公开(公告)号：JP2005136438A

公开(公告)日：2005-05-26

申请号：JP2005009629

申请日：2005-01-17

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： HOEHN KLAUS ,  WAITL GUENTER

IPC: B23K1/00 ,  B23K101/36 ,  H01L23/00 ,  H01L23/12 ,  H01L31/02 ,  H01L33/38 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

CPC classification number: H05K3/3442 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05599

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, in which the adherence of soldering dregs is fully prevented on the side of the component package, which needs to be prevented from being soldered.
SOLUTION: A plastic package 14 or only a part of the plastic package having at least one metal soldering region 4 of the electronic component 1, is coated by a solder adhesion preventing layer 6, which mainly has siloxane, and is fixed on the plastic package 14 in the form of a solution without another solvent additive.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种电子部件的制造方法，其中在组件封装的侧面上完全防止了焊料的粘附，需要防止焊接。 解决方案：塑料封装14或仅具有电子部件1的至少一个金属焊接区域4的塑料封装的一部分被主要具有硅氧烷的焊料防粘附层6涂覆并固定在 无溶剂添加剂的溶液形式的塑料包装14。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：WO2015082498A3

公开(公告)日：2015-07-30

申请号：PCT/EP2014076307

申请日：2014-12-02

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  HAIBERGER LUCA ,  WICKE MARKUS

IPC: H01C7/10 ,  H01C7/105 ,  H01C17/065 ,  H01C17/16

CPC classification number: H01C7/1006 ,  H01C7/10 ,  H01C7/105 ,  H01C17/0652 ,  H01C17/06526 ,  H01C17/06586 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/62 ,  H01L2224/2929 ,  H01L2224/29291

Abstract: The invention relates to a varistor paste comprising a matrix material and particles embedded in the matrix material. Said matrix material has a viscosity of less than 0,8 Pa.s without the embedded particles. Said embedded particles comprise varistor particles.

Abstract translation: 变阻器包括基质材料和基质材料嵌入的颗粒。 如果没有嵌入的颗粒，所述基质材料到小于0.8帕的粘度。 嵌入的颗粒包含变阻器。

公开(公告)号：WO2011039071A3

公开(公告)日：2011-08-25

申请号：PCT/EP2010063813

申请日：2010-09-20

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HOEHN KLAUS

Inventor： HOEHN KLAUS

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/60 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic, especially an optical or optoelectronic component is disclosed that comprises a part (6) containing a thermoplastic material (5) which has particles (1) including a core and a shell. The shell is arranged on the surface of the core, and the core contains aluminum.

Abstract translation: 电子，在特定的光学或光电，组分，其包含（6）包含热塑性组分（5），其颗粒（1），其包括芯和壳，所述壳被设置在所述芯的表面上，和 其中，所述芯包括铝。

公开(公告)号：WO0186730A3

公开(公告)日：2002-06-27

申请号：PCT/DE0101820

申请日：2001-05-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HOEHN KLAUS ,  SORG JOERG

Inventor： HOEHN KLAUS ,  SORG JOERG

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: The aim of the invention is to fix an optical lens above an optoelectronic transmitter or receiver. To this end, an epoxy resin, which is cationically hardened in a UV-initiated or light-initiated manner, is used with the aid of which the bonding joint hardens within a few seconds and can be thus be fixed. The invention also relates to the use of resin compositions as an adhesive. Said resin compositions can be applied as a liquid, are optically adapted, and are optimized for the durable and reliable use in optoelectronic components and for the large-scale manufacture thereof.

Abstract translation: 对于光学透镜固定到一个光电发射器或接收器中，建议使用一个UV或光引发阳离子固化环氧树脂，借助于该接头可以在几秒钟内固化，从而固定。 此外，对于使用液态树脂施用的组合物被提议作为一种粘合剂，其被光学调整和用于在光电器件永久安全使用和它们的大规模生产进行了优化。

公开(公告)号：DE10023353A1

公开(公告)日：2001-11-29

申请号：DE10023353

申请日：2000-05-12

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SORG JOERG ,  HOEHN KLAUS

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58 ,  H01L33/00 ,  B29C65/02 ,  B32B7/12 ,  F21S8/10

Abstract: The aim of the invention is to fix an optical lens above an optoelectronic transmitter or receiver. To this end, an epoxy resin, which is cationically hardened in a UV-initiated or light-initiated manner, is used with the aid of which the bonding joint hardens within a few seconds and can be thus be fixed. The invention also relates to the use of resin compositions as an adhesive. Said resin compositions can be applied as a liquid, are optically adapted, and are optimized for the durable and reliable use in optoelectronic components and for the large-scale manufacture thereof.

