公开(公告)号：JP2000133748A

公开(公告)日：2000-05-12

申请号：JP30385798

申请日：1998-10-26

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKADA TAKASHI ,  OCHI TAKAO ,  NARAOKA HIROKI ,  HONMA FUTOSHI ,  MAEDA KENJI

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To surely ensure planarity of the lower surface of a wiring board by preventing the adhesion of a sealing resin to the lower surface, even through a resin package is provided on the side faces of the wiring board. SOLUTION: A semiconductor chip 102 is bonded to the upper surface of a hard wiring board 100A via an adhesive layer 101, and the electrode pads in the peripheral edge section of the chip 102 are connected electrically to the connecting electrodes in the peripheral edge section of the board 100A through bonding wires 103. On the lower surface of the board 100A, land-like outside connecting terminals 105A or ball-like outside connecting terminals 105B are formed. The terminals 105A or 105B are connected electrically to the connecting electrodes of the board 100A. The semiconductor chip 102, bonding wires 103, and the upper surface and side faces of the wiring board 100A are covered with a resin package 104, but the lower sections of the side faces of the board 100A are not covered with the package 104.

公开(公告)号：JPH09186286A

公开(公告)日：1997-07-15

申请号：JP12996

申请日：1996-01-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OCHI TAKAO ,  FUNAKOSHI HISASHI ,  OKUMURA ICHIRO ,  HONMA FUTOSHI ,  OKUMA KEIJI ,  FUJIMOTO KEIICHI

IPC: H01L23/28 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a lead frame for forming an LOC package with high reliability by making it possible to incorporate a semiconductor chip of large area in a standardized volume. SOLUTION: Connecting leads 3 extended from a lead frame body side to a semiconductor chip mounting area Retr side and support leads 4 are formed on the unit part for mounting the chip of a lead frame 10. A movable part 5 and spring 6A for elastically supporting the part 5 are provided between the leads 4 and the body. The end 4a of the lead 4 connected to the part 5 is extended inward of the area Retr in a natural state, and at the time of mounting the chip, the chip can be supported and fixed by the spring 6A in contact with the side of the chip. The stress or increase of the volume does not occur at a package without retaining the base end of the lead 4, the part 5 and the spring 6A in the package.