公开(公告)号：EP0351851A3

公开(公告)日：1991-11-06

申请号：EP89113348.0

申请日：1989-07-20

Applicant: Microelectronics and Computer Technology Corporation

Inventor： MacKay, Colin Alan

IPC: H01R9/07

CPC classification number: H01R12/62 ,  H01L21/486 ,  H01R12/714 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/064 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49169 ,  Y10T29/49222

Abstract: A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositing electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

公开(公告)号：EP0351851A2

公开(公告)日：1990-01-24

申请号：EP89113348.0

申请日：1989-07-20

Applicant: Microelectronics and Computer Technology Corporation

Inventor： MacKay, Colin Alan

IPC: H01R9/07

CPC classification number: H01R12/62 ,  H01L21/486 ,  H01R12/714 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/064 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49169 ,  Y10T29/49222

Abstract: A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositing electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

Abstract translation: 一种用于制造用于电子部件的堆叠之间的连接的柔性互连的方法和装置。 该方法包括通过柔性绝缘材料形成多个孔，将导电金属螺柱沉积到从弹性材料的至少一个侧面，优选两侧延伸的孔中，并且通过互连将一些导电金属螺柱电互连 由柔性材料支撑。 互连可以从柔性材料的外部支撑或嵌入其中。 虚拟螺柱可以设置在延伸到外部的柔性材料中，并且与连接到电互连的绝缘材料的另一侧上延伸的螺柱对准。