-
1.发明公开Encapsulated package for power magnetic devices and method of manufacturing therefor 失效电力磁性装置的封装包装及其制造方法
公开(公告)号：EP0791940A2
公开(公告)日：1997-08-27
申请号：EP97300866.7
申请日：1997-02-11
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Lotfi, Ashraf Wagih , Wolf, Karl Erich , Weld, John David , Woods, William Lonzo
IPC: H01F27/02
CPC classification number: H01F27/022 , Y10T29/435 , Y10T29/4902 , Y10T29/49144 , Y10T29/49171
Abstract: An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.
Abstract translation: 一种用于功率磁性器件的封装封装及其制造方法。 功率磁装置具有在受到应力时受到磁致伸缩的磁芯。 所述封装包括：（1）围绕所述磁芯的至少一部分设置的柔性材料，和（2）基本上围绕所述柔性材料和所述磁芯的密封剂，所述柔性材料提供用于在所述密封剂和所述磁体之间吸收应力的介质 该柔性材料减少了由来自密封剂的应力引起的磁芯上的磁致伸缩。 在一个实施例中，密封剂包括通向包装周围的环境的通风口。 排气孔为柔性材料提供压力释放，使柔性材料基本消除磁致伸缩效应。
-
2.发明公开Article comprising surface-mountable, EMI-shielded plastic cover and process for fabricating article 审中-公开OberflächenmontierbareEMV-Kunststoffabdeckung，sowie deren Herstellungsverfahren
公开(公告)号：EP1139712A2
公开(公告)日：2001-10-04
申请号：EP01302259.5
申请日：2001-03-12
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Decker, Robert LeRoy , Weld, John David
IPC: H05K9/00
CPC classification number: H05K9/003 , H05K3/341 , H05K2201/0129 , H05K2201/0215 , H05K2201/10371 , Y02P70/613
Abstract: A surface mountable cover for providing EMI shielding is formed of a composition of a conductive additive suspended within a thermoplastic polymeric material in an amount sufficient to allow the article to reflect and absorb incident electromagnetic radiation. The cover is formed of a material which is solderable to a substrate, such as a printed wiring board. The thermoplastic material has a melting point of greater than about 230°C to allow the thermoplastic material to be used in surface mount technology (SMT) processing. The article and electronic components or circuits covered by the article are affixed to a printed wiring board with SMT processing.
Abstract translation: 用于提供EMI屏蔽的可表面安装的盖由悬浮在热塑性聚合材料内的导电添加剂的组合物形成，其量足以允许制品反射和吸收入射的电磁辐射。 该盖由可焊接到诸如印刷线路板的基底的材料形成。 热塑性材料的熔点大于约230℃，以使热塑性材料用于表面贴装技术（SMT）加工。 文章所涉及的物品和电子元件或电路通过SMT处理固定在印刷电路板上。
-
3.发明公开Encapsulated package for power magnetic devices and method of manufacturing therefor 失效Eingekapselte Modulefürmagnetische Leistungselemente und Herstellungsverfahren
公开(公告)号：EP0791940A3
公开(公告)日：1997-10-22
申请号：EP97300866.7
申请日：1997-02-11
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Lotfi, Ashraf Wagih , Wolf, Karl Erich , Weld, John David , Woods, William Lonzo
IPC: H01F27/02
CPC classification number: H01F27/022 , Y10T29/435 , Y10T29/4902 , Y10T29/49144 , Y10T29/49171
Abstract: An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.
Abstract translation: 一种用于功率磁性器件的封装封装及其制造方法。 功率磁性装置具有受应力作用时磁致伸缩的磁芯。 所述包装包括：（1）围绕所述磁芯的至少一部分设置的柔性材料和（2）基本上围绕所述柔性材料和所述磁芯的密封剂，所述柔性材料提供用于吸收所述密封剂和所述磁性体之间的应力的介质 芯，柔性材料减少了由密封剂的应力引起的磁芯上的磁致伸缩。 在一个实施例中，密封剂包括通向包装周围的环境的通风口。 排气口为柔性材料提供压力释放，允许柔性材料基本上消除磁致伸缩效应。
-
4.发明公开Encapsulated, integrated power magnetic device and method of manufacture therefor 失效封装并集成磁性性能的装置和方法用于制造相同
公开(公告)号：EP0801460A2
公开(公告)日：1997-10-15
申请号：EP97302214.8
申请日：1997-04-01
Applicant: LUCENT TECHNOLOGIES INC.
