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    Scalable fabrication techniques and circuit packaging devices
    2.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923A1

    公开(公告)日：2016-07-14

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE
    3.
    发明专利
    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE 未知

    公开(公告)号：CA2947025A1

    公开(公告)日：2015-11-05

    申请号：CA2947025

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

    CONFIGURATION AND SPATIAL PLACEMENT OF FRONTAL ELECTRODE SENSORS TO DETECT PHYSIOLOGICAL SIGNALS
    5.
    发明申请
    CONFIGURATION AND SPATIAL PLACEMENT OF FRONTAL ELECTRODE SENSORS TO DETECT PHYSIOLOGICAL SIGNALS 审中-公开
    用前置电极传感器检测生理信号的配置和空间布局

    公开(公告)号：WO2014059431A3

    公开(公告)日：2014-06-19

    申请号：PCT/US2013064892

    申请日：2013-10-14

    Applicant: UNIV CALIFORNIA ,  SALK INST FOR BIOLOGICAL STUDI

    Inventor： COLEMAN TODD PRENTICE ,  MA RUI ,  BAJEMA MICHAEL ,  GIL DA COSTA RICARDO ,  FUNG RAYNARD

    IPC: A61B5/0476 ,  A61B5/0482 ,  A61B5/0488

    CPC classification number: A61B5/0482 ,  A61B5/04012 ,  A61B5/0478 ,  A61B5/0484 ,  A61B5/04842 ,  A61B5/04845 ,  A61B5/04847 ,  A61B5/0488 ,  A61B5/0492 ,  A61B5/165 ,  A61B5/167 ,  A61B5/168 ,  A61B5/6803 ,  A61B5/6814

    Abstract: Methods, systems, and devices are disclosed for acquiring and analyzing physiological signals. In one aspect, a physiological sensor device includes a substrate formed of an electrically insulative material and structured to allow physical contact of the device with the frontal region of the head of a user, a recording electrode configured at a first location on the substrate to acquire an electrophysiological signal of the user, a reference electrode configured at a second location on the substrate to acquire a reference signal to the electrophysiological signal, and a ground electrode configured at a third location at least partially between the first and the second locations on the substrate, in which the first location is posterior to the second and third locations, and in which the device is operable when electrically coupled to an electrical circuit to detect physiological signals of the user.

    Abstract translation: 公开了用于采集和分析生理信号的方法，系统和设备。 在一个方面中，生理传感器装置包括由电绝缘材料形成并且被构造为允许装置与用户头部的前部区域物理接触的基板，配置在基板上的第一位置处的记录电极以获取 用户的电生理信号，在基板上的第二位置处配置的参考电极以获取对电生理信号的参考信号，以及接地电极，配置在基板上的第一位置和第二位置之间的至少部分位于第三位置处 其中第一位置在第二和第三位置的后面，并且其中当电耦合到电路以检测用户的生理信号时，该设备可操作。

    Scalable fabrication techniques and circuit packaging devices
    6.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923B2

    公开(公告)日：2019-01-17

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
    7.
    发明专利
    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS 未知

    公开(公告)号：CA2934493A1

    公开(公告)日：2015-06-25

    申请号：CA2934493

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: H01L21/02 ,  H01L21/68 ,  H01L21/70 ,  H01L21/768 ,  H01L23/28 ,  H01L27/15 ,  H05K3/36

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

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