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    1.
    发明专利
    未知

    公开(公告)号：DE60232572D1

    公开(公告)日：2009-07-23

    申请号：DE60232572

    申请日：2002-10-17

    Applicant: PANASONIC CORP

    Inventor： ASAHI TOSHIYUKI ,  SUGAYA YASUHIRO ,  KOMATSU SHINGO ,  NAKATANI SEIICHI ,  YAMAMOTO YOSHIYUKI

    IPC: H01L25/065 ,  H01L21/60 ,  H01L21/98 ,  H01L23/538 ,  H01L25/16 ,  H05K1/18

    Abstract: A component built-in module includes an insulating layer (101), wirings (102, 106) integrated with both surfaces of the insulating layer (101), a via (103) connecting the wirings (102, 106), and one or more components (104) selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings (102, 106) is configured with a wiring (106) formed on a surface of a wiring board (109), and the components (104) embedded inside of the insulating layer (101) are mounted on and integrated with the wiring board (109) before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.

    2.
    发明专利
    未知

    公开(公告)号：DE60226111T2

    公开(公告)日：2009-05-28

    申请号：DE60226111

    申请日：2002-02-26

    Applicant: PANASONIC CORP

    Inventor： MAEKAWA TOMOYA ,  SUGAYA YASUHIRO ,  YAMADA TORU ,  ISHIZAKI TOSHIO

    IPC: H01P1/203 ,  H01P1/213 ,  H01P11/00

    Abstract: A dielectric filter includes resonator electrodes, an inter-stage coupling capacitor electrode, and an input/output coupling capacitor electrode on dielectric substrates, respectively. The resonator electrodes are electro-magnetically coupled to each other to form a tri-plate structure, are made of a metallic foil embedded in a resonator dielectric substrate. Another dielectric filter includes an upper shield electrode dielectric substrate, an inter-stage coupling capacitor dielectric substrate, a resonator dielectric substrate, and an input/output coupling capacitor dielectric substrate which are made of a composite dielectric material including a high-dielectric-constant material and a low-dielectric-constant material. The above described arrangement provides the dielectric filter with an improved Q factor of a resonator, a low loss, and a high attenuation.

    4.
    发明专利
    未知

    公开(公告)号：DE60327962D1

    公开(公告)日：2009-07-30

    申请号：DE60327962

    申请日：2003-04-02

    Applicant: PANASONIC CORP

    Inventor： IWAKI HIDEKI ,  TAGUCHI YUTAKA ,  OGURA TETSUYOSI ,  SUGAYA YASUHIRO ,  ASAHI TOSHIYUKI ,  NISHIYAMA TOUSAKU ,  IDOGAWA YOSHINOBU

    IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/10 ,  H01L23/12 ,  H01L23/34 ,  H01L23/552 ,  H01L25/00 ,  H05K1/18

    Abstract: A semiconductor built-in millimeter-wave band module includes: an insulating substrate (105) made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate (103) made of a dielectric material having thermal conductivity higher than the insulating substrate (105) and laminated on one surface of the insulating substrate (105); a plurality of wiring patterns (119) formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device (101) operating at millimeter-wave band, which is arranged inside of the insulating substrate (105), is packaged on the high thermal conductivity substrate (103) in a face-up manner, and is connected electrically with the wiring patterns (119); and a distributed constant circuit element (121) and an active element (124) provided on the semiconductor device (101). In this module, a void (107) is provided inside of the insulating substrate (105) and in the vicinity of a surface of the distributed constant circuit element (121) and the active element (124). With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.

    Electronic component package and manufacturing method of the same
    7.
    发明专利
    Electronic component package and manufacturing method of the same 有权
    电子元件封装及其制造方法

    公开(公告)号：JP2013123071A

    公开(公告)日：2013-06-20

    申请号：JP2013012824

    申请日：2013-01-28

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： KASHIWAGI TAKAFUMI ,  SUGAYA YASUHIRO ,  TAKAYAMA RYOICHI ,  TAKANO ATSUSHI ,  FURUKAWA MITSUHIRO

    IPC: H01L23/02 ,  H01L23/04 ,  H03H3/08 ,  H03H9/25

    CPC classification number: H01L2924/16235

    Abstract: PROBLEM TO BE SOLVED: To propose new package structure and a manufacturing method which can achieve both of package thinning and high reliability in an electronic component package where a hollow part is formed and sealed on a functional element.SOLUTION: A resin layer 4 provided with space on a functional region 2 and a metal layer are stacked. The metal layer is formed so that the same material is separated into a portion 6 forming a lid having a projection for covering the space and supporting external pressure and a portion 7 forming an external terminal. After plating the entire surface so as to fill a space part and a patterned upper resin layer 9 that is provided on lower-layer resin 4 with a through hole 8 formed, the same structure can be easily obtained by cutting into predetermined thickness.

    Abstract translation: 要解决的问题：提出一种能够实现在功能元件上形成和密封中空部件的电子部件封装中的封装薄化和高可靠性的新封装结构和制造方法。 解决方案：在功能区域2和金属层上设置空间的树脂层4被堆叠。 形成金属层，使得相同的材料分离成形成具有用于覆盖空间和支撑外部压力的突起的盖的部分6和形成外部端子的部分7。 在整个表面上电镀以填充形成有通孔8的空间部分和设置在下层树脂4上的图案化的上部树脂层9之后，通过切割成预定厚度可以容易地获得相同的结构。 版权所有（C）2013，JPO＆INPIT

    Component built-in substrate and method of manufacturing the same
    8.
    发明专利
    Component built-in substrate and method of manufacturing the same 审中-公开
    组件内置衬底及其制造方法

