Abstract:
The present invention relates to an integrated memory system (1) comprising at least a non volatile memory (2) and an automatic storage error corrector, and wherein the memory (2) is connected to a controller (3) by means of an interface bus (4). Advantageously, the system comprises in the memory (2) circuit means, functionally independent, each being responsible for the correction of a predetermined storage error; at least one of said means generating a signal (IRQ) to ask a correction being external to the memory (2).
Abstract:
A non-volatile memory device (100) is proposed. The non-volatile memory device includes a plurality of memory cells (110) each one having a programmable threshold voltage, and means for reading (130, 140, 150) a set of selected memory cells with respect to a plurality of reference voltages, for each selected memory cell the means for reading including means for charging (Pc) a reading node (BL) associated with the selected memory cell with a charging voltage (Vc), means for biasing (130) the selected memory cell with a biasing voltage, means for connecting (120d, 120s) the charged reading node with the biased selected memory cell, and means for sensing (205) a voltage at the reading node after a predefined delay from the connection, for at least a first one of the reference voltages (V R ) the biasing voltage being a first biasing voltage equal to the first reference voltage and the delay being a common first delay (Te), wherein for at least a second one of the reference voltages (Vga) the biasing voltage is a second biasing voltage (V R ) different from the second reference voltage, and the delay is a second delay (Teg) different from the first delay.
Abstract:
A memory (104) has one bus (112) for data, addresses, and commands. A data register (114) is coupled to the bus (112) to store the data written to and read from the memory (104), a command register is coupled to the bus for receiving memory commands, and an address register is coupled to the bus to address the memory. The memory also includes an Error Correction Code (ECC) circuit for calculating an ECC. The memory (104) is configured (168, 200, 206, 237) to be responsive to external commands for controlling the operation of the ECC circuit (140) for reading or writing of the ECC that are separate from external commands controlling reads or writes of the memory data. The memory may also include a status register that stores information regarding the passing or failing of the ECC.
Abstract:
A non volatile memory of the type comprising a predetermined number of sectors capable of ensuring the operation of the same even with a lower number of defective sectors than a predetermined limit.
Abstract:
A page buffer (130) for an electrically programmable memory (100) is provided. The electrically programmable memory includes a plurality of memory cells (110) arranged in a plurality of bit lines (BLe,BLo) of memory cells and forming a plurality of individually-selectable memory sets. The electrically programmable memory includes a plurality of distinct programming states defined for each memory cell, corresponding to a number N>=2 of data bits storable in each memory cell. The data bits include at least a first data bits group (MSB) and a second data bits group (LSB), the first data bits groups and, respectively, the second data bits groups stored in the memory cells of one of said individually-selectable memory cell sets forming at least a first memory page and a second memory page, respectively. The first and second memory pages are individually addressable in reading and writing. The page buffer comprises at least one read/program unit (205) having a coupling line (SO) operatively associable with at least one of said bit lines and adapted to at least temporarily storing data bits read from or to be written into either one of the first or second memory page stored in the memory cells of a selected memory cells sets. The read/program unit comprises enabling means (230-1, 230-2, 252, 254, 256, 258, 272, 274, 276, 278) for selectively enabling a change in programming state of a selected memory cell by causing the coupling line to take one among a program enabling potential and a program inhibition potential, conditioned to a target data value to be stored in the first group of data bits (MSB) of the selected memory cell, and an existing data value already stored in the second group of data bits (LSB) of the selected memory cell. The enabling means comprise reading means (256, 258, 260, 230-2) for retrieving the existing data value; means (252, 254, 230-1) for receiving an indication of the target data value; combining means (272, 274, 276, 278) for combining the received target data value with the retrieved existing data value, thereby modifying said indication of the target data value so as to obtain a modified indication; and conditioning means (272, 274) included in the combining means for conditioning a potential of the coupling line based on the existing data value and the modified indication, so as to cause the coupling line to take the program enabling potential or the program inhibition potential.
Abstract:
Multi-level programming (30-42) allows for writing a first and a second bit in selected cells (3) by separately programming (30-32) a first bit (LSB) from a second bit (MSB). Programming (30-32) of the first bit determines a shifting (32) from a first threshold level (A) to a second threshold level (B); programming (36-42) of the second bit requires a preliminary reading (36-40) to detect whether the first bit (LSB) has been modified; performing a first writing step (42) to bring the cell to a third threshold voltage (C) if the first bit has been modified and performing a second writing step (42) to bring the selected cell to a fourth threshold voltage (D) different from the third threshold level if the first bit has not been modified. The memory array (2) divided into a first portion (2a) where data are stored using multiple threshold levels corresponding to a plurality of bits, and a second portion (2b) where data are stored using two threshold levels corresponding to a single bit. For increasing reading and program reliability, during preliminary reading (40) of the second portion (2b) a reading result is forced to correspond to the first threshold level.
Abstract:
A flash memory device with NAND architecture (100) is proposed. The memory device includes a matrix of memory cells (110) each one having a programmable threshold voltage, wherein the matrix includes at least one sector individually erasable (115) and it is arranged in a plurality of rows and columns with the cells of each row connected to the corresponding word line (WL) and the cells of each column arranged in a plurality of strings (125) of cells connected in series, the strings of each column being connected to a corresponding bit line (BL), wherein the memory device further includes means (320) for erasing the cells of a selected sector, and means (330) for restoring the threshold voltage of the erased cells, wherein the means for restoring acts in succession on each of a plurality of blocks of the sector, for each one of a set of selected bit lines the block including a group of cells connected to a set of selected word lines, the means for restoring including means (446a, 446b) for reading each group with respect to a limit value exceeding a reading reference value, means (451a, 451b) for programming only each group wherein the threshold voltage of at least one group does not reach said limit value, and means (449a, 449b) for stopping the restoring in response to the reaching of the limit value by at least one sub-set of the groups.