公开(公告)号：JP2007329514A

公开(公告)日：2007-12-20

申请号：JP2007238060

申请日：2007-09-13

Applicant: Tessera Interconnect Materials Inc ,  テセラ・インターコネクト・マテリアルズ,インコーポレイテッド

Inventor： ASANO TOSHIHIKO ,  OHIRA HIROSHI ,  ENDO KIMIYOSHI ,  KUROSAWA INATARO

IPC: H05K3/46 ,  H05K3/26

Abstract: PROBLEM TO BE SOLVED: To increase height of a bump while not blocking miniaturization of patterns. SOLUTION: A multilayer wiring circuit board: forms a bump for connecting between upper and lower wirings 6 made in one or integrally made of copper on a copper layer 5; laminates a metal plate 35 formed with extended bumps so as to electrically connect each extended bump to each bump for connecting between upper and lower wirings 6 associated with the extended bump at a position associating with each bump for connecting between upper and lower wirings 6 on an interlayer insulating film of one substrate in which an interlayer insulating film 7 is formed at a portion where there is not a bump on the copper layer 5 and an upper surface of the bump for connecting between upper and lower wirings; and forms an interlayer insulating film 39 at a portion where an extended bump 38 of a metal plate is not formed. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：增加凸块的高度，同时不阻碍图案的小型化。 解决方案：多层布线电路板：形成用于连接在铜层5上由铜制成的一体或整体制成的上布线6和下布线6之间的凸块; 层叠形成有延伸凸块的金属板35，以便将每个延伸的凸块电连接到每个凸起，用于在与每个凸起相关联的位置处的上部和下部布线6之间连接延伸的凸起，以在上部和下部布线6之间连接 在铜层5上没有凸点的部分形成层间绝缘膜7的一个基板的层间绝缘膜和用于连接上下布线的凸块的上表面; 并且在未形成金属板的延伸凸块38的部分形成层间绝缘膜39。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：EP1377145A4

公开(公告)日：2008-07-30

申请号：EP02707177

申请日：2002-03-27

Applicant: TESSERA INTERCONNECT MATERIALS

Inventor： IIJIMA TOMOO ,  KATO YOSHIRO ,  ODAIRA HIROSHI ,  OHSAWA MASAYUKI ,  KUROSAWA INETARO ,  SAKUMA KAZUO ,  ASANO TOSHIHIKO ,  ENDO KIMITAKA

IPC: B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.