公开(公告)号：JP2001168262A

公开(公告)日：2001-06-22

申请号：JP35130899

申请日：1999-12-10

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： UCHIUMI KATSUKI ,  MATSUO TAKAHIRO ,  FUKUDA TOSHIYUKI ,  YAMAGUCHI YUKIO

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To solve a problem such that the frame of a separated lead frame flies off to have an adverse effect such as a reduction in productivity in the manufacture of a semiconductor device when leads are cut off with a rotary blade in place of a cutting die. SOLUTION: A connection part 13 as high as a sealing resin 8 is formed of the sealing resin 8 on the cutting line of a lead 4 which comes out of the sealing resin 8, a sealing resin is formed also on a runner, a lead frame is bonded to a resins heat 14, and the lead 4 is cut off by a rotary blade 15, and a frame is bonded to the resin sheet 14 with the connection part 13 after the lead 4 is cut off, so that a resin-sealed semiconductor device manufacturing method which is high in productivity, kept free from resin burrs and scattering of the cut frames can be obtained.

公开(公告)号：JP2000236060A

公开(公告)日：2000-08-29

申请号：JP3667599

申请日：1999-02-16

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： ITO KENICHI ,  OGATA SHUICHI ,  FUKUDA TOSHIYUKI

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device, having improved contact strength between a die pad and sealing resin and improved resistance to moisture. SOLUTION: A lead frame is fabricated, such that a plurality of protrusions 9 are made on the side of a die pad 1 and that the protrusions 9 are bent to the side of the mounting surface where a semiconductor device 3 is mounted. Then, the semiconductor 3 is mounted on the mounting surface, the surface to be exposed of the die pad 1 is exposed, and then the semiconductor 3, the protrusions 9, inner leads (5a, 5b) are sealed with sealing resin 7. The protrusions 9 and their connected portions bite into the sealing resin 7 to increase the contact strength between the die pad 1 and the sealing resin 7, which reduces the deformation of the die pad 1, when the device is mounted and hence can keep good resistance to moisture, after the device has been mounted.

公开(公告)号：JP2000040678A

公开(公告)日：2000-02-08

申请号：JP20979498

申请日：1998-07-24

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： FUKUDA TOSHIYUKI

IPC: H01L21/301

Abstract: PROBLEM TO BE SOLVED: To provide a dicing tape and the manufacture of a semiconductor chip which can curtail the waste in semiconductor manufacture, by separating and recovering a dicing tape and an inferior tape, and recycling the separated and recovered dicing tape into a resource. SOLUTION: A semiconductor wafer 5 is mounted on a dicing tape 2 which is provided with an adhesive material layer 4 whose adhesive force drops by application of an ultraviolet ray or heating, the semiconductor wafer 5 is divided into specified chip size, the adhesive force of the adhesive material layer 5 drops by the application of an ultraviolet ray or heating so such magnitude that it can pick up the chip, and a superior chip 5b is picked up on the dicing tape 2, the adhesive force of the adhesive material layer 4 is dropped further by the reapplication of an ultraviolet ray or heating, the inferior tape 5a left on the dicing tape 2 is exfoliated from the dicing tape 2, and the dicing tape 2 and the inferior tape 5a are sorted and recovered.

公开(公告)号：JP2000196006A

公开(公告)日：2000-07-14

申请号：JP36707598

申请日：1998-12-24

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： ITO KENICHI ,  OGATA SHUICHI ,  FUKUDA TOSHIYUKI

IPC: H01L23/50 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor device which has improved close contact between a die pad and a sealing resin material, and also moisture resistance thereof. SOLUTION: A plurality of projections 9 are provided at the side surface of a die pad 1 and a lead frame is processed to bend the projections 9 towards the loading surface of a semiconductor element 3. The semiconductor element 3 is loaded on the loading surface, the exposed surface of the die pad 1 is exposed, and the semiconductor element 3, projections 9, an inner lead, etc., are sealed with a sealing resin material 7. Thereby, the projections 9 and coupling portions thereof are engaged with the sealing resin material 7 to improve the close contact structure. Deformation of die pad 1 at loading is rather small, and good moisture resistance after loading can be maintained.

