Power MOS semiconductor device
    1.
    发明公开
    Power MOS semiconductor device 有权
    MOS-Leistungshalbleiteranordnung

    公开(公告)号:EP1659636A1

    公开(公告)日:2006-05-24

    申请号:EP05025285.7

    申请日:2005-11-18

    CPC classification number: H01L29/7802 H01L29/4238 H01L29/4933 H01L29/4983

    Abstract: Power electronic MOS device of the type comprising a plurality of elementary power MOS transistors (2) and a gate structure (12) comprising a plurality of conductive strips (8) realised with a first conductive material such as polysilicon, a plurality of gate fingers or metallic tracks (11) connected to a gate pad (30) and at least a connection layer (20) arranged in series to at least one of said conductive strip (8). Such gate structure (12) comprising at least a plurality of independent islands (10) formed on the upper surface (9) of the conductive strips (8) and suitably formed on the connection layers (20). Said islands (10) being realised with at least one second conductive material such as silicide.

    Abstract translation: 包括多个基本功率MOS晶体管(2)和栅极结构(12)的功率电子MOS器件包括由诸如多晶硅的第一导电材料实现的多个导电条(8),多个栅极指或者 连接到栅极焊盘(30)的金属轨道(11)和至少与所述导电条(8)中的至少一个串联布置的连接层(20)。 这种栅极结构(12)包括形成在导电条(8)的上表面(9)上并适当地形成在连接层(20)上的至少多个独立的岛(10)。 所述岛(10)用至少一种第二导电材料(例如硅化物)实现。

    Power MOS semiconductor device
    2.
    发明授权
    Power MOS semiconductor device 有权
    MOS功率半导体器件

    公开(公告)号:EP1659636B1

    公开(公告)日:2009-11-04

    申请号:EP05025285.7

    申请日:2005-11-18

    CPC classification number: H01L29/7802 H01L29/4238 H01L29/4933 H01L29/4983

    Abstract: Power electronic MOS device of the type comprising a plurality of elementary power MOS transistors (2) and a gate structure (12) comprising a plurality of conductive strips (8) realised with a first conductive material such as polysilicon, a plurality of gate fingers or metallic tracks (11) connected to a gate pad (30) and at least a connection layer (20) arranged in series to at least one of said conductive strip (8). Such gate structure (12) comprising at least a plurality of independent islands (10) formed on the upper surface (9) of the conductive strips (8) and suitably formed on the connection layers (20). Said islands (10) being realised with at least one second conductive material such as silicide.

    Double-sided semiconductor structure and method for manufacturing the same
    3.
    发明公开
    Double-sided semiconductor structure and method for manufacturing the same 有权
    Doppelseitige Halbleiterstruktur und Herstellungsverfahren

    公开(公告)号:EP2317553A1

    公开(公告)日:2011-05-04

    申请号:EP10188931.9

    申请日:2010-10-26

    Abstract: A semiconductor structure (100; 200; 300) comprising; a substrate (5; 302) of semiconductor material of a first type of conductivity; a first semiconductor layer (7) set in direct electrical contact with the substrate on a first side (2) of the substrate; a second semiconductor layer (8) set in direct electrical contact with the substrate on a second side (4) of the substrate; a first active electronic device (10; 303) formed in the first semiconductor layer (7); and a second active electronic device (12; 62; 305) formed in the second semiconductor layer (8).

    Abstract translation: 一种半导体结构(100; 200; 300),包括: 具有第一类导电性的半导体材料的衬底(5; 302); 在衬底的第一侧(2)上与衬底直接电接触的第一半导体层(7); 在所述基板的第二侧(4)上与所述基板直接电接触的第二半导体层(8); 形成在第一半导体层(7)中的第一有源电子器件(10; 303)。 和形成在第二半导体层(8)中的第二有源电子器件(12; 62; 305)。

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