Abstract:
The invention relates to an integrated structure (1) for memory cells formed over a semiconductor substrate (2) doped with a first dopant type and including at least one memory cell (CM) in turn formed in a conductive well (3) provided in said semiconductor substrate (2) and doped with a second dopant type, said conductive well (3) having an additional well (4) formed therein which is doped with the first dopant type and comprises active areas (5,6) of the memory cell (CM). According to the invention, a substrate bias terminal (8), formed in the additional well (4), is further associated with the memory cell (CM) to receive a suitable bias voltage (Vpol) to lower the threshold voltage (Vth) of the memory cell (CM) by body effect. The invention also relates to a biasing device (13) for a memory cell (CM) which has at least one substrate bias terminal (8) associated therewith, the biasing device comprising at least a first sub-threshold circuitry block (A) adapted to supply an appropriate current during the device standby phase through a restore transistor (M1) connected between a supply voltage reference (Vcc) and the substrate bias terminal (8) of the memory cell (CM), and having a control terminal connected to a bias circuit (14), in turn connected between the supply voltage reference (Vcc) and a ground voltage reference (GND) to drive the restore transistor (M1) with a current of limited value. The device according to the invention further comprises a second feedback block (B) for fast charging the substrate bias terminal (8), being connected between the supply voltage reference (Vcc) and the ground voltage reference (GND) and comprising a first bias transistor (M2) having a control terminal connected to the ground voltage reference (GND) via a stabilization transistor (M3), having in turn a control terminal connected to an output node (OC), and to the control terminal of a first regulation transistor (M4) connected between the supply voltage reference (Vcc) and the ground voltage reference (GND), the stabilization transistor (M3) and first regulation transistor (M4) providing feedback for the bias transistor (M2), thereby to restrict the voltage range of the output node (OC).
Abstract:
The present invention relates to a memory device of the type comprising: at least one first (M1) and one second (M2) memory cell array for storage respectively of a first plurality of user data and a second plurality of error identification and correction data, first (D1) and second (D2) decoding means connected respectively to the first (M1) and second (M2) memory cell array for selection and reading respectively of the first and second pluralities of data, error identification means (L1) coupled to said first (D1) and second (D2) decoder means, and error correction means (C1,C2,EN) operationally connected to said first (D1) and second (D2) decoder means and to said error identification means (L1), and characterized in that it comprises at least one logical control unit (L2) operationally connected to the second decoder means (D2), to error identification means (L1) and to the error correction means (C1,C2,EN) to enable said second decoder means (D2) and said error correction means (C1,C2,EN) if an error is detected by the error identification means (L1).