公开(公告)号：HK1073965A1

公开(公告)日：2005-10-21

申请号：HK05106338

申请日：2005-07-25

Applicant: TESSERA INTERCONNECT MATERIALS INC

Inventor： IIJIMA TOMOO ,  ENDO KIMITAKA ,  IKENAGA KAZUO ,  ODAIRA HIROSHI ,  MINARI NAOTO ,  KATO TAKASHI

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K20100101 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/06 ,  H05K3/10 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.

公开(公告)号：EP1377145A4

公开(公告)日：2008-07-30

申请号：EP02707177

申请日：2002-03-27

Applicant: TESSERA INTERCONNECT MATERIALS

Inventor： IIJIMA TOMOO ,  KATO YOSHIRO ,  ODAIRA HIROSHI ,  OHSAWA MASAYUKI ,  KUROSAWA INETARO ,  SAKUMA KAZUO ,  ASANO TOSHIHIKO ,  ENDO KIMITAKA

IPC: B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.

公开(公告)号：EP1821588A4

公开(公告)日：2009-11-11

申请号：EP05788279

申请日：2005-09-29

Applicant: SONY CHEM & INF DEVICE CORP ,  TESSERA INTERCONNECT MATERIALS

Inventor： SHIMIZU KAZUHIRO ,  YAGI MASANOBU ,  HANAMURA KENICHIRO ,  TAKAYASU MITSUYUKI ,  NAGAI KIYOE ,  IIJIMA TOMOO

IPC: H05K3/46 ,  B32B37/26

CPC classification number: H05K3/4038 ,  B32B37/26 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/06 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49163