Abstract:
A voltage regulating circuit for a capacitive load, being connected between first and second terminals of a supply voltage generator (VDD,GND) and having an input terminal (IN) and an output terminal (OUT), comprises an operational amplifier (OP) having an inverting (-) input terminal connected to the input terminal (IN) of the regulating circuit and a non-inverting (+) input terminal connected to an intermediate node of a voltage divider (R1,R2) which is connected between an output node connected to the output terminal (OUT) of the regulating circuit and the second terminal (GND) of the supply voltage generator, and having an output terminal connected, for driving a first field-effect transistor (MPU), between the output node and the first terminal (VDD) of the supply voltage generator, the output terminal of the operational amplifier being further connected to the output node through a compensation network (COMP), and comprises a second field-effect transistor (MPD1) connected between the output node and the second terminal of the supply voltage generator (GND) and having its gate terminal connected to a constant voltage generating circuit means (RB,CB,MB,IB).
Abstract:
A voltage boost device includes a first boost stage (4) and a second boost stage (5) connected to an input terminal and to an output terminal (10), the output terminal (10) supplying an output voltage higher than a supply voltage. The input terminal receives an operating condition signal (SB) having a first logic level representative of a standby operating state and a second logic level representative of an active operation state. The first boost stage (4) is enabled in presence of the second logic level of the operating condition signal (SB), and is disabled in presence of the first logic level of the operating condition signal (SB); the second boost stage (5) is controlled in a first operating condition in presence of the first logic level of the operating condition signal (SB), and is controlled in a second operating condition in presence of the second logic level of the operating condition signal (SB).
Abstract:
A flash memory device with NAND architecture (100) is proposed. The memory device includes a matrix of memory cells (110) each one having a programmable threshold voltage, wherein the matrix includes at least one sector individually erasable (115) and it is arranged in a plurality of rows and columns with the cells of each row connected to the corresponding word line (WL) and the cells of each column arranged in a plurality of strings (125) of cells connected in series, the strings of each column being connected to a corresponding bit line (BL), wherein the memory device further includes means (320) for erasing the cells of a selected sector, and means (330) for restoring the threshold voltage of the erased cells, wherein the means for restoring acts in succession on each of a plurality of blocks of the sector, for each one of a set of selected bit lines the block including a group of cells connected to a set of selected word lines, the means for restoring including means (446a, 446b) for reading each group with respect to a limit value exceeding a reading reference value, means (451a, 451b) for programming only each group wherein the threshold voltage of at least one group does not reach said limit value, and means (449a, 449b) for stopping the restoring in response to the reaching of the limit value by at least one sub-set of the groups.
Abstract:
The invention relates to a method and a programming circuit for the regulation of voltages on the drain (D) and body (B) terminals of a non-volatile memory cell (3) while being programmed. These voltages are applied through a programming circuit (1) inserted on a conduction pattern that transfers a predetermined voltage value (VPD,Vb) on at least one terminal (D,B) of the memory cell. The method comprises a local regulation phase of said voltage value, within the programming circuit, for deleting the effect of a parasitic resistor (R par ) lying on the conduction pattern.
Abstract:
The invention relates to a method and a programming circuit for the regulation of voltages on the drain (D) and body (B) terminals of a non-volatile memory cell (3) while being programmed. These voltages are applied through a programming circuit (1) inserted on a conduction pattern that transfers a predetermined voltage value (VPD,Vb) on at least one terminal (D,B) of the memory cell. The method comprises a local regulation phase of said voltage value, within the programming circuit, for deleting the effect of a parasitic resistor (R par ) lying on the conduction pattern.