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    Chip scale stacking system and method
    1.
    发明专利
    Chip scale stacking system and method 未知

    公开(公告)号：GB2395367A

    公开(公告)日：2004-05-19

    申请号：GB0406140

    申请日：2002-10-25

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

    IPC: H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H01L23/48 ,  H05K1/00

    Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module (10) devised in accordance with a preferred embodiment of the present invention, a pair of CSPs (12, 14) is stacked, with one CSP (12) above the other (14). The two CSPs are connected with a pair of flexible circuit structures (30, 32). Each of the pair of flexible circuit structures (30, 32) is partially wrapped about a respective opposite lateral edge (20, 22) of the lower CSP (14) of the module (10). The flex circuit pair (30, 32) connects the upper and lower CSPs (12, 14) and provides a thermal and electrical path connection path between the module (10) and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing.

    Circuit module for memory expansion
    2.
    发明专利
    Circuit module for memory expansion 未知

    公开(公告)号：GB2453064A

    公开(公告)日：2009-03-25

    申请号：GB0822086

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    STACKED MODULE SYSTEMS AND METHODS
    3.
    发明申请
    STACKED MODULE SYSTEMS AND METHODS 审中-公开
    堆叠模块系统和方法

    公开(公告)号：WO2007053523A3

    公开(公告)日：2007-10-04

    申请号：PCT/US2006042232

    申请日：2006-10-27

    Applicant: STAKTEK GROUP LP ,  PARTRIDGE JULIAN ,  WEHRLY JAMES DOUGLAS ,  ROPER DAVID L ,  VILLANI JOSEPH

    Inventor： PARTRIDGE JULIAN ,  WEHRLY JAMES DOUGLAS ,  ROPER DAVID L ,  VILLANI JOSEPH

    IPC: H01L23/52 ,  H01L25/065

    CPC classification number: H01L23/49833 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06579 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H05K3/305 ,  H05K2201/056 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2224/0401

    Abstract: The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to add ional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.

    Abstract translation: 本发明将集成电路封装堆叠到电路模块中。 在优选实施例中，分别将焊膏和主粘合剂施加到柔性电路上的选定位置。 补充粘合剂用于在柔性电路，CSP或其他组件上添加离子位置。 柔性电路和CSP彼此靠近。 在回流焊操作期间，施加力并且CSP朝柔性电路折叠，取代主粘合剂和辅助粘合剂。 补充粘合剂建立了为柔性电路提供额外支撑的粘合。 在另一个实施例中，CSP或其他集成电路封装通过粘合剂的组合彼此粘合或粘合到其他组件。 快速粘合粘合剂在组装期间保持粘合的封装和/或部件的对齐，并且结构粘合粘合剂为粘合提供额外的强度和/或结构完整性。

    Circuit module system and method
    4.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：GB2452880B

    公开(公告)日：2009-07-29

    申请号：GB0822085

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    A HIGH-DENSITY CIRCUIT MODULE
    5.
    发明专利
    A HIGH-DENSITY CIRCUIT MODULE 未知

    公开(公告)号：HK1077460A1

    公开(公告)日：2006-02-10

    申请号：HK05109243

    申请日：2005-10-22

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

    IPC: H01L20090101 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

    Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

    Circuit module system and method
    6.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：GB2417836B

    公开(公告)日：2009-08-26

    申请号：GB0516622

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    Circuit module for memory expansion
    7.
    发明专利
    Circuit module for memory expansion 未知

    公开(公告)号：GB2417836A

    公开(公告)日：2006-03-08

    申请号：GB0516622

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module 10 comprises a rigid substrate 14 having laterally opposed sides S1, S2 and a flexible circuit 12 wrapped around one edge 16A of the substrate. The flexible circuit is attached to at least one of the sides of the substrate and has a plurality of contacts 20 in the vicinity of the edge 16A for connection to a circuit board socket. A plurality of memory CSPs 18 (chipscale packaged devices) are provided on at least one of the sides of the flexible circuit. Also claimed are modules having thermally conductive properties and various shaped substrates.

    Chip scale stacking system and method
    8.
    发明专利
    Chip scale stacking system and method 未知

    公开(公告)号：GB2395367B

    公开(公告)日：2005-05-25

    申请号：GB0406140

    申请日：2002-10-25

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L ,  WEHRLY JAMES DOUGLAS ,  DOWDEN JULIAN ,  BUCHLE JEFF

    IPC: H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H01L23/48 ,  H05K1/00

    Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

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