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1.发明公开Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure 失效使用金属化的柔性外壳的电子电路和组件的保护装置
公开(公告)号：EP0802710A2
公开(公告)日：1997-10-22
申请号：EP97302412.8
申请日：1997-04-08
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Dahringer, Donald William , Hubbauer, Philip , Lambert, William Roger , Lyons, Alan Michael , Shepherd, Lloyd , Weld, John David
CPC classification number: H05K3/284 , H05K1/0218 , H05K3/281 , H05K9/0039 , Y10T29/49146 , Y10T29/49178 , Y10T428/1338 , Y10T428/1355
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
Abstract translation: 用于保护电子产品的有源电子部件从环境和电磁干扰（EMI）的组件。 描述了一种方法由电子产品周围提供一金属化柔性外壳，其中所述组件被形成，检查印刷电路板，并随后密封所述金属化柔性外壳，求也可分离连接器可以在不比奥拉·廷容易地访问该密封件的完整性 ， 金属化柔性外壳包括聚合物材料的多个层提供没有扩散阻挡性和金属层并同时提供扩散阻挡性和EMI屏蔽功能。 所述多个层片被图案化以优化扩散阻挡性和EMI屏蔽功能。 另外，多层片材能够实现高效，大批量的生产。 因此，电子产品可设置有在环境防护能力和EMI屏蔽能力适合于可靠和具有成本效益的大批量生产在组装具有。
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2.发明公开Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure 失效使用金属化的柔性外壳的电子电路和组件的保护装置
公开(公告)号：EP0802710A3
公开(公告)日：1998-04-22
申请号：EP97302412.8
申请日：1997-04-08
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Dahringer, Donald William , Hubbauer, Philip , Lambert, William Roger , Lyons, Alan Michael , Shepherd, Lloyd , Weld, John David
CPC classification number: H05K3/284 , H05K1/0218 , H05K3/281 , H05K9/0039 , Y10T29/49146 , Y10T29/49178 , Y10T428/1338 , Y10T428/1355
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
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