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8 records (took 0.026 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE19964252A1

    公开(公告)日：2002-06-06

    申请号：DE19964252

    申请日：1999-12-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： JAEGER HARALD ,  BRUNNER REINHOLD ,  HOEHN KLAUS

    IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00

    Abstract: A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

    2.
    发明专利
    未知

    公开(公告)号：DE19963806A1

    公开(公告)日：2001-07-19

    申请号：DE19963806

    申请日：1999-12-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： JAEGER HARALD ,  BRUNNER REINHOLD ,  HOEHN KLAUS

    IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00 ,  B32B27/38

    Abstract: The invention concerns a surface mountable light diode light source, whereby the curvature of the leadframe required for surface mounting faces the rear side of the housing inside a transparent plastic shaped body. The invention also concerns a method for the production of a mixed light source, preferably a white light source based on a UV or blue emitting semiconductor LED (1), wherein the LED (1) is mounted on a leadframe (10), a transparent plastic molding compound (3) is mixed with a conversion material (4) and optionally other filling materials with the purpose of forming a molded compound and the leadframe (10) is reshaped with the molded compound in an injection process in such a way that the light exit sides of the LED (1) are surrounded by the molded compound.

    6.
    发明专利
    未知

    公开(公告)号：DE19963806C2

    公开(公告)日：2002-02-07

    申请号：DE19963806

    申请日：1999-12-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： JAEGER HARALD ,  BRUNNER REINHOLD ,  HOEHN KLAUS

    IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00

    Abstract: A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

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