Abstract:
Disclosed is a method for analyzing the composition of a microscopic particle (100) resting on a first sample surface (110). The method comprises positioning a micro-manipulator probe (120) near the particle; attaching the particle to the probe (120); moving the probe (120) and the attached particle (100) away from the first sample surface (110); positioning the particle on a second sample surface (150); and, analyzing the composition of the particle on the second sample surface (150) by energy-dispersive X-ray analysis or detection of Auger electrons. The second surface (150) has a reduced or non-interfering background signal during analysis relative to the background signal of the first surface (110). Also disclosed are methods for adjusting potentials after its transfer and relocation to the second sample surface (150).
Abstract:
We disclose an apparatus and method for detecting probe-tip (120) contact with a surface, generally inside a focused ion-beam instrument, where the probe tip (120) is attached to a capsule (130), and the capsule (130) is movably secured in a probe shaft (140). There is a fiber-optic cable (150) having a first end and a second end; a beam splitter (115) having first and second output ports; and a light source (100) connected to the beam splitter (115). The first output port of the beam splitter (115) is connected to the first end of the fiber-optic cable (150), and the second output port of the beam splitter (115) is connected to a photodiode (110). The second end of the fiber-optic cable (150) has a mirror (155) for reflecting incident light at approximately a ninety-degree angle to the axis of the optical path in the fiber-optic cable (150) and onto the capsule (130), so that the intensity of the light reflected back from the capsule (130) through the fiber-optic cable (150) is proportional to the deflection of the capsule (130) as the probe tip (120) makes contact with the surface.
Abstract:
When a desired portion (110) is separated from an integrated circuit chip or a semiconductor wafer (100), the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam (160). Prior to separation, the sample is fixed to a micromanipulator probe (120). The sample is moved by the probe to the location for examination and fixed there. The probe is then detached form the sample by the focused ion-beam.
Abstract:
An apparatus for performing automated in-situ lift-out of a sample (150) from a specimen (125) includes a computer (100) having a memory with computer-readable instructions, a stage (120) for a specimen (125) and a nano-manipulator (130). The stage (120) and the nano-manipulator (130) are controlled by motion controllers (110) connected to the computer (100). The nano-manipulator (130) has a probe tip (140) for attachment to samples (150) excised from the specimen (125). The computer-readable instructions include instructions to cause the stage motion controllers (110) and the nano-manipulator motion controllers (110), as well as an ion-beam source (170), to automatically perform in-situ lift-out of a sample (150) from the specimen (125).
Abstract:
An apparatus for testing flip-chip packages has a programmed computer (100), a test-engine stage (130) for applying an impact to at least one package (110) under test, and a monitoring stage (140). The test-engine stage (130) causes an impact on the package (110) on the side opposite its ball-grid array. The test-engine stage (130) has actuators connected to the test-engine stage (130) and the computer (100), for moving and aligning the test-engine stage (130). The monitoring stage (140) has a digital camera (300) connected to the computer (100) for transmitting digital images from the ball-grid array side of the package (110) to the computer (100). A microscope (290) is preferably connected to the digital camera (300). A sample stage (120) located between the test-engine stage (130) and the monitoring stage (140) holds the package (110 under test. The sample stage (120) has an acoustic transducer (190) capable of being removably connected to the package (110) under test. The acoustic transducer (190) is connected to the computer (100) for transmitting signals from the acoustic transducer (190) to the computer (100).