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公开(公告)号：JP2006074031A
公开(公告)日：2006-03-16
申请号：JP2005235451
申请日：2005-08-15
Applicant: Staktek Group Lp , スタクテック・グループ・エルピー
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS JR
IPC: H05K1/14 , G11C5/00 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/18 , H05K1/02 , H05K1/05 , H05K1/11 , H05K1/18 , H05K7/20
CPC classification number: H05K1/189 , G11C5/04 , H01L25/105 , H01L2224/16 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To provide a packaging technology which reduces an increase in packaging volume accompanied by an increase in capacity. SOLUTION: Each flexible circuit is arranged with integrated circuits (ICs) disposed along one or both of its major sides, and bent around the edge of a rigid thermally-conductive substrate, thus placing ICs on one or both sides of the substrate with one or two layers of ICs on one or both sides of the substrate. On the side of the flexible circuit closest to the substrate, ICs are disposed at least partially in places which are windows, pockets, or cutaway areas in the substrate. The substrate material can be removed to reduce a module profile. An extension of the substrate reduces a thermal module load and encourages reduction in thermal variation among the ICs of the module during operation. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种包装技术，其随着容量的增加而减少包装体积的增加。
解决方案：每个柔性电路布置有沿着其主要侧面中的一个或两个侧面设置的集成电路（IC），并且围绕刚性导热基板的边缘弯曲，从而将IC放置在基板的一侧或两侧 在衬底的一侧或两侧上具有一层或两层IC。 在靠近基板的柔性电路的一侧，IC至少部分地设置在基板中的窗口，凹穴或切口区域的位置。 可以去除衬底材料以减少模块轮廓。 衬底的延伸减少了热模块的负载，并且有助于在操作期间模块的IC之间的热变化减小。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：GB2395367A
公开(公告)日：2004-05-19
申请号：GB0406140
申请日：2002-10-25
Applicant: STAKTEK GROUP LP
Inventor： CADY JAMES W , WILDER JAMES , ROPER DAVID L , WEHRLY JAMES DOUGLAS , DOWDEN JULIAN , BUCHLE JEFF
IPC: H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36 , H01L23/48 , H05K1/00
Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module (10) devised in accordance with a preferred embodiment of the present invention, a pair of CSPs (12, 14) is stacked, with one CSP (12) above the other (14). The two CSPs are connected with a pair of flexible circuit structures (30, 32). Each of the pair of flexible circuit structures (30, 32) is partially wrapped about a respective opposite lateral edge (20, 22) of the lower CSP (14) of the module (10). The flex circuit pair (30, 32) connects the upper and lower CSPs (12, 14) and provides a thermal and electrical path connection path between the module (10) and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing.
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公开(公告)号：WO2006121489A3
公开(公告)日：2008-01-03
申请号：PCT/US2006007193
申请日：2006-02-28
Applicant: STAKTEK GROUP LP , CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
Inventor： CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
IPC: G11C8/00
CPC classification number: H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境 。
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公开(公告)号：GB2417836B
公开(公告)日：2009-08-26
申请号：GB0516622
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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公开(公告)号：GB2417836A
公开(公告)日：2006-03-08
申请号：GB0516622
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module 10 comprises a rigid substrate 14 having laterally opposed sides S1, S2 and a flexible circuit 12 wrapped around one edge 16A of the substrate. The flexible circuit is attached to at least one of the sides of the substrate and has a plurality of contacts 20 in the vicinity of the edge 16A for connection to a circuit board socket. A plurality of memory CSPs 18 (chipscale packaged devices) are provided on at least one of the sides of the flexible circuit. Also claimed are modules having thermally conductive properties and various shaped substrates.
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Patent Agency Ranking
公开(公告)号：GB2395367B
公开(公告)日：2005-05-25
申请号：GB0406140
申请日：2002-10-25
Applicant: STAKTEK GROUP LP
Inventor： CADY JAMES W , WILDER JAMES , ROPER DAVID L , WEHRLY JAMES DOUGLAS , DOWDEN JULIAN , BUCHLE JEFF
IPC: H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36 , H01L23/48 , H05K1/00
Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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公开(公告)号：GB2452880B
公开(公告)日：2009-07-29
申请号：GB0822085
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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公开(公告)号：HK1077460A1
公开(公告)日：2006-02-10
申请号：HK05109243
申请日：2005-10-22
Applicant: STAKTEK GROUP LP
Inventor： CADY JAMES W , WILDER JAMES , ROPER DAVID L , WEHRLY JAMES DOUGLAS , DOWDEN JULIAN , BUCHLE JEFF
IPC: H01L20090101 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36
Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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公开(公告)号：WO2007001505A2
公开(公告)日：2007-01-04
申请号：PCT/US2006006935
申请日：2006-02-27
Applicant: STAKTEK GROUP LP , CADY JAMES W , GOODWIN PAUL
Inventor： CADY JAMES W , GOODWIN PAUL
IPC: H05K1/14
CPC classification number: H05K1/189 , G11C5/04 , H01L23/5387 , H01L25/0652 , H01L25/105 , H01L2225/1005 , H01L2225/107 , H01L2924/0002 , H01L2924/3011 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/1056 , H05K2201/10674 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2924/00
Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。
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公开(公告)号：GB2453064A
公开(公告)日：2009-03-25
申请号：GB0822086
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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