公开(公告)号：EP1377145A4

公开(公告)日：2008-07-30

申请号：EP02707177

申请日：2002-03-27

Applicant: TESSERA INTERCONNECT MATERIALS

Inventor： IIJIMA TOMOO ,  KATO YOSHIRO ,  ODAIRA HIROSHI ,  OHSAWA MASAYUKI ,  KUROSAWA INETARO ,  SAKUMA KAZUO ,  ASANO TOSHIHIKO ,  ENDO KIMITAKA

IPC: B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.