Integrated circuit with identification signal writing circuitry distributed on multiple metal layers
    2.
    发明公开
    Integrated circuit with identification signal writing circuitry distributed on multiple metal layers 审中-公开
    包括:在多个金属层的集成电路分布式布线用于写入的识别信号

    公开(公告)号:EP1100125A1

    公开(公告)日:2001-05-16

    申请号:EP99830699.7

    申请日:1999-11-10

    Abstract: Integrated device (100) comprising a plurality of conducting layers (115a-115c), each having a first (120ga-120gc) and a second (120va-120vc) power supply contact for providing, respectively, a first and a second binary value, and means for supplying at least one identification bit of a version of the integrated device (100); the integrated device (100) includes, for each identification bit, parity check means (135abi, 135bci) having a plurality of input terminals whose number is equal to the number of conducting layers (115a-115c), and an output terminal, each input terminal being connected to one contact selected from the first (120ga-120gc) and the second (120va-120vc) power supply contacts of a corresponding one of the conducting layers (115a-115c), and the output terminal supplying the corresponding identification bit.

    Abstract translation: 集成器件(100)包括导电层(115A-115C)的复数,每个都具有第一(120ga-120gc)和用于提供第二(120VA-120vc)供电接触件,分别为第一和第二二进制值, 和装置,用于提供一个版本的集成设备(100)中的至少一个识别位; 集成器件(100)包括,对于每个识别位,奇偶校验手段(135abi,135bci),其具有输入端子,其数量等于导电层(115A-115C)的数量,和输出端子的复数,每个输入 端子被连接到从第一(120ga-120gc)选择的一个接触,并且相应的所述导电层中的一个(115A-115C)的第二个(120VA-120vc)电源触点,和输出端供给对应的识别位。

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