    公开(公告)号：JP2012033879A

    公开(公告)日：2012-02-16

    申请号：JP2011105967

    申请日：2011-05-11

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： SUGAYA YASUHIRO ,  KITAE TAKASHI ,  HASHIMOTO AKIRA ,  ECHIGO FUMIO

    IPC: H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To solve such a problem that the shape of a conductive via may be distorted significantly due to resin flow when a component is built in and thereby electrically stable via connection is not obtained, and a copper foil to be connected with the conductive via must satisfy the requirements of soldering.SOLUTION: A component built-in substrate 101 has a multilayer substrate 115 where a first insulation layer 102 and a second insulation layer 105 are laminated, a circuit component 112 mounted on a wiring pattern 111 on the inner layer side of the first insulation layer 102 which is the outermost layer of the multilayer substrate 115, and a housing section 114 which houses the circuit component 112. The space between the circuit component 112 and the multilayer substrate 115 is filled with a hardened matter of a second hardening resin 106, and a via 109 is formed of a conductive paste 110. The via 109 is constituted of a first metal region principally comprising an intermetallic compound and covering the periphery of surface contact area of Cu particles so as to straddle that area, and a second metal region principally comprising Bi.

    Abstract translation: 解决的问题为了解决这样一个问题：导电通孔的形状可能由于树脂的流动而在构成内部并因而不能获得电连接的电气稳定性时可能会发生畸变，并且铜箔将被 与导电通孔连接必须满足焊接要求。 解决方案：组件内置基板101具有层叠第一绝缘层102和第二绝缘层105的多层基板115，安装在第一绝缘层102和第二绝缘层105的内层侧的布线图案111上的电路部件112 作为多层基板115的最外层的绝缘层102和容纳电路部件112的壳体部114.电路部件112与多层基板115之间的空间填充有第二硬化树脂106的硬化物 通孔109由导电膏110形成。通孔109由主要包含金属间化合物的第一金属区域构成，并覆盖Cu颗粒的表面接触面的周边以跨越该区域，第二金属 区域主要包含Bi。 版权所有（C）2012，JPO＆INPIT

    Wiring board having built-in electronic component
    9.
    发明专利
    Wiring board having built-in electronic component 审中-公开
    具有内置电子元件的接线板

    公开(公告)号：JP2009252761A

    公开(公告)日：2009-10-29

    申请号：JP2008094663

    申请日：2008-04-01

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： ISHITOMI HIROYUKI ,  FUJII TATSUO ,  SUGAYA YASUHIRO ,  HASHIGUCHI KATSUNORI

    IPC: H05K3/46 ,  H05K1/16

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board having a built-in electronic component, capable of improving an effect of removing a high-frequency noise flowing between positive electrode connection terminals while coping with high capacity of a capacitor, and thinning the board. SOLUTION: In the wiring board having a built-in electronic component, connection terminals each include: a positive electrode connection terminal electrically connected to a valve metal sheet body of a solid-state electrolytic capacitor at not less than two points via a wiring pattern and an inductor and/or a via electrode and/or a through electrode; and a negative electrode connection terminal electrically connected to a power collecting layer of the solid-state electrolytic capacitor via the wiring pattern and/or the inductor and/or the via electrode and/or the through electrode, wherein the wiring pattern has the inductor formed in a conductor pattern shape. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种具有内置电子部件的布线基板，能够提高除去在正电极连接端子之间流动的高频噪声的效果，同时应对电容器的高容量，并且减薄 董事会。 解决方案：在具有内置电子部件的布线板中，连接端子各自包括：正极连接端子，其通过经由一个或多个第二连接端子电连接到固态电解电容器的阀金属片体上 布线图案和电感器和/或通孔电极和/或通孔电极; 以及经由布线图案和/或电感器和/或通孔电极和/或贯通电极与固态电解电容器的集电层电连接的负极连接端子，其中布线图形具有形成的电感器 导体图案形状。 版权所有（C）2010，JPO＆INPIT

    Electronic component package and its manufacturing method
    10.
    发明专利
    Electronic component package and its manufacturing method 有权
    电子元器件及其制造方法

    公开(公告)号：JP2009043957A

    公开(公告)日：2009-02-26

    申请号：JP2007207585

    申请日：2007-08-09

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： KASHIWAGI TAKAFUMI ,  SUGAYA YASUHIRO ,  TAKAYAMA RYOICHI ,  TAKANO ATSUSHI ,  FURUKAWA MITSUHIRO

    IPC: H01L23/02 ,  H03H3/08 ,  H03H9/25

    Abstract: PROBLEM TO BE SOLVED: To propose a new package structure and a manufacturing method with respect to such a problem that package thinning and high reliability are not compatible with each other in an electronic component package with a hollow part formed and sealed on a functional element. SOLUTION: A resin layer provided with a space on a functional region and a metal layer are stacked. The metal layer is formed in such a manner that the same material is separated into a portion forming a lid having a projection for covering the space and supporting external pressure and a portion forming an external terminal. After plating the entire surface so as to fill the space part and the patterned upper resin layer that is provided on the lower-layer resin with a through hole formed, the same structure can be easily obtained by cutting into a predetermined thickness. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提出一种新的封装结构和制造方法，即在具有形成并密封在中空部件上的中空部件的电子部件封装中，封装变薄和高可靠性彼此不兼容的问题 功能元素 解决方案：层叠在功能区域和金属层上设置空间的树脂层。 金属层形成为将相同的材料分成形成具有用于覆盖空间并支撑外部压力的突起的盖的部分和形成外部端子的部分。 在整个表面上电镀以填充形成有通孔的空间部分和设置在下层树脂上的图案化的上树脂层之后，通过切割成预定厚度可以容易地获得相同的结构。 版权所有（C）2009，JPO＆INPIT

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