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公开(公告)号:JP2000294554A
公开(公告)日:2000-10-20
申请号:JP2000066646
申请日:2000-03-10
Applicant: MOTOROLA INC
Inventor: YU ZHIYI , DROOPAD RAVINDRANATH , OVERGAARD COREY DANIEL , RAMDANI JAMAL , CURLESS JAY A , HALLMARK JERALD ALLEN , OOMS WILLIAM J , WANG JUN
IPC: H01L41/24 , C30B23/02 , C30B25/02 , H01L21/203 , H01L21/316
Abstract: PROBLEM TO BE SOLVED: To provide the manufacture of a thin stable crystalline interface to silicon. SOLUTION: This method is for manufacturing of a semiconductor substrate by preparing a silicon substrate 10 having a surface, and forming interface 14 consisting of silicon, oxygen, and a metal on the surface of the silicon substrate, and forming one or more single crystalline oxide layer on the interface 14. This interface consists of the atomic layer of silicon oxygen, and a metal expressed by the formula XSiO2, where X represents a metal.
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公开(公告)号:SG101423A1
公开(公告)日:2004-01-30
申请号:SG200003946
申请日:2000-07-14
Applicant: MOTOROLA INC
Inventor: YU ZHIYI , DROOPAD RAVINDRANATH , OVERGAARD COREY DANIEL , RAMDANI JAMAL , CURLESS JAY A , HALLMARK JERALD A , OOMS WILLIAM J , WANG JUN
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公开(公告)号:SG140094G
公开(公告)日:1995-01-13
申请号:SG140094
申请日:1994-09-30
Applicant: MOTOROLA INC
Inventor: CURLESS JAY A , KRAMER GARY D , TSUI RAYMOND K , PEFFLEY MARILYN S , RODE DANIEL L
IPC: C30B25/18
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公开(公告)号:HK1043246A1
公开(公告)日:2002-09-06
申请号:HK02104063
申请日:2002-05-31
Applicant: MOTOROLA INC
Inventor: YU ZHIYI , DROOPAD RAVINDRANATH , OVERGAARD COREY D , RAMDANI JAMAL , CURLESS JAY A , HALLMARK JERALD A , COMS WILLIAM J , WANGJUN
IPC: C30B20060101 , C30B25/00 , H01L20060101 , H01L21/00 , H01L21/20 , H01L , C30B
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公开(公告)号:HK14095A
公开(公告)日:1995-02-10
申请号:HK14095
申请日:1995-02-06
Applicant: MOTOROLA INC
Inventor: CURLESS JAY A , KRAMER GARY D , TSUI RAYMOND K , PEFFLEY MARILYN S , RODE DANIEL L
IPC: H01L21/203 , C30B23/02 , H01L21/26 , C30B25/18
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公开(公告)号:DE3685245D1
公开(公告)日:1992-06-17
申请号:DE3685245
申请日:1986-03-27
Applicant: MOTOROLA INC
Inventor: CURLESS JAY A , KRAMER GARY D , TSUI RAYMOND K , PEFFLEY MARILYN S , RODE DANIEL L
IPC: H01L21/203 , C30B23/02 , H01L21/26 , C30B25/18
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