公开(公告)号：JPH11345895A

公开(公告)日：1999-12-14

申请号：JP15083198

申请日：1998-06-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： FUKUDA TOSHIYUKI ,  MORISHITA YOSHIHIKO

IPC: H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which has a lead-less surface mounted package using a metal plate and has high reliability capable of handling multi-pin situation. SOLUTION: This device is provided with a semiconductor chip 1a, bonding pads 2a which are bonded with electrodes of the semiconductor chip 1a, inner leads 4a which are integrally formed below the bonding pads 2a, mount bonding electrodes 5 which are formed integrally below the inner leads 4a and of which at least a part overlaps, a protective film from which mount bonding electrodes 5 are exposed, encapsulating resin 7 which encapsulates over a protecting film 6 and soldering balls 8, which are formed on the mount bonding electrodes 5. The soldering balls 8 are arranged on the lower surface of the semiconductor device via the inner leads 4a which are encapsulated by the resin and the mount bonding electrodes 5 which are fixed by the protecting film 6, regardless of the position of the bonding pads 2a, so that the semiconductor device which can correspond to making multi-pin and has a high reliability is obtained.

公开(公告)号：JPH10189830A

公开(公告)日：1998-07-21

申请号：JP2233797

申请日：1997-02-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO ,  NANO MASANORI ,  KOUTOU NORIO ,  MORIKAWA TAKESHI ,  FUKUDA TOSHIYUKI ,  ITO FUMITO

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device and its manufacturing method having high reliability, while realizing the thinning process not only the conventional type one with its both sides simply resin-sealed. SOLUTION: Another sealing resin 15a is provided beneath a die pad 11 due to stepped parts 17 formed by upsetting process of hanging leads 10 of a lead frame 9, so that a thin-type but substantially both side sealing-type semiconductor device may be provided with both side sealing structure for securing the reliability thereof. Furthermore, outer lead parts 16 to be outer terminals are substantially on the same surface of the sides of the sealing resins 15 not to be protruded from the conventional sealing resins, thereby enabling the deformation, etc., of the outer leads 16 to be avoided for realizing the surface packaged type semiconductor device.

公开(公告)号：JP2001060657A

公开(公告)日：2001-03-06

申请号：JP23490499

申请日：1999-08-23

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： FUJIMOTO HIROAKI ,  KOGA AKIRA ,  FUKUDA TOSHIYUKI

IPC: H01L25/18 ,  H01L23/50 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To widen size combination of mountable chips in the application range in a semiconductor device, where two chips are laminated and mounted. SOLUTION: A thick insulating resin 8 is provided on the surface of a first LSI chip 2, and the rear of a second LSI chip 6 is set higher than the highest part of bonding wires 5 connected to the first LSI chip 2, so that the second LSI chip 6 will not come into contact with the bonding wires 5 connected to the first LSI chip 2. Therefore, size limitations imposed on the chips 3 and 6 are reduced, and a size combination of the LSI chips 3 and 6 can be widened in the application range.

公开(公告)号：JPH1154551A

公开(公告)日：1999-02-26

申请号：JP20884797

申请日：1997-08-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： FUKUDA TOSHIYUKI ,  YAMAGUCHI YUKIO ,  NANO MASANORI

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To make it possible to achieve the thin configuration regardless of the magnitude of a semiconductor device. SOLUTION: Thermosetting resin 10 is applied on the tip part of a suspension lead 2. A spherical filler 11 having the constant diameter is mixed into the thermosetting resin 10. Thus, the thickness of a junction part is controlled to 1/2-1/10 of the thickness of the lead, and the stabilized junction thickness can be realized. In this way, the balance of sealing resin 7a at the lower surface of a semiconductor 4 and sealing resin 7b at the upper surface can be maintained, and the fluidity of the sealing resin 7 in molding can be improved. Furthermore, the tip part 2a of the suspension lead 2 has a half-etched part 12. This is the surface mounting type semiconductor device, which does not indicate any difference from the shapes of the suspension lead 2 and an outer lead 8 exposing on the bottom surface part of a conventional plastic molded type semiconductor device.