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    Scalable fabrication techniques and circuit packaging devices
    3.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923A1

    公开(公告)日：2016-07-14

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance
    4.
    发明专利
    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance 未知

    公开(公告)号：AU2015253309B2

    公开(公告)日：2021-02-25

    申请号：AU2015253309

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE
    5.
    发明专利
    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE 未知

    公开(公告)号：CA2947025A1

    公开(公告)日：2015-11-05

    申请号：CA2947025

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

    Scalable fabrication techniques and circuit packaging devices
    7.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923B2

    公开(公告)日：2019-01-17

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
    8.
    发明专利
    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS 未知

    公开(公告)号：CA2934493A1

    公开(公告)日：2015-06-25

    申请号：CA2934493

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: H01L21/02 ,  H01L21/68 ,  H01L21/70 ,  H01L21/768 ,  H01L23/28 ,  H01L27/15 ,  H05K3/36

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
    9.
    发明专利
    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS 未知

    公开(公告)号：CA2934493C

    公开(公告)日：2022-06-14

    申请号：CA2934493

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: H01L21/68 ,  H01L21/02 ,  H01L21/70 ,  H01L21/768 ,  H01L23/28 ,  H01L27/15 ,  H05K3/36

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance
    10.
    发明专利
    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance 未知

    公开(公告)号：AU2015253309A1

    公开(公告)日：2016-11-17

    申请号：AU2015253309

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

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