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    Scalable fabrication techniques and circuit packaging devices
    3.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923A1

    公开(公告)日：2016-07-14

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance
    4.
    发明专利
    Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance 未知

    公开(公告)号：AU2015253309B2

    公开(公告)日：2021-02-25

    申请号：AU2015253309

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

    OPTICAL INTRAOCULAR SENSOR AND SENSING METHOD
    5.
    发明申请
    OPTICAL INTRAOCULAR SENSOR AND SENSING METHOD 审中-公开
    光学眼内传感器和传感方法

    公开(公告)号：WO2016064867A3

    公开(公告)日：2016-08-25

    申请号：PCT/US2015056449

    申请日：2015-10-20

    Applicant: UNIV CALIFORNIA

    Inventor： PHAN ALEX ,  TRUONG PHUONG ,  WEINREB ROBERT N ,  LASHERAS JUAN ,  TALKE FRANK

    IPC: A61B3/16

    CPC classification number: A61B3/16 ,  A61B3/14

    Abstract: An optical pressure sensor sized to be implanted at an intraocular location and formed from biocompatible materials. The sensor includes a rigid structure that supports a deformable structure arranged such that deformation of the deformable structure can be monitored optically when implanted in the intraocular location. A method for sensing intraocular pressure images the deformable structure and correlates an optical property affected by the state of deformation of the deformable structure to an intraocular pressure.

    Abstract translation: 一种光学压力传感器，其尺寸被设计成植入在眼内位置并由生物相容材料形成。 该传感器包括刚性结构，该刚性结构支撑可变形结构，该可变形结构被布置成使得当植入眼内位置时可以对可变形结构的变形进行光学监测。 一种用于感测眼内压图像的方法，该方法用于将可变形结构的变形状态影响的光学特性与眼内压相关联。

    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE
    6.
    发明专利
    UNOBTRUSIVE WIRELESS ELECTRONIC SYSTEMS FOR MONITORING AND FACILITATING PATIENT COMPLIANCE 未知

    公开(公告)号：CA2947025A1

    公开(公告)日：2015-11-05

    申请号：CA2947025

    申请日：2015-04-28

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  WEINREB ROBERT N ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  KANG DAE ,  OMAR AMR HAJ

    IPC: A61J7/00 ,  G16H10/60

    Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

    Scalable fabrication techniques and circuit packaging devices
    8.
    发明专利
    Scalable fabrication techniques and circuit packaging devices 未知

    公开(公告)号：AU2014368923B2

    公开(公告)日：2019-01-17

    申请号：AU2014368923

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
    9.
    发明专利
    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS 未知

    公开(公告)号：CA2934493A1

    公开(公告)日：2015-06-25

    申请号：CA2934493

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: H01L21/02 ,  H01L21/68 ,  H01L21/70 ,  H01L21/768 ,  H01L23/28 ,  H01L27/15 ,  H05K3/36

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
    10.
    发明专利
    HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS 未知

    公开(公告)号：CA2934493C

    公开(公告)日：2022-06-14

    申请号：CA2934493

    申请日：2014-12-19

    Applicant: UNIV CALIFORNIA

    Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

    IPC: H01L21/68 ,  H01L21/02 ,  H01L21/70 ,  H01L21/768 ,  H01L23/28 ,  H01L27/15 ,  H05K3/36

    Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

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