公开(公告)号：JPH1051173A

公开(公告)日：1998-02-20

申请号：JP9543497

申请日：1997-04-14

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DAHRINGER DONALD WILLIAM ,  HUBBAUER PHILIP ,  LAMBERT WILLIAM ROGER ,  LYONS ALAN MICHAEL ,  SHEPHERD LLOYD ,  WELD JOHN DAVID

IPC: H05K5/02 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00

Abstract: PROBLEM TO BE SOLVED: To provide an assembly of an electronic product having electromagnetic interference shielding capability. SOLUTION: A metallized flexible enclosure 50 is provided around an electronic product, such as, a printed circuit board, and the metallized flexible enclosure 50 is sealed in such a manner that an isolatable connector 20 may be easily accessed without deteriorating the completeness of sealing. Thus, an assembly is formed. The metallized flexible enclosure 50 has a plurality of polymeric material layers which provide diffusion barrier property, and a metal layer which provides diffusion barrier property and electromagnetic interference shielding capability. This multilayer sheet is so patterned as to optimize the diffusion barrier property and the electromagnetic interference shielding capability, thus enabling efficient mass production.

公开(公告)号：CA2200136A1

公开(公告)日：1997-10-17

申请号：CA2200136

申请日：1997-03-17

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DAHRINGER DONALD WILLIAM ,  HUBBAUER PHILIP ,  LAMBERT WILLIAM ROGER ,  LYONS ALAN MICHAEL ,  SHEPHERD LLOYD ,  WELD JOHN DAVID

IPC: H05K5/02 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K3/22

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

公开(公告)号：CA2200136C

公开(公告)日：2001-06-05

申请号：CA2200136

申请日：1997-03-17

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DAHRINGER DONALD WILLIAM ,  LYONS ALAN MICHAEL ,  HUBBAUER PHILIP ,  LAMBERT WILLIAM ROGER ,  SHEPHERD LLOYD ,  WELD JOHN DAVID

IPC: H05K5/02 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K3/22

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

公开(公告)号：SG52954A1

公开(公告)日：1998-09-28

申请号：SG1997001175

申请日：1997-04-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DAHRINGER DONALD WILLIAM ,  HUBBAUER PHILIP ,  LAMBERT WILLIAM ROGER ,  LYONS ALAN MICHAEL ,  SHEPHERD LLOYD ,  WELD JOHN DAVID

IPC: H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K5/02 ,  H05K13/00

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.