公开(公告)号：EP0905093B1

公开(公告)日：2002-11-06

申请号：EP98307231.5

申请日：1998-09-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Fleming, Debra Anne ,  Johnson, David Wilfred Jr. ,  Hubbauer, Philip ,  MacChesney, John Burnette ,  Stockert, Thomas Edward ,  Walz, Frederick W. Jr.

IPC: C03B19/12 ,  C04B35/14 ,  C04B35/624

CPC classification number: C04B35/14 ,  C03B19/12 ,  C04B35/624

公开(公告)号：EP0905093A1

公开(公告)日：1999-03-31

申请号：EP98307231.5

申请日：1998-09-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Fleming, Debra Anne ,  Johnson, David Wilfred Jr. ,  Hubbauer, Philip ,  MacChesney, John Burnette ,  Stockert, Thomas Edward ,  Walz, Frederick W. Jr.

IPC: C03B19/12 ,  C04B35/14 ,  C04B35/624

CPC classification number: C04B35/14 ,  C03B19/12 ,  C04B35/624

Abstract: The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence, i.e. less than 0.5%wt., of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact and by reducing the amount of impurities introduced in the tubes.

Abstract translation: 本发明是一种溶胶 - 凝胶挤出方法，其允许制造厚壁和薄壁管。 例如，该方法能够以比溶胶 - 凝胶浇铸方法更容易的方式制备二氧化硅外包管，并且还能够制备难以铸造的相对薄的基材管。 根据本发明，提供了含有稳定剂的二氧化硅分散体，向分散体中加入胶凝剂以引发凝胶化，并将所得凝胶挤出成二氧化硅体，基本上不存在，即小于0.5重量％。 ，来自凝胶的聚合物材料。 通过减少从管体中除去有机材料所需的时间和能量，通过减少环境影响和减少引入管中的杂质量，基本上避免了这种聚合物材料在外包装和底物管中的包含。

公开(公告)号：EP0802710A3

公开(公告)日：1998-04-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

公开(公告)号：EP0802710A2

公开(公告)日：1997-10-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

Abstract translation: 用于保护电子产品的有源电子部件从环境和电磁干扰（EMI）的组件。 描述了一种方法由电子产品周围提供一金属化柔性外壳，其中所述组件被形成，检查印刷电路板，并随后密封所述金属化柔性外壳，求也可分离连接器可以在不比奥拉·廷容易地访问该密封件的完整性 ， 金属化柔性外壳包括聚合物材料的多个层提供没有扩散阻挡性和金属层并同时提供扩散阻挡性和EMI屏蔽功能。 所述多个层片被图案化以优化扩散阻挡性和EMI屏蔽功能。 另外，多层片材能够实现高效，大批量的生产。 因此，电子产品可设置有在环境防护能力和EMI屏蔽能力适合于可靠和具有成本效益的大批量生产在组装具有。