公开(公告)号：US20230299021A1

公开(公告)日：2023-09-21

申请号：US18137514

申请日：2023-04-21

Applicant: KMW INC.

Inventor： Bae Mook JEONG ,  Seong Min AHN ,  Jae Eun KIM ,  Seung Min LEE ,  Jin Soo YEO

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/3736 ,  H01L24/45 ,  H05K1/021 ,  H01L2223/6644 ,  H01L2924/1421 ,  H01L2924/1811

Abstract: Provided are a power amplification device and a manufacturing method thereof, wherein the power amplification device provides compact substrates by laminating a plurality of substrates, and has improved heat dissipating performance since a heat dissipating plate is installed to be in surface-contact with one of the plurality of substrates, and a heating element mounted on the substrate is in contact with the heat dissipating plate.
To this end, the power amplification device, according to the present disclosure, comprises: a first board having a first through-hole penetrating from the front to rear thereof; a second board of which the front surface is disposed on the rear surface of the first board, has a second through-hole penetrating from the front to rear thereof at a position corresponding to the first through-hole, and has a heating element penetrating the first through-hole and the second through-hole; and a heat dissipating plate of which the front surface is disposed on the rear surface of the second board and is in contact with the rear surface of the heating element.

公开(公告)号：US20240098885A1

公开(公告)日：2024-03-21

申请号：US18525907

申请日：2023-12-01

Applicant: KMW INC.

Inventor： Bae Mook JEONG ,  Kyo Sung JI ,  Seong Min AHN ,  Chi Back RYU ,  Jae Eun KIM ,  Seung Min LEE ,  Ki Hun PARK ,  Won Jun PARK ,  Duk Yong KIM

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0242 ,  H05K1/0243 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/10098

Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.

公开(公告)号：US20240098880A1

公开(公告)日：2024-03-21

申请号：US18525872

申请日：2023-12-01

Applicant: KMW INC.

Inventor： Bae Mook JEONG ,  Kyo Sung JI ,  Seong Min AHN ,  Chi Back RYU ,  Jae Eun KIM ,  Seung Min LEE ,  Ki Hun PARK ,  Won Jun PARK ,  Jun Woo YANG

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0212 ,  H05K1/184 ,  H05K3/321 ,  H05K2201/0355 ,  H05K2201/06 ,  H05K2201/0715 ,  H05K2201/10409

Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.