公开(公告)号：MY143763A

公开(公告)日：2011-07-15

申请号：MYPI20082382

申请日：2006-12-19

Applicant: LAM RES CORP

Inventor： MIKHAIL KOROLIK ,  FREER ERIK M ,  DE LARIOS JOHN M ,  KATRINA MIKHAYLICHENKO ,  MIKE RAVKIN ,  FRED REDEKER

IPC: B08B7/00

Abstract: 1 8 METHOD AND SYSTEM FOR USING A TWO-PHASES SUBSTRATE CLEANING COMPOUND ABSTRACT OF THE DISCLOSURE 1511 CLEANING COMPOUNDS, APPARATUS, AND METHODS TO REMOVE CONTAMINANTS FROM A 5 SUBSTRATE SURFACE ARE PROVIDED. AN EXEMPLARY CLEANING COMPOUND TO REMOVE PARTICULATE CONTAMINANTS FROM A SEMICONDUCTOR SUBSTRATE SURFACE IS PROVIDED. THE CLEANING COMPOUND INCLUDES A VISCOUS LIQUID WITH A VISCOSITY BETWEEN ABOUT I CP TO ABOUT 10,000 O. THE CLEANING COMPOUND ALSO INCLUDES A PLURALITY OF SOLID COMPONENTS DISPERSED IN THE VISCOUS LIQUID, THE PLURALITY OF SOLID COMPONENTS INTERACT WITH THE PARTICULATE CONTAMINANTS ON THE SUBSTRATE SURFACE TO REMOVE THE PARTICULATE CONTAMINANTS FROM THE SUBSTRATE SURFACE,

公开(公告)号：MY159175A

公开(公告)日：2016-12-30

申请号：MYPI20062784

申请日：2006-06-13

Applicant: LAM RES CORP

Inventor： JOHN M DE LARIOS ,  MIKE RAVKIN ,  JEFFREY FARBER ,  MIKHAIL KOROLIK ,  FRED C REDEKER

IPC: B08B3/00

Abstract: A METHOD FOR CLEANING A SUBSTRATE (702) IS PROVIDED. IN THIS METHOD, A FLOW OF NON-NEWTONIAN FLUID IS PROVIDED WHERE AT LEAST A PORTION OF THE FLOW EXHIBITS PLUG FLOW. TO REMOVE PARTICLES FROM A SURFACE OF THE SUBSTRATE (702), THE SURFACE OF THE SUBSTRATE IS PLACED IN CONTACT WITH THE PORTION OF THE FLOW THAT EXHIBITS PLUG FLOW SUCH THAT THE PORTION OF THE FLOW EXHIBITING PLUG FLOW MOVES OVER THE SURFACE OF THE SUBSTRATE. ADDITIONAL METHODS AN APPARATUSES FOR CLEANING A SUBSTRATE (702) ALSO ARE DESCRIBED. FIG. 5

公开(公告)号：SG115836A1

公开(公告)日：2005-10-28

申请号：SG200502519

申请日：2005-03-23

Applicant: LAM RES CORP

Inventor： MIKHAIL KOROLIK ,  JOHN M DE LARIOS ,  MIKE RAVKIN ,  JEFFREY FARBER

IPC: H01L21/304 ,  B08B3/04 ,  H01L21/00

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.