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公开(公告)号：US20230291117A1
公开(公告)日：2023-09-14
申请号：US18199336
申请日：2023-05-18
Applicant: KMW INC.
Inventor： Duk Yong KIM , Young Chan MOON , Nam Shin PARK , Sung Ho JANG , Jae Hong KIM , Joon Hyong SHIM , Bae Mook JEONG , Min Seon YUN , Seong Min AHN , Jae Eun KIM , Sung Hwan SO , Yong Won SEO , Oh Seog CHOI , Kyo Sung JI , Chi Back RYU
Abstract: The present disclosure relates to an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome combined with the front surface of the RF filter and protecting the radiation element module from the outside.
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公开(公告)号：US20230253694A1
公开(公告)日：2023-08-10
申请号：US18135156
申请日：2023-04-16
Applicant: KMW INC.
Inventor： Duk Yong KIM , Young Chan MOON , Nam Shin PARK , Sung Ho JANG , Jae Hong KIM , Joon Hyong SHIM , Bae Mook JEONG , Min Seon YUN , Sung Hwan SO , Yong Won SEO , Oh Seog CHOI , Kyo Sung JI , Chi Back RYU , Seong Min AHN , Jae Eun KIM
CPC classification number: H01Q1/02 , H01Q21/0006
Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
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公开(公告)号：US20230253693A1
公开(公告)日：2023-08-10
申请号：US18134706
申请日：2023-04-14
Applicant: KMW INC.
Inventor： Duk Yong KIM , Young Chan MOON , Nam Shin PARK , Sung Ho JANG , Jae Hong KIM , Joon Hyong SHIM , Bae Mook JEONG , Min Seon YUN , Sung Hwan SO , Yong Won SEO , Oh Seog CHOI , Kyo Sung JI , Chi Back RYU , Seong Min AHN , Jae Eun KIM
Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
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Patent Agency Ranking
公开(公告)号：US20240098885A1
公开(公告)日：2024-03-21
申请号：US18525907
申请日：2023-12-01
Applicant: KMW INC.
Inventor： Bae Mook JEONG , Kyo Sung JI , Seong Min AHN , Chi Back RYU , Jae Eun KIM , Seung Min LEE , Ki Hun PARK , Won Jun PARK , Duk Yong KIM
CPC classification number: H05K1/0242 , H05K1/0243 , H05K1/142 , H05K1/145 , H05K2201/10098
Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.
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公开(公告)号：US20240098880A1
公开(公告)日：2024-03-21
申请号：US18525872
申请日：2023-12-01
Applicant: KMW INC.
Inventor： Bae Mook JEONG , Kyo Sung JI , Seong Min AHN , Chi Back RYU , Jae Eun KIM , Seung Min LEE , Ki Hun PARK , Won Jun PARK , Jun Woo YANG
CPC classification number: H05K1/0212 , H05K1/184 , H05K3/321 , H05K2201/0355 , H05K2201/06 , H05K2201/0715 , H05K2201/10409
Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
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公开(公告)号：US20230253695A1
公开(公告)日：2023-08-10
申请号：US18135157
申请日：2023-04-16
Applicant: KMW INC.
Inventor： Duk Yong KIM , Young Chan MOON , Nam Shin PARK , Sung Ho JANG , Jae Hong KIM , Joon Hyong SHIM , Bae Mook JEONG , Min Seon YUN , Sung Hwan SO , Yong Won SEO , Oh Seog CHOI , Kyo Sung JI , Chi Back RYU , Seong Min AHN , Jae Eun KIM
Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF filter, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
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公开(公告)号：US20240088553A1
公开(公告)日：2024-03-14
申请号：US18518625
申请日：2023-11-24
Applicant: KMW INC.
Inventor： Duk Yong KIM , Bae Mook JEONG , Kyo Sung JI , Chi Back RYU , Won Jun PARK , Jun Woo YANG , Seong Min AHN , Ki Hun PARK , Jae Eun KIM
IPC: H01Q1/52
CPC classification number: H01Q1/526
Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.
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公开(公告)号：US20230299021A1
公开(公告)日：2023-09-21
申请号：US18137514
申请日：2023-04-21
Applicant: KMW INC.
Inventor： Bae Mook JEONG , Seong Min AHN , Jae Eun KIM , Seung Min LEE , Jin Soo YEO
IPC: H01L23/66 , H01L23/367 , H01L23/373 , H05K1/02 , H01L23/00
CPC classification number: H01L23/66 , H01L23/3675 , H01L23/3736 , H01L24/45 , H05K1/021 , H01L2223/6644 , H01L2924/1421 , H01L2924/1811
Abstract: Provided are a power amplification device and a manufacturing method thereof, wherein the power amplification device provides compact substrates by laminating a plurality of substrates, and has improved heat dissipating performance since a heat dissipating plate is installed to be in surface-contact with one of the plurality of substrates, and a heating element mounted on the substrate is in contact with the heat dissipating plate.
To this end, the power amplification device, according to the present disclosure, comprises: a first board having a first through-hole penetrating from the front to rear thereof; a second board of which the front surface is disposed on the rear surface of the first board, has a second through-hole penetrating from the front to rear thereof at a position corresponding to the first through-hole, and has a heating element penetrating the first through-hole and the second through-hole; and a heat dissipating plate of which the front surface is disposed on the rear surface of the second board and is in contact with the rear surface of the heating element.
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