公开(公告)号：KR20200130230A

公开(公告)日：2020-11-18

申请号：KR20207011104

申请日：2018-04-05

Applicant: LAM RES CORP

Inventor： MATYUSHKIN ALEXANDER ,  COMENDANT KEITH LAURENCE ,  HOLLAND JOHN PATRICK

IPC: H01L21/683 ,  B23Q3/15 ,  H01L21/67 ,  H01L21/687 ,  H02N13/00

Abstract: 기판프로세싱시스템용정전척이제공되고베이스플레이트, 베이스플레이트상에배치된중간층, 및상단플레이트를포함한다. 상단플레이트는중간층을통해베이스플레이트에본딩되고기판에정전기적으로클램핑하도록구성된다. 상단플레이트는단극성클램핑전극및 시일링들을포함한다. 단극성클램핑전극은냉각제가스그루브개구부세트들을갖는그루브개구부패턴을포함한다. 시일링들은냉각제가스존들을분리한다. 냉각제가스존들은 4 개이상의냉각제가스존들을포함한다. 냉각제가스존들각각은별개의냉각제가스그루브세트들을포함한다. 상단플레이트는별개의냉각제가스그루브세트들을포함한다. 별개의냉각제가스그루브세트들각각은하나이상의냉각제가스공급홀들을갖고각각의하나의냉각제가스그루브개구부세트들에대응한다.

公开(公告)号：KR20210008146A

公开(公告)日：2021-01-20

申请号：KR20217000935

申请日：2017-12-15

Applicant: LAM RES CORP

Inventor： KELLOGG MICHAEL C ,  MACE ADAM ,  MARAKHTANOV ALEXEI ,  HOLLAND JOHN ,  CHEN ZHIGANG ,  KOZAKEVICH FELIX ,  MATYUSHKIN ALEXANDER

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/50

Abstract: 에지링을지지링에고정하기위한시스템들및 방법들이기술된다. 에지링은에지링의하단표면에삽입되는복수의패스너들을통해지지링에고정된다. 에지링을지지링에고정하는것은플라즈마챔버내에서기판의프로세싱동안에지링의안정성을제공한다. 이에더하여, 지지링이, 플라즈마챔버의절연체벽에연결되는절연체링에고정되기때문에, 에지링을지지링에고정하는것은, 에지링을플라즈마챔버에고정한다. 게다가, 지지링 및에지링은기판의프로세싱동안하나이상의걸쇠메커니즘들을사용하여수직으로풀 다운되고플라즈마챔버로부터에지링 및지지링을제거하기위해걸쇠메커니즘들을사용하여수직으로푸시업된다.

公开(公告)号：SG10202101997SA

公开(公告)日：2021-04-29

申请号：SG10202101997S

申请日：2018-04-05

Applicant: LAM RES CORP

Inventor： MATYUSHKIN ALEXANDER ,  COMENDANT KEITH LAURENCE ,  HOLLAND JOHN PATRICK

公开(公告)号：SG11201904091XA

公开(公告)日：2019-11-28

申请号：SG11201904091X

申请日：2018-04-05

Applicant: LAM RES CORP

Inventor： MATYUSHKIN ALEXANDER ,  COMENDANT KEITH LAURENCE ,  HOLLAND JOHN PATRICK

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: WO 19/ 19 48 12 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 10 October 2019 (10.10.2019) WIPO I PCT 1111111111111011111111111111110111110101110111111111111111111011101111111011110111111 (10) International Publication Number WO 2019/194812 Al (51) International Patent Classification: HOlL 21/683 (2006.01) HOlL 21/687 (2006.01) HO1L 21/67 (2006.01) (21) International Application Number: PCT/US2018/026299 (22) International Filing Date: 05 April 2018 (05.04.2018) (25) Filing Language: English (26) Publication Language: English (71) Applicant: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, California 94538 (US). (72) Inventors: MATYUSHKIN, Alexander; 2809 Rubino Circle, San Jose, California 95125 (US). COMENDANT, Keith Laurence; 4350 Glidden Way, Fremont, California 94536 (US). HOLLAND, John Patrick; 1565 Calaveras Ave., San Jose, California 95126 (US). (74) Agent: AQUINO, Damian M. et al.; Harness, Dickey & Pierce, P.L.C., P.O. Box 828, Bloomfield Hills, Michigan 48303 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (54) Title: ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOVE AND MONOPO- LAR ELECTROSTATIC CLAMPING ELECTRODE PATTERNS FIG. 2 (57) : An electrostatic chuck for a substrate processing system is provided and includes a baseplate, an intermediate layer disposed on the baseplate, and a top plate. The top plate is bonded to the baseplate via the intermediate layer and is configured to electrostatically clamp to a substrate. The top plate includes a monopolar clamping electrode and seals. The monopolar clamping electrode includes a groove opening pattern with coolant gas groove opening sets. The seals separate coolant gas zones. The coolant gas zones include four or more coolant gas zones. Each of the coolant gas zones includes distinct coolant gas groove sets. The top plate includes the distinct coolant gas groove sets. Each of the distinct coolant gas groove sets has one or more coolant gas supply holes and corresponds to a respective one of the coolant gas groove opening sets. [Continued on next page] WO 2019/194812 Al HINIONOIMEIMMEMEMENHEilMEMIEMIE SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3))

公开(公告)号：SG11202004504VA

公开(公告)日：2020-07-29

申请号：SG11202004504V

申请日：2017-12-15

Applicant: LAM RES CORP

Inventor： KELLOGG MICHAEL ,  MACE ADAM ,  MARAKHTANOV ALEXEI ,  HOLLAND JOHN ,  CHEN ZHIGANG ,  KOZAKEVICH FELIX ,  MATYUSHKIN ALEXANDER

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/50

Abstract: Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.