公开(公告)号：JP2008098656A

公开(公告)日：2008-04-24

申请号：JP2007297120

申请日：2007-11-15

Applicant: Tessera Interconnect Materials Inc ,  テセラ・インターコネクト・マテリアルズ,インコーポレイテッド

Inventor： KATO YOSHIRO ,  OHIRA HIROSHI ,  OSAWA MASAYUKI ,  IIJIMA ASAO ,  KUROSAWA INATARO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain an inter-layer connecting material wherein microscopic formation vias can be formed at all interlayers.
SOLUTION: The inter-layer connecting material includes: a metal layer that is patternable for forming a wiring circuit pattern and has a first main surface with a continuous flat shape and a second main surface with the continuous flat shape on the opposite side of the first main surface; and a second layer lying on the first main surface, wherein a removable layer comprising polymer lies on a stripping layer. Further, the patternable inter-layer connecting material includes: the removable layer wherein the second layer is peelable by means of the strippping layer, which temporarity adheres the second layer to the first metal layer and is fit so as to be peeled from the first metal layer; and a plurality of solid metal bump, which lies on the second main surface and is formed of the second metal, respectively.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：获得层间连接材料，其中可以在所有中间层上形成微观形成通孔。 解决方案：层间连接材料包括：金属层，其可图案化以形成布线电路图案，并具有连续平坦形状的第一主表面和在相对侧具有连续平坦形状的第二主表面 的第一主表面; 以及位于第一主表面上的第二层，其中包含聚合物的可移除层位于剥离层上。 此外，可图案化的层间连接材料包括：可移除层，其中第二层可以通过剥离层剥离，该时间​​性将第二层粘附到第一金属层并且被配合以便从第一金属 层; 以及分别位于第二主表面上并由第二金属形成的多个固体金属凸块。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：EP1377145A4

公开(公告)日：2008-07-30

申请号：EP02707177

申请日：2002-03-27

Applicant: TESSERA INTERCONNECT MATERIALS

Inventor： IIJIMA TOMOO ,  KATO YOSHIRO ,  ODAIRA HIROSHI ,  OHSAWA MASAYUKI ,  KUROSAWA INETARO ,  SAKUMA KAZUO ,  ASANO TOSHIHIKO ,  ENDO KIMITAKA

IPC: B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.