (88) in combination with an electron beam (110). The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate (90) for analysis includes removing a portion of a material on a substrate (90) proximate to a defect using chemical etching (88) in combination with an electron beam (110) and a light beam.

Abstract translation: 提供了用于测量基板（90）的特性或准备用于分析的基板（90）的方法和系统。 用于测量衬底（90）的特性的一种方法包括使用电子束（110）去除衬底（90）上的特征的一部分以暴露特征的剩余部分的横截面轮廓。 该特征可以是光致抗蚀剂特征。 该方法还包括测量横截面轮廓的特性。 制备用于分析的基板（90）的方法包括使用化学蚀刻（88）与电子束（110）组合地去除靠近缺陷的基板（90）上的材料的一部分。 缺陷可能是地下缺陷或部分地下缺陷。 制备用于分析的衬底（90）的另一种方法包括使用化学蚀刻（88）与电子束（110）和光束组合，去除邻近缺陷的衬底（90）上的材料的一部分。

公开(公告)号：WO2004111623B1

公开(公告)日：2005-03-17

申请号：PCT/US2004017707

申请日：2004-06-04

Applicant: KLA TENCOR TECH CORP ,  BEVIS CHRISTOPHER F ,  KIRK MIKE ,  VAEZ-IRAVANI MEHDI

Inventor： BEVIS CHRISTOPHER F ,  KIRK MIKE ,  VAEZ-IRAVANI MEHDI

IPC: G01N21/47 ,  G01N21/94 ,  G01N21/95

CPC classification number: G01N21/956 ,  G01N21/474 ,  G01N21/94 ,  G01N21/9501

Abstract: Systems for inspection of patterned and unpatterned wafers are provided. One system includes an illumination system configured to illuminate the specimen. The system also includes a collector configured to collect light scattered from the specimen. In addition, the system includes a segmented detector configured to separately detect different portions of the light such that azimuthal and polar angular information about the different portions of light is preserved. The detector may also be configured to produce signals representative of the different portions of the light. The system may also include a processor configured to detect defects on the specimen from the signals. In another embodiment, the system may include a stage that is configured to rotate and translate the specimen. In one such embodiment, the system may also include an illumination system configured to scan the specimen in a wide scan path during rotation and translation of the specimen.

Abstract translation: 提供了用于图案化和未图案化晶片检查的系统。 一个系统包括被配置为照亮样本的照明系统。 该系统还包括收集器，用于收集从样品散射的光。 此外，该系统包括分段检测器，其被配置为分别检测光的不同部分，使得保持关于光的不同部分的方位角和极坐标信息。 检测器还可以被配置为产生表示光的不同部分的信号。 该系统还可以包括处理器，其配置成从信号中检测样本上的缺陷。 在另一个实施例中，系统可以包括被配置为旋转和平移样本的台。 在一个这样的实施例中，系统还可以包括被配置为在样本的旋转和平移期间以宽扫描路径扫描样本的照明系统。

公开(公告)号：WO2004025848A9

公开(公告)日：2004-06-10

申请号：PCT/US0328593

申请日：2003-09-10

Applicant: KLA TENCOR TECH CORP

Inventor： VAEZ-IRAVANI MEHDI

IPC: G01N21/47 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66 ,  G01N21/00 ,  G01J4/00

CPC classification number: G01N21/9501 ,  G01N21/474 ,  G01N21/956

Abstract: A compact surface inspection optical head is disclosed which comprises a frame with two rings of apertures (12a, 12b) therein. The first set of apertures (12a) surrounding and close to a normal direction (20') to the surface to be inspected is connected to fibers used to collect scattered radiation useful for the detection of micro-scratches caused by chemical and mechanical polishing. A second ring of apertures (12b) at low elevation angles to the surface inspected is connected to fibers to collect radiation scattered by the surface inspected for anomaly detectoin on patterned surfaces. This ring of apertures (12b) segments azimuthally the collection space so that the signal outputs from detectors that are saturated by the pattern diffraction or scattering may be discarded and only the outputs of unsaturated detectors are used for anomaly detection. A pair of larger apertures (12c) in the double dark field positions may be employed for anomaly detection on unpatterned surfaces.

公开(公告)号：WO03069263A9

公开(公告)日：2004-03-04

申请号：PCT/US0304043

申请日：2003-02-11

Applicant: KLA TENCOR TECH CORP

Inventor： VAEZ-IRAVANI MEHDI ,  ZHAO GUOHENG ,  STOKOWSKI STANLEY E

IPC: G01B11/30 ,  G01B11/24 ,  G01N21/47 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66 ,  G01N21/00

CPC classification number: G01N21/95623 ,  G01N21/47 ,  G01N21/94 ,  G01N2201/1045

Abstract: A cylindrical mirror or lens (12) is used to focus an input collimated beam of light onto a line (20) on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of CCD (32) parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam. For inspecting surface with a pattern thereon, the light from the surface is first passed through a spatial filter (106) before it is imaged onto the CCD. The spatial filter may be replaced by reflective strips that selectively reflects scattered radiation to the detector, where the reflective strips also shift in synchronism with the relative motion.

Abstract translation: 圆柱形镜或透镜（12）用于将输入的准直光束聚焦到要检查的表面上的线（20）上，其中线基本上在聚焦束的入射平面中。 光束的图像被投影到平行于线的CCD阵列（32）上，用于检测表面的异常和/或特征，其中阵列位于聚焦光束的入射平面之外。 为了在其上检查具有图案的表面，来自表面的光在其被成像到CCD之前首先通过空间滤光器（106）。 空间滤波器可以由选择性地将散射的辐射反射到检测器的反射条替代，其中反射条也与相对运动同步地移动。

公开(公告)号：DE112005000660T5

公开(公告)日：2007-02-08

申请号：DE112005000660

申请日：2005-03-22

Applicant: KLA TENCOR TECH CORP

Inventor： NASSER-GHODSI MEHRAN ,  BAKKER DAVE ,  BOROWICZ MARK ,  VAEZ-IRAVANI MEHDI ,  AJI PRASHANT ,  GARCIA RUDY F ,  CHUANG TZU CHIN

IPC: G01N1/28 ,  A61N5/00 ,  G01N1/32 ,  G01N1/44 ,  G01N13/10 ,  G03C5/00 ,  G03F9/00 ,  G21G5/00 ,  H01J37/30

Abstract: Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.