公开(公告)号：EP1631137A4

公开(公告)日：2009-05-27

申请号：EP05726702

申请日：2005-03-17

Applicant: PANASONIC CORP

Inventor： FUJIWARA JOJI ,  HIMORI TSUYOSHI ,  TSUNEOKA MICHIAKI

IPC: H05K9/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L23/29 ,  H01L23/552 ,  H01L2924/15159 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/09972 ,  H05K2201/10204

Abstract: On a board (11) of a module component, a mounting component (12) and a conductive divider (13) which divides a circuit block into at least two circuit blocks are mounted, a sealing body (14) for covering the circuit block is provided, and a conductive film (16) is provided on a surface of the sealing body (14). The module component is electrically shielded by every group of circuit blocks. The module component provides sufficient shielding effects without increasing the number of manufacturing processes, maintains bending strength and has a small warp.

公开(公告)号：EP1648028A4

公开(公告)日：2010-05-26

申请号：EP05737236

申请日：2005-04-28

Applicant: PANASONIC CORP

Inventor： TSUNEOKA MICHIAKI ,  SUGAYA YASUHIRO ,  KATSUMATA MASAAKI ,  FUJIWARA JOJI

IPC: H01L23/00 ,  H05K3/46 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4614 ,  H05K2201/0715 ,  H05K2203/061