公开(公告)号：DE19963806A1

公开(公告)日：2001-07-19

申请号：DE19963806

申请日：1999-12-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  BRUNNER REINHOLD ,  HOEHN KLAUS

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00 ,  B32B27/38

Abstract: The invention concerns a surface mountable light diode light source, whereby the curvature of the leadframe required for surface mounting faces the rear side of the housing inside a transparent plastic shaped body. The invention also concerns a method for the production of a mixed light source, preferably a white light source based on a UV or blue emitting semiconductor LED (1), wherein the LED (1) is mounted on a leadframe (10), a transparent plastic molding compound (3) is mixed with a conversion material (4) and optionally other filling materials with the purpose of forming a molded compound and the leadframe (10) is reshaped with the molded compound in an injection process in such a way that the light exit sides of the LED (1) are surrounded by the molded compound.

公开(公告)号：DE19945131A1

公开(公告)日：2001-04-12

申请号：DE19945131

申请日：1999-09-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  WAITL GUENTHER

IPC: B23K1/00 ,  B23K101/36 ,  H01L23/00 ,  H01L23/12 ,  H01L31/02 ,  H01L33/38 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34 ,  H01L23/28 ,  H01L33/00 ,  H01L23/482

Abstract: The invention relates to an electronic component comprising, in predetermined areas, soldered regions that are arranged on at least one outer surface, whereby the component is coated on its surface that is not formed by the soldered regions with a layer that prevents the adherence of soldering agents thereto. The invention also relates to a coating agent for reducing the amount of solder tailings.

公开(公告)号：DE59713056D1

公开(公告)日：2011-03-31

申请号：DE59713056

申请日：1997-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DEBRAY ALEXANDRA ,  HOEHN KLAUS ,  SCHLOTTER PETER ,  SCHMIDT RALF ,  SCHNEIDER JUERGEN

IPC: F21V5/04 ,  B29C39/02 ,  H01L33/00 ,  B29K63/00 ,  B29K105/16 ,  C08K3/22 ,  C08K3/30 ,  C08K7/00 ,  C08K9/00 ,  C08L63/00 ,  C09K11/00 ,  C09K11/08 ,  C09K11/62 ,  C09K11/64 ,  C09K11/77 ,  C09K11/79 ,  C09K11/80 ,  F21V9/16 ,  F21Y101/02 ,  H01L23/29 ,  H01L23/31 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01S5/32 ,  H05B33/04 ,  H05B33/12

公开(公告)号：DE102005061828A1

公开(公告)日：2007-01-04

申请号：DE102005061828

申请日：2005-12-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  BRUNNER HERBERT

IPC: C09D5/33 ,  C08K3/34 ,  C09B63/00 ,  C09K9/00 ,  C09K19/60 ,  H01L33/50

Abstract: Disclosed is a wavelength-converting converter material comprising at least one wavelength-converting phosphor comprising phosphor particles, wherein a portion of said phosphor or all of said phosphor is present in the form of nanoparticles. Also disclosed is a light-emitting optical component comprising such a converter material and a method for producing such components.

公开(公告)号：DE59708820D1

公开(公告)日：2003-01-09

申请号：DE59708820

申请日：1997-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  DEBRAY ALEXANDRA ,  SCHLOTTER PETER ,  SCHMIDT RALF ,  SCHNEIDER JUERGEN

IPC: B29C39/02 ,  B29K63/00 ,  F21V5/04 ,  B29K105/16 ,  C08K3/22 ,  C08K3/30 ,  C08K7/00 ,  C08K9/00 ,  C08L63/00 ,  C09K11/00 ,  C09K11/08 ,  C09K11/62 ,  C09K11/64 ,  C09K11/77 ,  C09K11/79 ,  C09K11/80 ,  F21V9/16 ,  F21Y101/02 ,  H01L23/29 ,  H01L23/31 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01S5/32 ,  H05B33/04 ,  H05B33/12 ,  H01L33/00

Abstract: A light-emitting semiconductor device has (a) a semiconductor body (1) with a layer sequence (7) capable of emitting electromagnetic radiation of a first wavelength range in the UV, blue and/or green region; and (b) a luminescence conversion element which converts radiation of the first wavelength range to radiation of one or more second, different wavelength ranges so that the device emits mixed radiation in the first and second wavelength ranges. Preferably, the luminescence conversion element consists of organic dye molecules in a plastic matrix preferably of silicone, thermoplastic or thermosetting material, especially an epoxide resin or polymethyl methacrylate matrix, and/or an inorganic phosphor (preferably a Ce-doped garnet, especially Ce:YAG) in an epoxide resin or low melting point inorganic glass matrix.