公开(公告)号：EP0803558A2

公开(公告)日：1997-10-29

申请号：EP97302560.4

申请日：1997-04-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Lyons, Alan Michael ,  Dahringer, Donald William

IPC: C09J5/02

CPC classification number: H05K3/0061 ,  C09J5/02 ,  H05K3/321 ,  H05K3/323 ,  H05K3/382 ,  H05K3/383 ,  H05K2201/023 ,  H05K2203/025 ,  H05K2203/0315

Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength ofthe bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.

Abstract translation: 一种用导电粘合剂将导电表面电气和机械结合的方法，其中至少一个导电表面是易于形成不稳定氧化物的类型。 导电粘合剂具有预定量的导电颗粒。 导电粒子的刚性至少与组成导电表面的材料和形成在其上的任何氧化物一样硬。 该接合方法包括制备导电表面以在其上形成微观粗糙化的氧化物表面的步骤。 该方法还包括同时施加预定量的热和压力以固化导电表面导电粘合剂导电表面接头的步骤，使得导电粘合剂中的导电颗粒穿透氧化物以与其下的导电表面直接接触 。 该方法控制键合的机械强度和接合点的电气特性。 电气特性包括对高温和/或湿度条件的接头电阻率和接头灵敏度。

公开(公告)号：EP0802710A2

公开(公告)日：1997-10-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

Abstract translation: 用于保护电子产品的有源电子部件从环境和电磁干扰（EMI）的组件。 描述了一种方法由电子产品周围提供一金属化柔性外壳，其中所述组件被形成，检查印刷电路板，并随后密封所述金属化柔性外壳，求也可分离连接器可以在不比奥拉·廷容易地访问该密封件的完整性 ， 金属化柔性外壳包括聚合物材料的多个层提供没有扩散阻挡性和金属层并同时提供扩散阻挡性和EMI屏蔽功能。 所述多个层片被图案化以优化扩散阻挡性和EMI屏蔽功能。 另外，多层片材能够实现高效，大批量的生产。 因此，电子产品可设置有在环境防护能力和EMI屏蔽能力适合于可靠和具有成本效益的大批量生产在组装具有。

公开(公告)号：EP0802710A3

公开(公告)日：1998-04-22

申请号：EP97302412.8

申请日：1997-04-08

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.