公开(公告)号：US20240380110A1

公开(公告)日：2024-11-14

申请号：US18781984

申请日：2024-07-23

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Bae Mook JEONG ,  Seong Min AHN ,  Ki Hun PARK ,  Kyo Sung JI ,  Chi Back RYU ,  Won Jun PARK ,  Min Sik PARK ,  Hyoung Seok YANG ,  Yong Sang LEE ,  Sung Hwan SO ,  Yong Won SEO ,  In Ho KIM ,  Hee KIM

IPC: H01Q5/307 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q21/06

Abstract: The present invention relates to a small cell base station antenna apparatus, and more particularly, comprises: a radio unit (RU); one or more antenna modules installed on the radio unit so as to be capable of tilting and steering operations; and a multi-function link for mediating the installation of the one or more respective antenna modules on the radio unit, wherein the multi-function link includes male connectors that electrically connect female connectors included in the antenna modules and the radio unit, thus providing the benefits of improving the workability of indoor installation and facilitating the construction of a small cell base station.

公开(公告)号：US20240088553A1

公开(公告)日：2024-03-14

申请号：US18518625

申请日：2023-11-24

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Bae Mook JEONG ,  Kyo Sung JI ,  Chi Back RYU ,  Won Jun PARK ,  Jun Woo YANG ,  Seong Min AHN ,  Ki Hun PARK ,  Jae Eun KIM

IPC: H01Q1/52

CPC classification number: H01Q1/526

Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.

公开(公告)号：US20240098885A1

公开(公告)日：2024-03-21

申请号：US18525907

申请日：2023-12-01

Applicant: KMW INC.

Inventor： Bae Mook JEONG ,  Kyo Sung JI ,  Seong Min AHN ,  Chi Back RYU ,  Jae Eun KIM ,  Seung Min LEE ,  Ki Hun PARK ,  Won Jun PARK ,  Duk Yong KIM

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0242 ,  H05K1/0243 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/10098

Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.

公开(公告)号：US20240098880A1

公开(公告)日：2024-03-21

申请号：US18525872

申请日：2023-12-01

Applicant: KMW INC.

Inventor： Bae Mook JEONG ,  Kyo Sung JI ,  Seong Min AHN ,  Chi Back RYU ,  Jae Eun KIM ,  Seung Min LEE ,  Ki Hun PARK ,  Won Jun PARK ,  Jun Woo YANG

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0212 ,  H05K1/184 ,  H05K3/321 ,  H05K2201/0355 ,  H05K2201/06 ,  H05K2201/0715 ,  H05K2201/10409

Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.