公开(公告)号：GB2395367A

公开(公告)日：2004-05-19

申请号：GB0406140

申请日：2002-10-25

Applicant: STAKTEK GROUP LP

Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H01L23/48 ,  H05K1/00

Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module (10) devised in accordance with a preferred embodiment of the present invention, a pair of CSPs (12, 14) is stacked, with one CSP (12) above the other (14). The two CSPs are connected with a pair of flexible circuit structures (30, 32). Each of the pair of flexible circuit structures (30, 32) is partially wrapped about a respective opposite lateral edge (20, 22) of the lower CSP (14) of the module (10). The flex circuit pair (30, 32) connects the upper and lower CSPs (12, 14) and provides a thermal and electrical path connection path between the module (10) and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing.

公开(公告)号：GB2395367B

公开(公告)日：2005-05-25

申请号：GB0406140

申请日：2002-10-25

Applicant: STAKTEK GROUP LP

Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H01L23/48 ,  H05K1/00

Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

公开(公告)号：HK1077460A1

公开(公告)日：2006-02-10

申请号：HK05109243

申请日：2005-10-22

Applicant: STAKTEK GROUP LP

Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

IPC: H01L20090101 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.