公开(公告)号：JPH10189830A

公开(公告)日：1998-07-21

申请号：JP2233797

申请日：1997-02-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO ,  NANO MASANORI ,  KOUTOU NORIO ,  MORIKAWA TAKESHI ,  FUKUDA TOSHIYUKI ,  ITO FUMITO

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device and its manufacturing method having high reliability, while realizing the thinning process not only the conventional type one with its both sides simply resin-sealed. SOLUTION: Another sealing resin 15a is provided beneath a die pad 11 due to stepped parts 17 formed by upsetting process of hanging leads 10 of a lead frame 9, so that a thin-type but substantially both side sealing-type semiconductor device may be provided with both side sealing structure for securing the reliability thereof. Furthermore, outer lead parts 16 to be outer terminals are substantially on the same surface of the sides of the sealing resins 15 not to be protruded from the conventional sealing resins, thereby enabling the deformation, etc., of the outer leads 16 to be avoided for realizing the surface packaged type semiconductor device.

公开(公告)号：JPH08181272A

公开(公告)日：1996-07-12

申请号：JP32285294

申请日：1994-12-26

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： NAKAOKA HISASHI ,  MURAYAMA TSUGIO ,  OKUMURA ICHIRO ,  MOTOI YOSHIHIKO

IPC: H01L23/50

Abstract: PURPOSE: To provide a semiconductor device in which a semiconductor chip is firmly bonded to a lead frame without using adhesive, a manufacturing method of the semiconductor device and a lead frame for the semiconductor device. CONSTITUTION: A semiconductor chip 9 is held by the casing part protrusions 13a and 13b of casing parts 12 which are provided in the inner lead groups 11a and 11b of a lead frame and the support lead protrusions 15a and 15b of support lead parts 14a and 14b. Electrode pads 16 which are provided in the central region of the semiconductor chip 9 are electrically connected to the inner leads with metal fine wires 17 such as gold (Au) fine wires. The whole outer circumference of the semiconductor chip 9 and the lead frame is covered with sealing resin. With this constitution, the semiconductor chip can be held by the respective protrusions 13a of the casing parts 12 provided in the inner lead groups 11 of the lead frame and by the respective protrusions 15 of the support lead parts 14 without using adhesive or the like.

公开(公告)号：JPH03101240A

公开(公告)日：1991-04-26

申请号：JP23723289

申请日：1989-09-14

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO

IPC: H01L21/56

Abstract: PURPOSE:To prevent the deformation of a wire by sealing beforehand only the part which covers the wire connecting the inner lead of a lead frame and the electrode on a semiconductor chip, and then sealing the semiconductor resin sealing part entirely. CONSTITUTION:Only the part, which covers a wire 4, is sealed beforehand with bonding resin 1 without causing wire deformation, and then the resin sealed part is sealed with resin 2. Hereby, wire deformation can be prevented.

公开(公告)号：JPH01276651A

公开(公告)日：1989-11-07

申请号：JP10718988

申请日：1988-04-27

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO

IPC: H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To improve resistance to shock, electric field, and moisture and improve adhesion, by sealing a plurality of layers with resin by using different kinds of sealing resins which are effective with respect to different items of measures. CONSTITUTION:Semiconductor chips 1 which are mounted on a die pad are connected to a plurality of leads 4 through bonding wires 3 are sealed by the first sealing resin 5 which has a high moisture and adhesion resistance. Further, the external side is sheathed in the second sealing resin 6 which has a high shock and electric field resistance. Then, a measure of using the second sealing resin 6 is considered how to cope with difficulties due to a shock and electric field caused by outside factors and then, the inside that is sheathed by the second sealing resin 6 is protected from the influence of the above outside factors. The first sealing resin 5 which is protected from the outside influence in this way takes effects to improve a moisture and adhesion resistance. Thus, these sealing resins improve the resistance to shock, electric field, and moisture and improve adhesion.

公开(公告)号：JPH09186286A

公开(公告)日：1997-07-15

申请号：JP12996

申请日：1996-01-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OCHI TAKAO ,  FUNAKOSHI HISASHI ,  OKUMURA ICHIRO ,  HONMA FUTOSHI ,  OKUMA KEIJI ,  FUJIMOTO KEIICHI

IPC: H01L23/28 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a lead frame for forming an LOC package with high reliability by making it possible to incorporate a semiconductor chip of large area in a standardized volume. SOLUTION: Connecting leads 3 extended from a lead frame body side to a semiconductor chip mounting area Retr side and support leads 4 are formed on the unit part for mounting the chip of a lead frame 10. A movable part 5 and spring 6A for elastically supporting the part 5 are provided between the leads 4 and the body. The end 4a of the lead 4 connected to the part 5 is extended inward of the area Retr in a natural state, and at the time of mounting the chip, the chip can be supported and fixed by the spring 6A in contact with the side of the chip. The stress or increase of the volume does not occur at a package without retaining the base end of the lead 4, the part 5 and the spring 6A in the package.

公开(公告)号：JPH03230556A

公开(公告)日：1991-10-14

申请号：JP2651390

申请日：1990-02-06

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO

IPC: H01L21/60 ,  H01L23/50

Abstract: PURPOSE:To prevent punching of corners, failure in adhesion, and deformation or sagging of a wire by mechanically flattening a tip of an inner lead of a lead frame to increase its area. CONSTITUTION:An area of the tip is increased by mechanically processing a tip of an inner lead 1 of a lead frame for a semiconductor device to have it flattened 1a. By thus increasing the area of the tip by means of flattening the tip of the inner lead 1 with respect to the lead frame etching-molded, a width of the inner lead to be required for wire bonding can be secured, and good wire bonding is possible since a long wire is not necessary.

公开(公告)号：JPH03222440A

公开(公告)日：1991-10-01

申请号：JP1836290

申请日：1990-01-29

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO ,  ITO YASUO

IPC: H01L21/56

Abstract: PURPOSE:To provide a semiconductor device sealed with resin having fewer voids by using a molding material of resin in the shape of a hollow cylinder rather than a solid cylinder. CONSTITUTION:Resin shaped in a hollow cylinder is used for molding so that it may be melted uniformly as opposed to the shape of a solid cylinder. Such resin in a pot is melted uniformly in both the inner and outer parts and introduced to a cavity without big bubbles. Therefore, a semiconductor device can be sealed with resin having fewer voids.

公开(公告)号：JPH03220760A

公开(公告)日：1991-09-27

申请号：JP1554590

申请日：1990-01-25

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO

IPC: H01L23/50

Abstract: PURPOSE:To make it hard to generate a resin crack while improving solder heat resistance by using a lead frame die pad, in which the rear peripheral part to be a starting point of a resin crack is smoothly tapered. CONSTITUTION:The subject resin sealing type semiconductor device has a semiconductor chip 3 fixed to a lead frame die pad 2 and a connection wire 1 for electrically connecting a lead frame inner lead 4 while a lead frame die pad rear peripheral part 5 is all over sealed by resin 6. In this case, the lead frame die pad rear peripheral part to be used is smoothly tapered. Thereby, no concentration is generated so as to bring about a state of being hard to generate a resin crack thus to improve solder heat resistance of a resin sealing type semiconductor device.