Abstract:
PROBLEM TO BE SOLVED: To completely fill a resin in a cavity and to prevent a flash at a molding by deviating an inside end of an upper side half mold for forming a mold to an inside with respect to an inside end of a lower side half mold, and cooperating a spoiler of a lead frame to limit an opening dimension of a slit. SOLUTION: A semiconductor die 1 is assembled on a depressed central pad 2 of a lead frame 3 made of a metal, and sealed in a cavity 6 formed of both upper and lower half molds 4 and 5. Then, a slit 7 is formed at adjacent parts to the pad 2 and the frame 3, and a resin is charged in the cavity 6 from the slit 7. That is, one end 8 of the pad 2 is bent upward to form a deflecting plate and a spoiler, and the slit 7 is formed. An inside end of the mold 4 is deviated to the inside with respect to the inside end of the mold 5, and when the molds 4, 5 are connected, a size of the slit 7 is reduced. Thus, the resin can be completely charge din the cavity 6.
Abstract:
In a microfluidic assembly (20), a microfluidic device (1') is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (1'). The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10'), adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.