Abstract:
Un ensamble (80) de substrato de capas multiples incluye por lo menos un componente embebido (52) dentro de una pluralidad de substratos pre-procesados apilados. Cada substrato pre-procesado puede tener un dielectrico central (14), superficies conductoras (12 y 16) con un patron determinado en costados opuestos del dielectrico central, y por lo menos un orificio (18) en cada uno de por lo menos dos substratos pre-procesados apilados de manera adyacente de modo tal que por lo menos dos orificios se alinean substancialmente unos sobre otros formando un solo orificio (19). El ensamble incluye ademas una capa adhesiva procesada (48) entre las superficies superior e inferior de los substratos pre-procesados respectivos. El componente embebido se coloca en el orificio individual y forma una abertura (67 y 66) entre el componente embebido y una pared periferica del orificio individual. Cuando se inclina el ensamble, la capa adhesiva procesada llena la abertura a fin de formar el ensamble que tiene el componente embebido que corta transversalmente la pluralidad de substratos pre-procesados.
Abstract:
A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within the apparatus casing for providing at least one function to the electronic host product, and an interface (255) on the apparatus casing for enabling the at least one function to operate in conjunction with the electronic product. The apparatus casing can be made of recyclable products and the interface can form a portion of the circuitry within the apparatus casing. In one embodiment, the electronic host device can be a phone and the circuitry can provide any number of functions including the function of charging a power source within the phone.
Abstract:
A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.
Abstract:
An adaptable keypad or button utilizes a display laminate made up of a driving layer (108), an electrically active ink layer (110), and a transparent conductor layer (112). In a preferred embodiment, the display laminate is placed between a switch (302, 303, 304) and an actuating member. The driving layer has a series of symbols or characters created by conductor patterns (202, 204, 208, 210) in the shape of the symbols or characters. Some of the conductor segments are used exclusively by one character, some are used exclusively by another character, and some may be common to both characters. The conductors making up the desired character or symbol to be displayed are electrically energized, causing a corresponding pattern in the electrically active ink layer to appear. If the character or symbol needs to be changed to the alternate symbol on the button, then the first character image is erased from the active ink, and the second conductor set is electrically energized to form an image of the second character in the active ink.