公开(公告)号：EP0802710A3

公开(公告)日：1998-04-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

公开(公告)号：EP0802033A1

公开(公告)日：1997-10-22

申请号：EP97301675.1

申请日：1997-03-12

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Lambert, William Roger ,  Weld, John David

IPC: B29C47/02 ,  B29C47/06 ,  H05K9/00

CPC classification number: H05K9/0084 ,  B29C47/0021 ,  B29C47/0023 ,  B29C47/003 ,  B29C47/0052 ,  B29C47/023 ,  B29C47/065

Abstract: A method for fabricating a coextruded part includes a multiple layer sheet. First, an extruded part (80) is fabricated which can include a complex interior structure. Then, a multiple layer sheet material (82) is formed into a tube surrounding the first extruded part (80) and bonded to the outer surface. Next, the composite structure then enters a second extrusion die (40) and an outer layer of a second polymeric material (84) is coextruded over the structure to form the outer surface. Thus, the multiple layer sheet (82) embedded within the coextruded part imparts diffusion barrier and electromagnetic shielding capabilities to a complex extruded part in a continuous and cost effective manner.

Abstract translation: 一种用于制造共挤出部件的方法，包括：多个层片。 首先，在挤压部分（80）被制造，其可包括一个复杂的内部结构。 然后，多层片材（82）被形成为围绕第一挤压部分（80）的管和结合到所述外表面。 接着，该复合结构，然后进入第二挤出的（40）和第二聚合材料的外层（84）上共挤出在该结构上，以形成外表面。 因此，嵌入在共挤出部分中的多个层片（82）赋予扩散阻挡并以连续和成本有效的方式的电磁屏蔽功能，以一种复杂的挤出部分。

公开(公告)号：EP0802710A2

公开(公告)日：1997-10-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

Abstract translation: 用于保护电子产品的有源电子部件从环境和电磁干扰（EMI）的组件。 描述了一种方法由电子产品周围提供一金属化柔性外壳，其中所述组件被形成，检查印刷电路板，并随后密封所述金属化柔性外壳，求也可分离连接器可以在不比奥拉·廷容易地访问该密封件的完整性 ， 金属化柔性外壳包括聚合物材料的多个层提供没有扩散阻挡性和金属层并同时提供扩散阻挡性和EMI屏蔽功能。 所述多个层片被图案化以优化扩散阻挡性和EMI屏蔽功能。 另外，多层片材能够实现高效，大批量的生产。 因此，电子产品可设置有在环境防护能力和EMI屏蔽能力适合于可靠和具有成本效益的大批量生产在组装具有。