公开(公告)号：EP2301067A4

公开(公告)日：2013-08-28

申请号：EP09762834

申请日：2009-05-22

Applicant: LAM RES CORP

Inventor： STEVENSON TOM ,  DHINDSA RAJINDER

IPC: H01L21/3065 ,  C23C16/455 ,  C23C16/509 ,  C23C16/52 ,  H01J37/32 ,  H01L21/205

CPC classification number: H01L21/3065 ,  C23C16/45565 ,  C23C16/52 ,  H01J37/32091 ,  H01J37/32532 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605 ,  H01L21/67069

Abstract: Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact regions across the backing plate; and at least one interface member separating the backing plate and the thermal control plate, or the thermal control plate and showerhead electrode, at the contact regions, the interface member having a thermally and electrically conductive gasket portion and a particle mitigating seal portion. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

公开(公告)号：EP2460179A4

公开(公告)日：2012-06-06

申请号：EP10804865

申请日：2010-06-29

Applicant: LAM RES CORP

Inventor： STEVENSON TOM ,  BYUN DANIEL ,  ULLAL SAURABH ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER

IPC: H01L21/687 ,  B23Q3/15 ,  C23C16/458 ,  H01L21/683 ,  H02N13/00

CPC classification number: H01L21/68757 ,  H01J37/32541 ,  H01J37/3255 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6875

公开(公告)号：WO2012017378A3

公开(公告)日：2012-06-07

申请号：PCT/IB2011053417

申请日：2011-08-01

Applicant: LAM RES CORP ,  LAM RES AG ,  KIMBALL CHRIS ,  STEVENSON TOM ,  MURAOKA PETER

Inventor： KIMBALL CHRIS ,  STEVENSON TOM ,  MURAOKA PETER

IPC: H01L21/683 ,  B23Q3/15 ,  H01L21/687 ,  H02N13/00

CPC classification number: B08B7/0064 ,  B08B1/00 ,  H01L21/6831

Abstract: Methods for stabilizing a ceramic contact surface of an electrostatic chuck, wherein the electrostatic chuck can be disposed within a reaction chamber of a semiconductor wafer processing assembly including a radio frequency source and a coolant gas supply are described herein. The method may include: clamping electrostatically a conditioning wafer to the ceramic contact surface of the electrostatic chuck; and cycling an output power of the radio frequency source and an output pressure of the coolant gas supply for multiple hot/cold cycles. Each of the hot/cold cycles includes a hot abrasion state and a cold abrasion state. At the hot abrasion state, the output power of the radio frequency source is relatively high and the output pressure of the coolant gas supply is relatively low to yield a relatively hot conditioning wafer. At the cold abrasion state, the output power of the radio frequency source is relatively low and the output pressure of the coolant gas supply is relatively high to yield a relatively cool conditioning wafer.

Abstract translation: 本文描述了用于稳定静电卡盘的陶瓷接触表面的方法，其中静电卡盘可以设置在包括射频源和冷却剂气体源的半导体晶片处理组件的反应室内。 该方法可以包括：将调理晶片静电夹持到静电卡盘的陶瓷接触表面; 并且循环射频源的输出功率和多个热/冷循环的冷却剂气体供应的输出压力。 每个热/冷循环包括热磨损状态和冷磨损状态。 在热磨损状态下，射频源的输出功率相对较高，并且冷却剂气体供应的输出压力相对较低以产生相对热调节的晶片。 在冷磨损状态下，射频源的输出功率相对较低，并且冷却剂气体供应的输出压力相对较高以产生相对较冷的调节晶片。

公开(公告)号：WO2011014328A3

公开(公告)日：2011-05-05

申请号：PCT/US2010040284

申请日：2010-06-29

Applicant: LAM RES CORP ,  STEVENSON TOM ,  BYUN DANIEL ,  ULLAL SAURABH ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER

Inventor： STEVENSON TOM ,  BYUN DANIEL ,  ULLAL SAURABH ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER

IPC: H01L21/687 ,  B23Q3/15 ,  H02N13/00

CPC classification number: H01L21/68757 ,  H01J37/32541 ,  H01J37/3255 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6875

Abstract: An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.

Abstract translation: 提供一种静电卡盘组件，其包括陶瓷接触层，图案化结合层，导电基板和地下电弧缓解层。 陶瓷接触层和导电基板协作以形成在静电卡盘组件的地下部分中形成的多个混合气体分配通道。 混合气体分配通道中的各个包括由导电基板呈现的相对高的导电性的表面和由陶瓷接触层呈现的相对低的电导率。 地下电弧缓解层包括相对较低电导率的层，并且形成在静电卡盘组件的地下部分中的混合气体分配通道的较高电导率表面上。 还提供了半导体晶片处理室。

公开(公告)号：WO2009078923A3

公开(公告)日：2009-09-17

申请号：PCT/US2008013466

申请日：2008-12-18

Applicant: LAM RES CORP ,  LARSON DEAN JAY ,  STEVENSON TOM ,  WANG VICTOR

Inventor： LARSON DEAN JAY ,  STEVENSON TOM ,  WANG VICTOR

IPC: H01L21/3065 ,  H01L21/205

CPC classification number: H01L21/67069 ,  B32B37/12 ,  H01L21/67103 ,  H01L21/68757 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T428/31504

Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of =800% at a temperature range between room temperature and 300°C such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

Abstract translation: 提供了一种用于减少诸如等离子体处理装置的半导体真空室中的颗粒污染的粘合组件，包括在部件的配合表面和支撑构件之间的弹性片粘合剂粘合以适应热应力。 弹性体片材包括硅氧烷粘合剂，以在室温和300℃之间的温度范围内承受= 800％的高剪切应变，例如可热固化的高分子量二甲基硅氧烷和任选的填料。 片材形式具有用于粘结表面平行度的粘结厚度控制。 片状粘合剂可以被切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以安装到空腔中。 安装可以手动，手动安装工具或自动化机械。 具有不同物理性质的片状粘合剂的复合层可以层压或共面。

公开(公告)号：SG10201404264RA

公开(公告)日：2014-10-30

申请号：SG10201404264R

申请日：2010-06-29

Applicant: LAM RES CORP

Inventor： STEVENSON TOM ,  BYUN DANIEL ,  ULLAL SAURABH ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER

Abstract: An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.

公开(公告)号：MY166000A

公开(公告)日：2018-05-21

申请号：MYPI2010002812

申请日：2008-12-17

Applicant: LAM RES CORP

Inventor： LARSON DEAN JAY ,  STEVENSON TOM ,  WANG VICTOR

IPC: B23P17/04 ,  B23P19/00 ,  C23C16/455 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509 ,  C23F1/00 ,  H01L21/306 ,  H01S4/00

Abstract: A SHOWERHEAD ELECTRODE FOR A PLASMA PROCESSING APPARATUS INCLUDES AN ELASTOMERIC SHEET ADHESIVE BOND BETWEEN MATING SURFACES OF AN ELECTRODE AND A BACKING MEMBER TO ACCOMMODATE STRESSES GENERATED DURING TEMPERATURE CYCLING DUE TO MISMATCH IN COEFFICIENTS OF THERMAL EXPANSION. THE ELASTOMERIC SHEET COMPRISES A THERMALLY CONDUCTIVE SILICONE ADHESIVE ABLE TO WITHSTAND A HIGH SHEAR STRAIN OF ≥300% IN A TEMPERATURE RANGE OF ROOM TEMPERATURE TO 3000C SUCH AS HEAT CURABLE HIGH MOLECULAR WEIGHT DIMETHYL SILICONE WITH FILLERS. THE SHEET FORM ADHESIVE HAS BOND THICKNESS CONTROL FOR PARALLELISM OF BONDED SURFACES OVER LARGE AREAS. THE SHEET ADHESIVE MAY BE CAST OR DIE CUT INTO PREFORM SHAPES THAT CAN CONFORM TO IRREGULARLY SHAPED FEATURES, MAXIMIZE SURFACE CONTACT AREA WITH MATING ELECTRODE SURFACES, AND INSTALLED INTO CAVITIES OF THE MATING ASSEMBLY. INSTALLATION CAN BE MANUALLY, MANUALLY WITH INSTALLATION TOOLING, OR WITH AUTOMATED MACHINERY. COMPOSITE LAYERS OF SHEET ADHESIVE HAVING DIFFERENT PHYSICAL PROPERTIES CAN BE LAMINATED OR COPLANAR.

公开(公告)号：SG177584A1

公开(公告)日：2012-02-28

申请号：SG2012001616

申请日：2010-06-29

Applicant: LAM RES CORP

Inventor： STEVENSON TOM ,  BYUN DANIEL ,  ULLAL SAURABH ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER

Abstract: An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.

公开(公告)号：SG10201407723PA

公开(公告)日：2014-12-30

申请号：SG10201407723P

申请日：2008-12-17

Applicant: LAM RES CORP

Inventor： LARSON DEAN JAY ,  STEVENSON TOM ,  WANG VICTOR

Abstract: A COMPOSITE SHOWERHEAD ELECTRODE ASSEMBLY FOR A A showerhead electrode for a plasma processing apparatus includes an elastomeric sheet adhesive bond between mating surfaces of an electrode and a backing member to accommodate stresses generated during temperature cycling due to mismatch in coefficients of thermal expansion. The elastomeric sheet comprises a thermally conductive silicone adhesive able to withstand a high shear strain of 300% in a ≥ temperature range of room temperature to 3000C such as heat curable high molecular weight dimethyl silicone with fillers. The sheet form adhesive has bond thickness control for parallelism of bonded surfaces over large areas. The sheet adhesive may be cast or die cut into pre-form shapes that can conform to irregularly shaped features, maximize surface contact area with mating electrode surfaces, and installed into cavities of the mating assembly. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar. Figure 1 - 29 -

公开(公告)号：SG187387A1

公开(公告)日：2013-02-28

申请号：SG2012093456

申请日：2008-12-18

Applicant: LAM RES CORP

Inventor： LARSON DEAN JAY ,  STEVENSON TOM ,  WANG VICTOR

Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of =800% at a temperature range between room temperature and 300°C such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.Figure 1A