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1.发明申请公开(公告)号：US20180199431A1
公开(公告)日：2018-07-12
申请号：US15740378
申请日：2016-05-20
Applicant: OSRAM GmbH
Inventor： Michael Schoewel , Peter Helbig , Jozsef Szekely , Sven Seifritz
CPC classification number: H05K1/0296 , F21S41/19 , F21V21/00 , H05K1/181 , H05K3/0014 , H05K3/202 , H05K3/4092 , H05K13/0069 , H05K2201/0367 , H05K2201/0397 , H05K2201/09063 , H05K2201/09118 , H05K2201/10113 , H05K2201/10318 , H05K2203/166
Abstract: Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. The circuit support may include at least one fastening aid that is formed from the material for the insulating matrix and/or from the material of the at least one conductor.
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公开(公告)号：US20150247606A1
公开(公告)日：2015-09-03
申请号：US14633178
申请日：2015-02-27
Applicant: OSRAM GmbH
Inventor： Berthold Gerlach , Jozsef Szekely , Oliver Woisetschlaeger , Sven Seifritz , Tobias Kohler , Peter Niedermeier , Dirk Amsbeck
CPC classification number: F21S43/195 , F21K9/232 , F21S43/14 , F21S45/47 , F21S45/49 , F21V23/001 , F21V29/70 , F21V29/767 , F21Y2115/10
Abstract: In various embodiments, a lamp is provided. The lamp may include a mounting board; at least one semiconductor light source arrangement arranged on the mounting board and comprising a base, which is provided with base contacts for supplying energy to the at least one semiconductor light source arrangement and which is compatible with a standardized incandescent lamp base; and at least one insulation displacement contact to make electrical contact with the at least one semiconductor light source arrangement.
Abstract translation: 在各种实施例中，提供灯。 灯可以包括安装板; 至少一个半导体光源装置，其布置在所述安装板上并且包括基座，所述基座设置有用于向所述至少一个半导体光源装置提供能量并且与标准化白炽灯基座兼容的基座触点; 以及至少一个绝缘位移触点，以与所述至少一个半导体光源装置电接触。
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3.发明申请公开(公告)号：US20180192507A1
公开(公告)日：2018-07-05
申请号：US15736802
申请日：2016-05-18
Applicant: OSRAM GmbH
Inventor： Michael Schöwel , Peter Helbig , Jozsef Szekely , Sven Seifritz
CPC classification number: H05K1/0204 , F21S41/192 , H05K1/0203 , H05K1/0373 , H05K1/181 , H05K3/0014 , H05K3/0061 , H05K3/02 , H05K3/202 , H05K3/284 , H05K3/4644 , H05K2201/0104 , H05K2201/0224 , H05K2201/068 , H05K2201/10106 , H05K2201/10113 , H05K2201/2036
Abstract: A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. The circuit support may further include a large number of spacers which are designed and arranged in order to set a height of the second region. The circuit support may further include a second insulation material with which the second region is filled.
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公开(公告)号：US09829158B2
公开(公告)日：2017-11-28
申请号：US14633178
申请日：2015-02-27
Applicant: OSRAM GmbH
Inventor： Berthold Gerlach , Jozsef Szekely , Oliver Woisetschlaeger , Sven Seifritz , Tobias Kohler , Peter Niedermeier , Dirk Amsbeck
CPC classification number: F21S43/195 , F21K9/232 , F21S43/14 , F21S45/47 , F21S45/49 , F21V23/001 , F21V29/70 , F21V29/767 , F21Y2115/10
Abstract: In various embodiments, a lamp is provided. The lamp may include a mounting board; at least one semiconductor light source arrangement arranged on the mounting board and comprising a base, which is provided with base contacts for supplying energy to the at least one semiconductor light source arrangement and which is compatible with a standardized incandescent lamp base; and at least one insulation displacement contact to make electrical contact with the at least one semiconductor light source arrangement.
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