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    PRESSURE SENSOR HAVING IMPROVED REJECTION OF UNDESIRED STIMULI
    2.
    发明申请
    PRESSURE SENSOR HAVING IMPROVED REJECTION OF UNDESIRED STIMULI 有权

    公开(公告)号：US20250130129A1

    公开(公告)日：2025-04-24

    申请号：US18915158

    申请日：2024-10-14

    Applicant: STMicroelectronics International N.V.

    Inventor： Filippo DANIELE ,  Enri DUQI ,  Lorenzo BALDO

    IPC: G01L19/04 ,  G01L9/00 ,  G01L13/02

    Abstract: A pressure sensor has a body having a first chamber and a second chamber hermetically separated from the first chamber; a first detection structure which is arranged in the first chamber, has a first deformable element and a first buried cavity within the first detection structure, wherein the first deformable element is configured to undergo a deformation as a function of a pressure difference between the first chamber and the first buried cavity. The sensor also has a second detection structure which is arranged in the second chamber, has a second deformable element and a second buried cavity within the second detection structure, wherein the second deformable element is configured to undergo a deformation as a function of a pressure difference between the second chamber and the second buried cavity. The sensor also has a first channel that extends into the body and is configured to fluidically couple the first buried cavity with the second chamber; and a second channel that extends into the body and is configured to fluidically couple the second buried cavity to the first chamber.

    LINEAR CAPACITIVE PRESSURE SENSOR
    3.
    发明公开
    LINEAR CAPACITIVE PRESSURE SENSOR 审中-公开

    公开(公告)号：US20240295454A1

    公开(公告)日：2024-09-05

    申请号：US18117070

    申请日：2023-03-03

    Applicant: STMicroelectronics International N.V.

    Inventor： Lorenzo BALDO ,  Filippo DANIELE ,  Enri DUQI

    IPC: G01L9/12

    CPC classification number: G01L9/12

    Abstract: A pressure-sensor includes a substrate with a cavity therein and a membrane suspended over the cavity. The cavity is connected to external air pressure so a change in external air pressure causes out-of-plane movement of the membrane. A frame suspended over the membrane includes a segment connected to the membrane but disconnected from other frame portions. A projection extends from the frame. A first spring is connected to the projection, a second spring is connected to the segment, and an end portion connects the springs so out-of-plane movement of the membrane applies out-of-plane force to the second spring, which is transferred to the first spring by the end portion and translated to an in-plane force by the first spring and applied to the projection. This causes lateral sliding movement of the frame with respect to the substrate. A capacitive-sensor detects sliding movement of the frame with respect to the substrate.

    SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN STACKED DIES AND CORRESPONDING MANUFACTURING PROCESS
    5.
    发明申请
    SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN STACKED DIES AND CORRESPONDING MANUFACTURING PROCESS 有权

    公开(公告)号：US20210147222A1

    公开(公告)日：2021-05-20

    申请号：US17161367

    申请日：2021-01-28

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Lorenzo BALDO ,  Domenico GIUSTI

    IPC: B81C1/00 ,  B81B7/00

    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

    WATERPROOF SWITCH ACTUATABLE BY A FLUID SUCH AS AIR AND USABLE IN PARTICULAR FOR ACTIVATING AN INHALATOR APPARATUS, SUCH AS AN ELECTRONIC CIGARETTE
    7.
    发明申请
    WATERPROOF SWITCH ACTUATABLE BY A FLUID SUCH AS AIR AND USABLE IN PARTICULAR FOR ACTIVATING AN INHALATOR APPARATUS, SUCH AS AN ELECTRONIC CIGARETTE 有权

    公开(公告)号：US20210114867A1

    公开(公告)日：2021-04-22

    申请号：US17072813

    申请日：2020-10-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Enri DUQI ,  Fabrizio CERINI ,  Lorenzo BALDO

    IPC: B81B7/02 ,  A24F40/51 ,  B81B7/00

    Abstract: A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.

    MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF
    10.
    发明申请
    MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF 有权

    公开(公告)号：US20220185661A1

    公开(公告)日：2022-06-16

    申请号：US17684317

    申请日：2022-03-01

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Marco DEL SARTO ,  Lorenzo BALDO

    IPC: B81C1/00 ,  B81B3/00 ,  B81C99/00

    Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

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