Abstract:
A memory cell comprises a first and a second inverters ( 103a,103b ) connected in a latch configuration. The inverters have respective first and second means ( SP1,SN1,SP2,SN2 ) for receiving a first and a second voltage supplies ( VDD,GND ), respectively. The cell also comprises means ( STa,STb ), responsive to a memory cell selection signal ( SEL ), for selectively connecting an input of at least one of the first and second inverter to at least one respective input/output data line ( I/O,I/ON ), carrying an input datum to be written in the memory cell in a memory cell write operation and an output datum read from the memory cell in a memory cell read operation. For flash-clearing the memory cell, means ( SWa,SWb ) are provided for switching at least one of the first and second voltage supply receiving means of at least one of the first and second inverters between the first voltage supply and the second voltage supply. The memory cell is particularly adapted to implement a flash-clear function in a memory device.
Abstract:
A lateral DMOS transistor having a drain region (13, 14) which comprises a high-concentration portion (14) with which the drain electrode (D) is in contact and a low-concentration portion (13) which is delimited by the channel region. In addition to the conventional source, drain, body and gate electrodes, the transistor has an additional electrode (25) in contact with a point of the low-concentration portion of the drain region (13, 14) which is close to the channel. The additional electrode permits a direct measurement of the electric field in the gate dielectric and thus provides information which can be used both for characterizing the transistor and selecting its dimensions and for activating devices for protecting the transistor and/or other components of an integrated circuit containing the transistor.
Abstract:
A solution for executing a reliability test is proposed. A corresponding electronic device (100) includes functional means (110) for implementing a functionality of the electronic device, and testing means (115) for executing a test of the functional means including a plurality of test operations on the functional means; the testing means returns an indication of a result of each test operation. In the solution according to an embodiment of the invention, the electronic device further includes control means (125) for causing the testing means to reiterate the test, monitoring means (215) for monitoring the result of each test operation to detect a failure of the test operation, and storage means (130) for storing failure information indicative of temporal characteristics of each failure.
Abstract:
A memory device comprises an array (1) of memory cells (2,DMC0-DMCn) arranged in rows (R1-Rn) and columns (C1-Cm,DC), a plurality of gates (RD1-RDn) for transmitting respective selection outputs (RS1-RSn) of a row decoder (3) to respective rows (RS), a dummy column (DC) of dummy memory cells (DMC0-DMCn) substantially indentical to the memory cells, precharge means (P4,P5,P6,P7) for precharging the columns and the dummy column at a precharge potential (VDD) when no row is selected, and programming means (N7,N8,7) for setting selected columns at respective programming potentials. The device comprises dummy memory cell preset means (P3) for presetting the dummy memory cells in a first logic state when no row is selected; dummy column programming means (N9,N10) for setting the dummy column at a prescribed programming potential corresponding to a second logic state opposite to the first logic state; first detector means (DET1) for detecting that the dummy column has discharged from the precharge potential to the prescribed programming potential and for consequently enabling said plurality of gates. Each of said gates has an input coupled to a respective dummy memory cell so that the gate is disabled as soon as the respective dummy memory cell has switched from said first logic state to said second logic state.
Abstract:
A memory cell comprises a bistable element (I1,I2) with a first (A) and a second nodes (B) storing complementary data, first (N3) and second selection means (N4) for respectively coupling the first (A) and second nodes (B) to a first (0) and a second input/output nodes (0') of the memory cell (1). The first (N3) and second selection means (N4) are respectively controlled by independent first (WL r/w ) and second selection signals (WL w ).
Abstract:
A monolithically integrated electronic system having a plurality of operating modes and comprising distinct random access static storage resources, acess to which is differently contemplated for different modes of operation, and means for interrupting power supply to distinct static storage resources that are not utilized in the currently selected operating mode, has two or more distinct static storage resources defined in distinct sectors of a single array of memory cells, each of which is separately powered through a dedicated supply line/source. All sectors share a single peripheral address and write/read circuitry that is also powered through a distinct supply line/source. The on or off state of distinct sectors is determined via software and commanded by the running program of a certain application by the integrated electronic system. A sector contemplated to remain always powered is composed by memory cells having a higher threshold of that of the memory cells of the other sectors of the array to be programmably switched off.
Abstract:
A built-in self-test and self-repair structure (BISR) of memory arrays embedded in an integrated device, including at least a test block (BIST) programmable to execute on a respective memory array of the device any of a certain number of predefined test algorithms, and a self-repair block that includes a column address generator processing the faulty addresses information for allocating redundant resources of the tested memory array, a redundancy register on which final redundancy information are loaded at each power-on of the device and a control logic for managing data transfer from external circuitry to the built-in self-test and self-repair structure (BISR) and vice versa, utilizes a single built-in self-test (BIST) structure serves any number of embedded memory arrays even of different type and size. The built-in self-test and self-repair (BISR) structure further includes nonvolatile storage means containing information on addresses and data bus sizes of the device architecture, aspect ratio, capacity, multiplexing and scrambling parameters and relative test algorithm instructions for each of said embedded memory arrays and on which redundance column addresses are permanently stored and a multiple frequency clock generator for selecting the maximum operating clock frequency of the type of embedded memory array to be accessed. Two distinct selectable test flows of an embedded random access memory array are selectable by programming. A first two-step test flow, each step of which includes the execution of a complete BIST check on the array, and a second three-step test flow, each step of which includes the execution of a complete BIST check on the array, the third BIST check revealing a possible failed programming of the redundance column addresses in said nonvolatile storage means.
Abstract:
A self diagnosis (BISD) device for a random memory array, preferably integrated with the random access memory, executes a certain number of predefined test algorithms and identifies addresses of faulty locations. The BISD device recognizes certain fail patterns of interest and generates bit-strings corresponding to them. In practice, the BISD device diagnoses automatically memory arrays and allow to identify defects in the production process that affect a new technology during its learning phase, thus accelerating its "maturation".