METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE

    公开(公告)号:CA2200136A1

    公开(公告)日:1997-10-17

    申请号:CA2200136

    申请日:1997-03-17

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    5.
    发明专利
    未知

    公开(公告)号:DE69809167D1

    公开(公告)日:2002-12-12

    申请号:DE69809167

    申请日:1998-09-08

    Abstract: The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence, i.e. less than 0.5%wt., of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact and by reducing the amount of impurities introduced in the tubes.

    6.
    发明专利
    未知

    公开(公告)号:DE69809167T2

    公开(公告)日:2003-07-24

    申请号:DE69809167

    申请日:1998-09-08

    Abstract: The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence, i.e. less than 0.5%wt., of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact and by reducing the amount of impurities introduced in the tubes.

    METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE

    公开(公告)号:CA2200136C

    公开(公告)日:2001-06-05

    申请号:CA2200136

    申请日:1997-03-17

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure

    公开(公告)号:SG52954A1

    公开(公告)日:1998-09-28

    申请号:SG1997001175

    申请日:1997-04-11

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

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