公开(公告)号：WO2008012846A1

公开(公告)日：2008-01-31

申请号：PCT/IT2006/000576

申请日：2006-07-26

Applicant: STMICROELECTRONICS S.R.L. ,  MERASSI, Angelo ,  CORTESE, Mario, Francesco ,  VIOLA, Fultio ,  SIMONI, Barbara ,  RUSCONI CLERICI BELTRAMI, Andrea

Inventor： MERASSI, Angelo ,  CORTESE, Mario, Francesco ,  VIOLA, Fultio ,  SIMONI, Barbara ,  RUSCONI CLERICI BELTRAMI, Andrea

IPC: B81B7/00 ,  G01P15/08

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P15/08 ,  G01P15/125 ,  G01P2015/0828

Abstract: Described herein is a microelectromechanical device (10) having a mobile mass (12) that undergoes a movement, in particular a spurious movement, in a first direction (z) in response to an external event; the device moreover has a stopper structure (14, 20) configured so as to stop said spurious movement. In particular, a stopper element (20) is fixedly coupled to the mobile mass (12) and is configured so as to abut against a stopper mass (14) in response to the spurious movement, thereby stopping it. In detail, the stopper element (20) is arranged on the opposite side of the stopper mass (14) with respect to a direction of the spurious movement, protrudes from the space occupied by the mobile mass (12) and extends in the space occupied by the stopper mass, in the first direction (z).

Abstract translation: 这里描述的是具有响应于外部事件在第一方向（z）上经历移动，特别是杂散运动的移动质量块（12）的微机电装置（10）。 该装置还具有构造成停止所述杂散运动的止动结构（14,20）。 特别地，止动元件（20）固定地联接到移动质量块（12），并且被配置为响应于伪运动而抵靠止动块（14），从而停止它。 详细地说，止动元件（20）相对于杂散运动的方向设置在止动块（14）的相对侧上，从可移动质量块（12）所占据的空间突出，并在占据的空间 通过止动块在第一方向（z）上。

公开(公告)号：WO2011061771A1

公开(公告)日：2011-05-26

申请号：PCT/IT2009/000527

申请日：2009-11-20

Applicant: UNIMICRON TECHNOLOGY CORP. ,  STMICROELECTRONICS S.R.L. ,  CORTESE, Mario, Francesco ,  AZZOPARDI, Mark, A. ,  HSU, Shih-Ping ,  TSAI, Kun-Chen ,  MICALLEF, Ivan

Inventor： CORTESE, Mario, Francesco ,  AZZOPARDI, Mark, A. ,  HSU, Shih-Ping ,  TSAI, Kun-Chen ,  MICALLEF, Ivan

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  Y10T156/1056 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board (20) with opposite first and second surfaces (20a, 20b) having first and second metal layers (21a, 21b) disposed thereon, respectively, wherein a through cavity (200) extends through the first board and the first and second metal layers; a second board (23) with opposite third and fourth surfaces (23a, 23b); an adhesive layer (22) sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess (200); and a first conductor layer (25a) coating the bottom and the side surfaces (201a, 201b) of the recess. The lid enhances the shielding effect upon the MEMS device.

Abstract translation: MEMS器件的盖子及相关制造方法。 所述盖包括：分别具有相对的第一和第二表面（20a，20b）的第一板（20），其具有分别设置在其上的第一和第二金属层（21a，21b），其中通孔（200）延伸穿过所述第一板和 第一和第二金属层; 具有相对的第三和第四表面（23a，23b）的第二板（23）; 夹在所述第一板的第二表面和所述第二板的第三表面之间的粘合剂层（22），以将所述第一和第二板连接在一起，使得所述通孔由所述第二板封闭，从而形成凹部（200） ; 以及涂覆凹部的底部和侧面（201a，201b）的第一导体层（25a）。 盖子增强了对MEMS器件的屏蔽效果。

公开(公告)号：WO2008089969A2

公开(公告)日：2008-07-31

申请号：PCT/EP2008/000495

申请日：2008-01-23

Applicant: STMICROELECTRONICS S.R.L. ,  BALDO, Lorenzo ,  COMBI, Chantal ,  CORTESE, Mario, Francesco

Inventor： BALDO, Lorenzo ,  COMBI, Chantal ,  CORTESE, Mario, Francesco

IPC: B81B7/00 ,  G01L9/00 ,  G01L13/02 ,  G01D11/24

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).

Abstract translation: 一种电子装置（1,1a，1b，1c，1d，1e），包括：设置有至少一个通过开口（5）的衬底（2），具有功能的MEMS装置（7） ，所述差动传感器设置有第一和第二表面（9,10），并且所述类型包括至少一个对与第一和第二相对的有效表面相对应的流体的化学和/或物理变化敏感的部分（11） （11a，11b），所述MEMS器件（7）的第一表面（9）离开所述第一有源表面（11a）并且所述第二表面（10）设置有另一开口（12），所述另一开口（12）暴露所述第二对置 所述电子装置（1,1d，1e）的特征在于，所述MEMS装置（7）的所述第一表面（9）面向所述衬底（2）且与所述衬底（2）隔开预定距离，所述敏感表面 部分（11）与衬底（2）的通过开口（5）对准，并且其还包括：保护包装（14， ，其至少部分地并入MEMS器件（7）和衬底（2），从而使第一和第二相对的有源表面（11a，11b）分别暴露于衬底的通过开口（5） （2）和第二表面（10）的另一开口（12）。

公开(公告)号：EP2501644A1

公开(公告)日：2012-09-26

申请号：EP09802226.2

申请日：2009-11-20

Applicant: Unimicron Technology Corp. ,  STMicroelectronics S.r.l.

Inventor： CORTESE, Mario, Francesco ,  AZZOPARDI, Mark, A. ,  HSU, Shih-Ping ,  TSAI, Kun-Chen ,  MICALLEF, Ivan

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  Y10T156/1056 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

公开(公告)号：EP2121513A2

公开(公告)日：2009-11-25

申请号：EP08707208.8

申请日：2008-01-23

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  COMBI, Chantal ,  CORTESE, Mario, Francesco

IPC: B81B7/00 ,  G01L9/00 ,  G01L13/02 ,  G01D11/24

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).