IPC: H02M3/28
CPC classification number: H01F41/08 , B23Q3/00 , H01F41/0206 , H01F2019/085 , H02M3/00 , H02M3/335 , Y10T29/49073 , Y10T29/49075 , Y10T29/49078 , Y10T29/53196 , Y10T29/53265
Abstract: A power magnetic device, a method of manufacture therefor and a power converter are disclosed. The power magnetic device includes: (1) an isolation transformer (240) having a primary winding (245) and a secondary winding (250), (2) a switch (260) coupled to the primary winding, (3) a rectifier (270, 275) coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input (280) coupled to a first end (282) of the primary winding, (b) a second power input (285) coupled to the switch, (c) first and second power outputs (287, 290) coupled to the rectifier circuit and (d) a control input (293) coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power (VIN), whereby the power magnetic device converts electrical power into DC electrical power.
Abstract translation: 功率磁性装置（230）具有到隔离变压器（240），其具有初级（245）和次级（250）的绕组。 电源开关FET（260）耦合到初级绕组（245）。 整流器（270.275）耦合到次级绕组（250）。 密封剂围绕变压器（240）开关（260）和整流器（270.275）将它们合成的（230）集成的封装。 包（230）具有耦合到的第一端部（282）的第一功率输入端（280）初级绕组（240）; 耦合的第二电源输入（285）切换（260）; 和第一和第二电源输出端（287.290），耦合到所述整流器的respectivement整流二极管（270.275）。 集成封装（230）具有耦合到开关（260）的控制输入端（293）。 控制输入端（293）允许开关（260）被控制以耦合初级绕组（245）到电功率源。 集成的包装或功率磁性装置（230）是能够采用隔离变压器（240）和整流器（270.275）至电功率转换成DC电力。 优选地，所述密封剂是热固性环氧模塑化合物。
-
公开(公告)号：EP1005207A2
公开(公告)日：2000-05-31
申请号：EP99309096.8
申请日：1999-11-16
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Decker, Robert Leroy , Weld, John David
IPC: H04M1/03
CPC classification number: H04M1/03
Abstract: Reaction injection molding is used to provide a communications device, e.g., a telephone handset, having a body that contains internal electronics and polymeric material that substantially fill the entire volume of the body. The body thus consists of the internal electronics surrounded or encapsulated by a continuous mass of the polymeric material.
Abstract translation: 反应注射成型用于提供通信设备，例如电话听筒，其具有主体，该主体包含基本上填充身体的整个体积的内部电子元件和聚合材料。 因此，该主体包括由连续质量的聚合物材料包围或封装的内部电子器件。
-
Patent Agency Ranking6.发明公开Encapsulated, integrated power magnetic device and method of manufacture therefor 失效封装并集成磁性性能的装置和方法用于制造相同
公开(公告)号：EP0801460A3
公开(公告)日：1999-04-21
申请号：EP97302214.8
申请日：1997-04-01
Applicant: LUCENT TECHNOLOGIES INC.
IPC: H02M3/28
CPC classification number: H01F41/08 , B23Q3/00 , H01F41/0206 , H01F2019/085 , H02M3/00 , H02M3/335 , Y10T29/49073 , Y10T29/49075 , Y10T29/49078 , Y10T29/53196 , Y10T29/53265
Abstract: A power magnetic device, a method of manufacture therefor and a power converter are disclosed. The power magnetic device includes: (1) an isolation transformer (240) having a primary winding (245) and a secondary winding (250), (2) a switch (260) coupled to the primary winding, (3) a rectifier (270, 275) coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input (280) coupled to a first end (282) of the primary winding, (b) a second power input (285) coupled to the switch, (c) first and second power outputs (287, 290) coupled to the rectifier circuit and (d) a control input (293) coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power (VIN), whereby the power magnetic device converts electrical power into DC electrical power.
