METHOD FOR PROVIDING ELECTROMAGNETIC SHIELD AND DIFFUSION BARRIER CHARACTERISTICS TO PLASTIC EXTRUDED PART AND DEVICE FORMED THEREBY

    公开(公告)号:JPH10674A

    公开(公告)日:1998-01-06

    申请号:JP7109797

    申请日:1997-03-25

    Abstract: PROBLEM TO BE SOLVED: To obtain a composite co-extrusion part reinforced in diffusion barrier characteristics and having shield characteristics of electromagnetic interference by extruding a first part made of a first material and forming a sheet material containing a multilayered sheet to the periphery of the extrudate in a tubular shape to bond the same thereto to form a composite structure and extruding a second part of a second material to cover the composite structure. SOLUTION: A base part 12 composed of a first material is extruded from a die 20 of an extruder 10 to form a first part 80 while a multilayered sheet 82 wherein a metal layer is held between upper and lower polymer layers is held to the continuous roll on a mandrel and continuously formed into a tubular form by a winding jig 70 and a sewing machine 72 and this flexible tube is matched with the outside of the first extrusion part 80 to be pressed to the surface of the first part 80 by a roll 60 to form a part 83. Next, the part 83 is passed through a second extrusion die 40 and the material 84 for a second part from an extruder 30 is extruded to be attached to the part 83 to form a part 81 to obtain a composite co-extrusion part having a multilayered structure.

    METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE

    公开(公告)号:CA2200136C

    公开(公告)日:2001-06-05

    申请号:CA2200136

    申请日:1997-03-17

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure

    公开(公告)号:SG52954A1

    公开(公告)日:1998-09-28

    申请号:SG1997001175

    申请日:1997-04-11

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE

    公开(公告)号:CA2200136A1

    公开(公告)日:1997-10-17

    申请号:CA2200136

    申请日:1997-03-17

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

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