公开(公告)号：EP2132767A4

公开(公告)日：2012-10-03

申请号：EP08726002

申请日：2008-02-22

Applicant: LAM RES CORP

Inventor： RAVKIN MICHAEL ,  DE LARIOS JOHN ,  REDEKER FRED C ,  KOROLIK MIKHAIL ,  FREER ERIK M

IPC: H01L21/67

CPC classification number: H01L21/67051

公开(公告)号：EP1965930A4

公开(公告)日：2012-09-26

申请号：EP06845929

申请日：2006-12-19

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

IPC: C11D11/00 ,  B08B3/08 ,  C09G1/02 ,  C11D3/14 ,  C11D17/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/306 ,  H01L21/67 ,  H05K3/26

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

公开(公告)号：WO2007078955A3

公开(公告)日：2008-02-07

申请号：PCT/US2006048548

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

IPC: C11D7/32

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

Abstract translation: 提供了制备用于制备基底表面的溶液的方法。 该方法包括提供将聚合物材料添加到连续介质的连续介质。 将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到 通过施加的搅拌超过聚合物材料的屈服应力。 施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

公开(公告)号：WO2007078956A3

公开(公告)日：2008-01-03

申请号：PCT/US2006048552

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

Inventor： FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

IPC: B08B3/00

CPC classification number: B08B3/024 ,  B08B3/003 ,  B08B3/08 ,  B08B6/00 ,  H01L21/67051

Abstract: A method and system for cleaning a surface, having particulate matter thereon, of a substrate features impinging upon the surface a jet of a liquid having coupling elements entrained therein. A sufficient drag force is imparted upon the coupling elements to have the same move with respect to the liquid and cause the particulate matter to move with respect to the substrate.

Abstract translation: 一种用于清洁其上具有颗粒物质的表面的表面的方法和系统，其特征在于其表面上具有夹带在其中的具有耦合元件的液体的射流。 赋予耦合元件足够的阻力以相对于液体具有相同的移动并使颗粒物质相对于基底移动。

公开(公告)号：WO2009051763A2

公开(公告)日：2009-04-23

申请号：PCT/US2008011830

申请日：2008-10-15

Applicant: LAM RES CORP ,  DE LARIOS JOHN M ,  FREER ERIK M ,  RAVKIN MICHAEL ,  MARKS JEFFREY

Inventor： DE LARIOS JOHN M ,  FREER ERIK M ,  RAVKIN MICHAEL ,  MARKS JEFFREY

IPC: H01L21/302

CPC classification number: H01L21/02057 ,  H01L21/67051

Abstract: Methods and apparatus for cleaning wafer surfaces are provided, especially for cleaning surfaces of patterned wafers. The cleaning apparatus includes a cleaning head with channels on the surface facing the patterned wafer, which has a predominant pattern. Cleaning material flowing the channels exerts a shear force on the surface of a patterned wafer, which is oriented in a specific direction to the cleaning head. The shear force and the specific orientation between the patterned wafer and the cleaning head improve the removal efficiency of the surface contaminants.

Abstract translation: 提供了用于清洁晶片表面的方法和装置，特别是用于清洁图案化晶片的表面。 清洁装置包括清洁头，该清洁头在面向图案化晶片的表面上具有通道，其具有主要图案。 流动通道的清洁材料在图案化晶片的表面上施加剪切力，该图案化晶片的面向清洁头的特定方向。 图案化晶片和清洁头之间的剪切力和特定取向提高了表面污染物的去除效率。

公开(公告)号：WO2007079373A2

公开(公告)日：2007-07-12

申请号：PCT/US2006062604

申请日：2006-12-26

Applicant: LAM RES CORP ,  FREER ERIK M ,  REDEKER FRED C ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

Inventor： FREER ERIK M ,  REDEKER FRED C ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: B08B7/00 ,  B08B3/00

CPC classification number: H01L21/67092 ,  B08B3/00 ,  B08B7/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086 ,  Y10T137/4891

Abstract: A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then die substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.

Abstract translation: 提供一种清洗基板的方法。 该方法通过将激活溶液施加到基底的表面来启动。 活化溶液和基材的表面与固体清洁表面的表面接触。 活化溶液被吸收到固体清洁元件的一部分中，然后被吸收到基片上，或者固体清洁表面相对于彼此移动以清洁基底的表面。 还提供了一种用经历塑性变形的固体清洁元件清洁基板表面的方法。 还提供了相应的清洁装置。

公开(公告)号：JP2007208246A

公开(公告)日：2007-08-16

申请号：JP2006353539

申请日：2006-12-28

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: H01L21/304 ,  C11D1/04 ,  C11D3/02 ,  C11D3/04

CPC classification number: H01L21/02052 ,  B08B3/04 ,  B08B7/00 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: PROBLEM TO BE SOLVED: To provide a cleaning agent for cleaning the surface of a wafer which is more efficient and has weak polishing effect, and to provide a method thereof.
SOLUTION: A method of executing cleaning with a three-phase body 110 is disclosed. A substrate 112 on which particles 102 are deposited on its surface is prepared. The three-phase body provided with a solid portion 108, a liquid portion 106 and a gas portion 104 is generated. A force F is applied to the three-phase body and an interaction between the solid portion and the particles is promoted. The three-phase body is removed from the surface of the substrate together with the particles. The particles are removed together with the three-phase body by the interaction between the solid portion and the particles.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于清洁晶片表面的清洁剂，其更有效并且具有较弱的抛光效果，并提供其方法。 公开了一种用三相体110进行清洗的方法。 制备其表面上沉积有颗粒102的基板112。 产生具有固体部分108，液体部分106和气体部分104的三相体。 力F施加到三相体上，促进了固体部分和颗粒之间的相互作用。 三相体与颗粒一起从衬底的表面去除。 颗粒通过固体部分和颗粒之间的相互作用与三相体一起被去除。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：WO2007078975A3

公开(公告)日：2008-08-28

申请号：PCT/US2006048706

申请日：2006-12-19

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

Inventor： KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

IPC: C09G1/00 ,  C09G1/02

CPC classification number: C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

Abstract: Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of. solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

Abstract translation: 提供了清除化合物，设备和从基材表面除去污染物的方法。 提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。 清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。 清洁化合物还包括分散在粘稠液体中的多个固体成分，多个。 固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

公开(公告)号：WO2007078642A3

公开(公告)日：2007-12-27

申请号：PCT/US2006047119

申请日：2006-12-08

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

IPC: B08B7/00

CPC classification number: H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Abstract translation: 清洁材料设置在基板上。 清洁材料包括分散在液体介质内的固体组分。 对液体介质内的固体组分施加力以使固体组分接近衬底上存在的污染物。 施加到固体组分上的力可以由液体介质内的不混溶组分施加。 当固体组分充分接近污染物时，在固体组分和污染物之间建立相互作用。 然后，将固体组分移离基底，使得从基底去除与固体组分相互作用的污染物。

公开(公告)号：WO2007079036A2

公开(公告)日：2007-07-12

申请号：PCT/US2006049109

申请日：2006-12-21

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: B08B3/00

CPC classification number: B08B7/00 ,  B08B3/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086

Abstract: A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.

Abstract translation: 提供一种清洗基板的方法。 该方法通过将其中具有固体组分的流体层设置在基底的表面来启动。 然后产生基本上平行于衬底的表面并朝向衬底的外边缘的剪切力。 在一个实施例中，剪切力可以由施加到与流体层接触的固体的力的正常或切向分量产生。 漂洗基材的表面以除去流体层。 还提供清洁系统和装置。