-
7.发明公开Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure 失效使用金属化的柔性外壳的电子电路和组件的保护装置
公开(公告)号：EP0802710A3
公开(公告)日：1998-04-22
申请号：EP97302412.8
申请日：1997-04-08
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Dahringer, Donald William , Hubbauer, Philip , Lambert, William Roger , Lyons, Alan Michael , Shepherd, Lloyd , Weld, John David
CPC classification number: H05K3/284 , H05K1/0218 , H05K3/281 , H05K9/0039 , Y10T29/49146 , Y10T29/49178 , Y10T428/1338 , Y10T428/1355
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
-
8.发明公开Method for providing electromagnetic shielding and diffusion barrier properties of plastic extrusion and devices fabricated therefrom 失效用抗电磁波和扩散阻挡性质，和制品的保护产生Kunststoffextrudaten的方法
公开(公告)号：EP0802033A1
公开(公告)日：1997-10-22
申请号：EP97301675.1
申请日：1997-03-12
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Lambert, William Roger , Weld, John David
CPC classification number: H05K9/0084 , B29C47/0021 , B29C47/0023 , B29C47/003 , B29C47/0052 , B29C47/023 , B29C47/065
Abstract: A method for fabricating a coextruded part includes a multiple layer sheet. First, an extruded part (80) is fabricated which can include a complex interior structure. Then, a multiple layer sheet material (82) is formed into a tube surrounding the first extruded part (80) and bonded to the outer surface. Next, the composite structure then enters a second extrusion die (40) and an outer layer of a second polymeric material (84) is coextruded over the structure to form the outer surface. Thus, the multiple layer sheet (82) embedded within the coextruded part imparts diffusion barrier and electromagnetic shielding capabilities to a complex extruded part in a continuous and cost effective manner.
Abstract translation: 一种用于制造共挤出部件的方法，包括：多个层片。 首先，在挤压部分（80）被制造，其可包括一个复杂的内部结构。 然后，多层片材（82）被形成为围绕第一挤压部分（80）的管和结合到所述外表面。 接着，该复合结构，然后进入第二挤出的（40）和第二聚合材料的外层（84）上共挤出在该结构上，以形成外表面。 因此，嵌入在共挤出部分中的多个层片（82）赋予扩散阻挡并以连续和成本有效的方式的电磁屏蔽功能，以一种复杂的挤出部分。
-
9.发明公开Article comprising co-injection molded component having integral light guide 审中-公开Gegenstand mit kospritzgegossenem Bauteil mit integriertem Lichtleiter
公开(公告)号：EP0964417A3
公开(公告)日：2000-11-29
申请号：EP99304077.3
申请日：1999-05-26
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Decker, Robert LeRoy , Weld, John David
CPC classification number: H01H13/70 , B29C45/1642 , B29L2031/3437 , H01H2219/062 , H01H2229/046 , H01H2231/022
Abstract: A device, such as a cellular phone, is provided having a component, e.g., a device housing, containing an integral light guide, where the component is formed by co-injection molding. The integral light guide is capable of distributing light from one or more sources through or along the component to distant keys or a distant liquid crystal display, thereby reducing the required number of light sources in the device. In addition, because the component and light guide are co-injection molded in a single step, the complexity and cost of the manufacturing of the component, and thus the overall device, is typically reduced.
Abstract translation: 提供了诸如蜂窝电话的设备，其具有包含整体光导的部件，例如设备外壳，其中通过共注射成型形成部件。 整体光导能够将来自一个或多个源的光通过或沿着部件分配到远距离的键或远距离的液晶显示器，从而减少了所需的设备数量的光源。 此外，由于部件和光导在一个步骤中共注塑，所以组件的制造的复杂性和成本以及因此整个装置的成本通常会降低。
-
10.发明公开Article comprising co-injection molded component having integral light guide 审中-公开具有集成光纤kospritzgegossenem组分制品
公开(公告)号：EP0964417A2
公开(公告)日：1999-12-15
申请号：EP99304077.3
申请日：1999-05-26
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Decker, Robert LeRoy , Weld, John David
CPC classification number: H01H13/70 , B29C45/1642 , B29L2031/3437 , H01H2219/062 , H01H2229/046 , H01H2231/022
Abstract: A device, such as a cellular phone, is provided having a component, e.g., a device housing, containing an integral light guide, where the component is formed by co-injection molding. The integral light guide is capable of distributing light from one or more sources through or along the component to distant keys or a distant liquid crystal display, thereby reducing the required number of light sources in the device. In addition, because the component and light guide are co-injection molded in a single step, the complexity and cost of the manufacturing of the component, and thus the overall device, is typically reduced.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.023 seconds)
